JPH0455056A - Soldering method - Google Patents

Abstract

PURPOSE:To obviate the leakage of solder and to allow an easy soldering operation by mounting a heat resistant elastic body to the part of a columnar material in contact with the lower part of a through-hole. CONSTITUTION:The columnar material 1 is passed into the through-hole of a plate material 2 and the heat resistant elastic body 4 like a heat resistant rubber ring is put on the circular column and is pressed to the lower part of the through-hole of the plate material 2; thereafter, the circular column 1 and the plate material 2 are soldered by solder 3. Then, the generation of a spacing between the circular column 1 and the plate material 2 is obviated and the downward leakage of the solder 3 at the time of solder joining is obviated. This method is simple and does not require manual labor and skill and, therefore, the operation can be made by any person.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a soldering method for joining a pillar material and a plate material by soldering.

[Conventional technology]

The fourth soldering method involves soldering a hollow or solid pillar material and a plate material having a through hole passing through the pillar material.
As shown in the figure, a heat-resistant tape 6 was wrapped around the pillar material 1 located below the plate material 2 to prevent the solder from dripping downward.

[Problem to be solved by the invention]

However, wrapping the heat-resistant tape requires considerable skill, and depending on the wrapping process, solder may leak and is time-consuming.

Furthermore, heat-resistant tape can be used only once, so it is costly.

[Means for solving RN] The present invention was developed as a result of intensive studies to solve this problem, and includes a hollow or solid pillar material having a circular or polygonal cross-sectional shape, and a hollow or solid pillar material that penetrates the pillar material. A soldering method in which a pillar material having a through hole and a plate material intersecting with the through hole are joined by soldering, characterized in that a heat-resistant elastic body is attached to a portion of the pillar material corresponding to the lower part of the through hole. It's a method.

The heat-resistant elastic body may be divided into a plurality of parts, and in this case, each of the divided parts is fixed to a holding jig and, when used, is pressed together with the jig around the pillar material.

[Effect]

By using a heat-resistant elastic body instead of a heat-resistant tape, there will be no gap between the pillar material and the plate material, and solder will not leak downward during solder joining.

Moreover, it is simple and does not require much manpower, and anyone can easily operate it since it does not require any skill.

〔Example〕

Next, the present invention will be explained in more detail with reference to Examples.

Example 1 As shown in Fig. 1, a column 1 is inserted into a through hole in a plate 2, a heat-resistant rubber ring 4 is placed over the column and pressed against the lower part of the through hole in the plate 2, and then solder 3 is applied to the column and the plate. was soldered. At this time, solder did not leak below the through hole.

Example 2 A jig 5 is used to hold down the heat-resistant rubber ring divided into two parts as shown in Fig. 2.
After fixing with adhesive, as shown in FIG. 3, the pillar material 1 was passed through the through hole and pressed against the lower part of the board material 2, and the pillar material and the board material were soldered with solder material 3. At this time, as in Example 1, the solder did not leak below the through hole.

〔Effect of the invention〕

As described above, according to the present invention, it is possible to easily solder the pillar material and the plate material intersecting with the pillar material, which has a significant industrial effect.

[Brief explanation of drawings]

1 to 3 are schematic diagrams showing an embodiment of the present invention, and FIG. 4 is a schematic diagram showing a conventional example. 1... Pillar material, 2... Plate material, 3... Solder, 4... Heat resistant rubber ring, 5... Holding jig, 6... Heat resistant tape.

Claims (2)

[Claims] (1) Soldering for joining a hollow or solid pillar material with a circular or polygonal cross-sectional shape and a plate material that has a through hole passing through the pillar material and intersects the pillar material and the through hole with solder. A soldering method characterized in that a heat-resistant elastic body is attached to a portion of a pillar material corresponding to the lower part of a through hole. (2) The soldering method according to claim 1, wherein the heat-resistant elastic body is divided into a plurality of rings, and each of the divided rings is fixed to a holding jig.