JPS6225150U - - Google Patents
Info
- Publication number
- JPS6225150U JPS6225150U JP1985117748U JP11774885U JPS6225150U JP S6225150 U JPS6225150 U JP S6225150U JP 1985117748 U JP1985117748 U JP 1985117748U JP 11774885 U JP11774885 U JP 11774885U JP S6225150 U JPS6225150 U JP S6225150U
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- workpiece
- polishing machine
- tank
- levitates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 1
Description
第１図は、本考案のウエハを非接触加工するた
めの研摩装置の一実施例を説明する図で、ａは平
面図、ｂは正面図、第２図は、従来のウエハを非
接触加工用研摩装置の一例を説明する図である。
図において、１と１′は研摩盤、２と２′は研
摩布、３は研摩液、４はタンク、６と６′はノズ
ル、７と７′はウエハ、８と８′はホルダー、１
０と１０′は支持棒、１２と１２′は横棒、１４
と１４′はおもり、１５と１５′はアーム、１６
と１６′は基板、２１はアーム板、２２は支柱を
示す。
Fig. 1 is a diagram illustrating an embodiment of the polishing apparatus for non-contact processing of wafers of the present invention, in which a is a plan view, b is a front view, and Fig. 2 is a conventional non-contact processing of wafers. FIG. 2 is a diagram illustrating an example of a polishing device. In the figure, 1 and 1' are polishing machines, 2 and 2' are polishing cloths, 3 is polishing liquid, 4 is a tank, 6 and 6' are nozzles, 7 and 7' are wafers, 8 and 8' are holders, 1
0 and 10' are support rods, 12 and 12' are horizontal bars, 14
and 14' are weights, 15 and 15' are arms, 16
and 16' indicate a substrate, 21 an arm plate, and 22 a support.
Claims (1)
せることにより、被加工物を微小量浮上させて研
摩する装置において、被加工物を保持したホルダ
ーを支柱の囲りに配置された研摩盤と洗浄槽に対
して装着できるよう支柱の軸線方向へ任意に上下
移動できかつ軸線の囲りに回転できるよう構成し
たアーム板を備えたことを特徴とする研摩装置。 In a device that levitates and polishes a workpiece by a minute amount by rotating the polishing machine at high speed while continuously supplying polishing liquid, the holder holding the workpiece is connected to the polishing machine placed around the pillar for cleaning. A polishing device characterized by comprising an arm plate configured to be able to move up and down arbitrarily in the axial direction of a support and rotate around the axis so that it can be attached to a tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985117748U JPS6225150U (en) | 1985-07-31 | 1985-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985117748U JPS6225150U (en) | 1985-07-31 | 1985-07-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6225150U true JPS6225150U (en) | 1987-02-16 |
Family
ID=31003550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985117748U Pending JPS6225150U (en) | 1985-07-31 | 1985-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6225150U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54143993A (en) * | 1978-04-28 | 1979-11-09 | Nippon Telegr & Teleph Corp <Ntt> | Noncontact surface polisher |
| JPS5932350B2 (en) * | 1980-12-17 | 1984-08-08 | 神鋼電機株式会社 | Brake control device |
-
1985
- 1985-07-31 JP JP1985117748U patent/JPS6225150U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54143993A (en) * | 1978-04-28 | 1979-11-09 | Nippon Telegr & Teleph Corp <Ntt> | Noncontact surface polisher |
| JPS5932350B2 (en) * | 1980-12-17 | 1984-08-08 | 神鋼電機株式会社 | Brake control device |
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