JPS62247309A - Method of assembling semiconductor laser module for light communication - Google Patents

Abstract

PURPOSE:To make positional deviation of optical fiber small when welding an optical fiber fixing part and a submodule by welding the circumference of the optical fiber fixing part holding the fixing part against the submodule until fixed perfectly after adjusting the position in a plane perpendicular to the optical axis of the optical fiber. CONSTITUTION:A sleeve 3 to which optical fiber 2 is fixed beforehand is passed through a hole in an optical fiber fixing part 1 and put on the upper face of a lens fixing part 5. Then, after adjusting the position in the direction of optical axis of the optical fiber 2 to a submodule 9, the optical fiber fixing part 1 and the sleeve 1 are fixed. Next, the position in a plane perpendicular to the optical axis of the optical fiber 2 is adjusted by moving the lower face of the optical fiber fixing part 1 keeping it in contact with the upper face of the lens fixing part 5. After adjusting, a part forming a sleeve holding hole 11 of the optical fiber fixing part 1 is held against the lens fixing part 5 to keep the position of the sleeve holding hole 11, and three points 1a, 1b, 1c of the weld zone on the circumference of the contact part between the optical fiber fixing part 1 and lens fixing part 5 are welded by YAG laser.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of assembling a semiconductor laser module for optical communication.

[Conventional technology]

FIG. 3 is a perspective view of a conventional optical fiber fixing component, and FIG. 4 is a sectional view of a semiconductor laser module for optical communication using the conventional optical fiber fixing component. In these figures, 2 is an optical fiber, 3 is a sleeve that wraps the optical fiber 2, 4 is a lens, 5 is a lens fixing part, 6 is a cap, 7 is a semiconductor laser, 9 is a submodule, and 4 is a lens 4.
．． Lens fixing parts 5. It is composed of a cap 6 and a semiconductor laser 7. 10 is an optical fiber fixing part, 10a, 10
b, toc are welded portions, and 11 is a sleeve holding hole for holding the sleeve 3.

Next, a conventional optical fiber fixing method will be explained.

First, the sleeve 3 with the optical fiber 2 fixed in advance is passed through the sleeve holding hole 11, and then the optical fiber fixing part 1o is placed on the upper surface of the lens fixing part 5. Next, the optical axis direction of the optical fiber 2 with respect to the submodule 9 is by moving the sleeve 3 in the optical axis direction,
After adjustment, the optical fiber fixing part 1o and the sleeve 3 are fixed. Next, the position of the optical fiber 2 in a plane perpendicular to the optical axis is
Adjustments are made by moving the lower surface of the optical fiber fixing component 1o in contact with the upper surface of the lens fixing component 5, and after adjustment welding parts 1oa, 10b on the circumference of the contact area between the optical fiber fixing component 10 and the lens fixing component 5.

Weld 3 points of 10c with YAG laser.

[Problem that the invention seeks to solve]

In the conventional optical fiber fixing method as described above, when the molten metal solidifies during welding between the optical fiber fixing component 10 and the submodule 9, the optical fiber fixing component 10 is damaged by the stress caused by the volume contraction. is pulled in the radial direction. And each welding part 10a, 10b, 10cc7)
Because it is difficult to make uniform welding conditions such as surface condition and welding position, even if the YAG laser is emitted at the same time, the timing at which the molten metal solidifies in three places will be different.
．． The optical fiber fixing component 1o is first pulled in a direction from the center of the component toward the solidified weld at the earliest timing, causing a positional shift. When the remaining welds solidify, the optical fiber fixing component 10 is similarly pulled in the direction from the center of the component toward the solidified weld. At this time,
Since the initial weld has already solidified, the amount of one position deviation is very small compared to the initial position deviation, however,
Optical fiber fixing part 1 after adjusting the position of optical fiber 2
0 and the submodule 9, the optical fiber fixing part 1o shifts in the direction from the center of the part toward the welded part that solidified at the earliest timing, so the adjusted position of the optical fiber 2 shifts. Since this positional shift greatly affects the performance of the semiconductor laser module, there is a problem that the defective rate of the finished product is extremely high.

The present invention has been made to solve these problems, and an object of the present invention is to provide a method for assembling a semiconductor laser module for optical communication that can reduce the positional deviation of optical fibers caused by welding.

[Means for solving problems]

In the method for assembling a semiconductor laser module for optical communication according to the present invention, a required number of slits corresponding to the welded portions are formed in the circumferential direction, and a sleeve having an optical fiber fixed in advance is passed through the sleeve holding hole. After placing the optical fiber fixing component on the top surface of the submodule, the process of fixing the sleeve holding hole and the sleeve by adjusting the position of the optical fiber in the optical axis direction and the position of the optical fiber in a plane perpendicular to the optical axis After adjusting the optical fiber fixing component, the optical fiber fixing component is pressed against the submodule and held until it is completely fixed, while welding the circumferential part.

[Effect]

In this invention, the optical fiber fixing part does not move due to the stress generated when the molten metal solidifies at the welding part, and this stress is absorbed by the deformation of the slit.

〔Example〕

FIG. 1 is a perspective view of an optical fiber fixing component used in an embodiment of the semiconductor laser module for optical communication of the present invention, and FIG. 2 is a sectional view similarly showing the semiconductor laser module for optical communication. In these figures, the same symbols as in FIGS. 3 and 4 indicate the same parts, 1 is the optical fiber fixing part, la, lb, and Ic are the welded parts, 8a, 8b
.

8C are slits formed on the optical fiber fixing component 1, respectively.

Next, a method of fixing the optical fiber 2 to the submodule 9 using the optical fiber fixing component 1 will be explained.

First, the sleeve 3 with the optical fiber 2 fixed in advance is passed through the hole of the optical fiber fixing part 1, and placed on the upper surface of the lens fixing part 5.Next, the position of the optical fiber 2 in the optical axis direction with respect to the submodule 9 is adjusted to the sleeve 3. After adjustment, the optical fiber fixing part 1 and the sleeve 3 are fixed by moving the optical fiber in the optical axis direction. The lens fixing part 5 is moved and adjusted while being in contact with the upper surface of the lens fixing part 5, and after adjustment, the part of the optical fiber fixing part 1 that forms the extra large sleeve retainer 11 is pressed against the lens fixing part 5 to maintain the position of the sleeve retaining hole 11, and the optical fiber Welded parts 1a, 1b, l on the circumference of the contact area between the fiber fixing part 1 and the lens fixing part 5
Weld the three points c using a YAG laser. At this time, the three welded parts 1a, Ib, and lc are pulled radially outward of the optical fiber fixing part 1 by stress in the order in which the molten metal solidifies, but the part forming the sleeve holding hole 11 is held. Because there are pickpockets 7) 8a, 8b.

Only the spring portion formed by 8c is deformed, and the sleeve holding hole 11 does not shift in position.Welded portions 1a and 1b
When the sleeve holding hole 11 is released after all of Ic has solidified, the sleeve holding hole 11 is pulled simultaneously from three directions by the restoring force of the deformed spring part, but since these forces are almost equal, the balanced position is adjusted. This makes the deviation of the optical fiber 2 from the adjusted position with respect to the sub-module 9 very small.

In addition, in the above embodiment, the slits 8a and 8b.

8C in a crescent shape ([Although formed in one place, the shape is not limited to a crescent shape, nor is the number of places formed limited to three places. It can be formed in such a way that it can be absorbed.

〔Effect of the invention〕

As explained above, this invention is a submodule in which an optical fiber fixing component is passed through a sleeve in which a required number of slits corresponding to the welded portions are formed in the circumferential direction, and an optical fiber is fixed in advance in the sleeve holding hole. After placing the optical fiber on the top surface, there is a step of fixing the sleeve holding hole and the sleeve by adjusting the position of the optical fiber in the optical axis direction, and a process of adjusting the position of the optical fiber in a plane perpendicular to the optical axis. This method includes the process of pressing the fixing part against the submodule and welding its circumferential part while holding the fixing part until it is completely fixed, thereby reducing the misalignment of the optical fiber caused by welding the optical fiber fixing part and the submodule. I can,
This has the effect of lowering the defective rate of finished products.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing an optical fiber fixing part used in an embodiment of the method for assembling a semiconductor laser module for optical communication according to the present invention, FIG. 2 is a sectional view similarly showing the semiconductor laser module for optical communication, and FIG. 4 is a perspective view showing a conventional optical fiber fixing component, and FIG. 4 is a sectional view similarly showing a semiconductor laser module for optical communication. In the figure, 1 is an optical fiber fixing part, 2 is an optical fiber, 3 is a sleeve, 4 is a lens, 5 is a lens fixing part, 6
is a cap, and 7 is a semiconductor laser. 8a, 8b, 8c are slits, 9 is a submodule, 1
1 is a sleeve holding hole. Note that the same reference numerals in each figure indicate the same or corresponding parts. Agent Masuo Oiwa (2 others) Figure 1 Figure 2 Figure 3 Figure 4 Procedural amendment (from FJ) 3. Relationship with the case of the person making the amendment Patent applicant address Marunouchi, Chiyoda-ku, Tokyo 2-2-3 Name (601) Mitsubishi Electric Corporation Representative Moriya Shiki 4, Agent 5, ? l! ]Claims column and Detailed description of the invention column 6 of the positive subject specification, ? 11 Correct contents (Amend the claims of the 11th specification as shown in the attached sheet. (3) Same (page 5, line 9, page 8, lines 13-14). ``The optical fiber fixing component'' is corrected as ``the part of the optical fiber fixing component that forms the sleeve holding hole.'' Above 2, in the assembly process of the claimed optical communication semiconductor laser module,
A required number of slits corresponding to the welding area are formed in the circumferential direction, and an optical fiber fixing component is placed on the top surface of the submodule by passing a sleeve with a fiber pre-prepared through the sleeve retaining hole. After adjusting the position of the optical fiber in the optical axis direction and fixing the sleeve holding hole and the sleeve, and adjusting the position of the optical fiber in a plane perpendicular to the optical axis, A method for assembling a semiconductor laser module for optical communication, comprising the step of pressing the part forming the sleeve holding hole against the submodule and welding the circumferential part while holding the part until it is completely fixed. .

Claims (1)

[Claims] In the assembly process of semiconductor laser modules for optical communication,
A required number of slits corresponding to the welded portions are formed in the circumferential direction, and an optical fiber fixing component is passed through a sleeve in which an optical fiber is prefixed to the sleeve holding hole. After placing the optical fiber fixing component on the top surface of the submodule, After adjusting the position of the optical fiber in the optical axis direction and fixing the sleeve holding hole and the sleeve, and adjusting the position of the optical fiber in a plane perpendicular to the optical axis, the optical fiber fixing part is fixed. A method for assembling a semiconductor laser module for optical communication, comprising the step of welding a circumferential portion of the sub-module while pressing it against the sub-module and holding it until it is completely fixed.