JPS62245695A - Manufacture of polyphenylene oxide system circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for manufacturing a polyphenylene oxide circuit board.

[Background technology]

Polyphenylene oxide circuit boards have characteristics such as good high frequency characteristics, good heat resistance, flexibility even when combined with glass cloth, etc., and low cost.

For these reasons, the use of polyphenylene oxide-based circuit boards is expected to expand, so that functions such as protection of circuits after circuit formation and secondary formation of circuits can be added without impairing the above characteristics. There is a need for a method for manufacturing polyphenylene oxide-based circuit boards.

[Purpose of the invention]

In view of the above, an object of the present invention is to provide a method for manufacturing a polyphenylene oxide circuit board that can protect a circuit after circuit formation and add functions such as secondary formation of a circuit.

[Disclosure of the invention]

The gist of the present invention is a method for manufacturing a polyphenylene oxide circuit board, in which a polyphenylene oxide core material having a desired conductor on the surface is prepared, and a resin composition is adhered to the surface of the polyphenylene oxide core material.

The present invention will be explained in detail below.

The above-mentioned polyphenylene oxide core material is a film made of the following polyphenylene oxide resin composition, or a prepreg impregnated with the following polyphenylene oxide resin composition, each consisting of one or more sheets, individually or in combination of both. , or one sheet each.

The polyphenylene oxide resin composition includes polyphenylene oxide, a crosslinkable polymer and/or
Alternatively, a material containing a crosslinking monomer may be used, but is not limited to these.

Here, polyphenylene oxide (also referred to as polyphenylene ether, hereinafter referred to as rPPOJ) is represented by the following general formula, for example, poly(2.
6-dimethyl-1,4-phenylene oxide).

Such PPOs are, for example, USP 4059
It can be synthesized by the method disclosed in No. 568. For example, 2,6-xylenol is subjected to an oxidative coupling reaction with an oxygen-containing gas and methanol in the presence of a catalyst to produce poly(2,6-dimethyl-1,4
-phenylene oxide), but is not limited to this method. Here, as a catalyst, a copper (1) compound, N-N'-di-tert-butylethylenediamine,
Contains butyldimethylamine and hydrogen bromide. Based on methanol, 2 to 15% by weight of water is added to the reaction mixture system, and the total amount of methanol and water is 5 to 25% by weight.
% by weight of the polymerization solvent. Although not particularly limited, for example, the weight average molecule it (Mw
) is 50,000, molecular weight distribution MW/Mn-4,2(M
Polymers in which n is the number average molecular weight are preferably used.

Examples of crosslinkable polymers include, but are not limited to, 1.2-polybutadiene, 1.4
-Polybutadiene, modified 1,2-polybutadiene (maleic modification, acrylic modification.

Examples include epoxy-modified polymers, styrene-based thermoplastic polymers, and rubbers, each of which may be used alone or in combination of two or more. The polymer state may be an elastomer or a rubber, but a high molecular weight rubber state is particularly preferred since it improves film forming properties. Examples of the styrenic thermoplastic polymer include, but are not limited to, styrene-butadiene block copolymer, styrene-isoprene block copolymer, and the like. Examples of the block state include AB, ABA, ABAB (for example, A is polystyrene, B is polybutadiene or polyisoprene, etc.) When a PPO resin composition is made into a sheet by the casting method described below, the film formation From the viewpoint of improving properties, it is preferable to use polystyrene within a range that does not interfere with achieving the object of the present invention. Note that polystyrene with a high molecular weight is desirable because it improves film-forming properties.

Examples of crosslinking monomers include ■ester (meth)
Acrylates, epoxy (meth)acrylates, urethane (meth)acrylates.

(Meth)acrylic acids such as ether (meth)acrylates, melamine (meth)acrylates, alkyd (meth)acrylates, and silicone (meth)acrylates; Triallyl cyanurate (hereinafter referred to as TAC)
, triallyl isocyanurate (hereinafter referred to as TAIC), ethylene glycol dimethacrylate, divinylbenzene.

Polyfunctional monomers such as diallyl phthalate, ■vinyltoluene, ethylvinylbenzene, and styrene.

Examples include monofunctional monomers such as paramethylstyrene, and (2) polyfunctional epoxies, which may be used individually or in combination of two or more, but are not particularly limited to these.

As the crosslinking monomer, TAC and/or TAI
It is preferable to use C because it has good compatibility with PPO and is preferable in terms of film formability, crosslinkability, heat resistance, and dielectric properties.

TAC and TAIC are chemically structurally isomers and have similar film-forming properties, compatibility, solubility, reactivity, etc., so either one or both can be used in the same way. be able to.

The crosslinkable polymer and/or crosslinkable monomer are used to improve heat resistance and the like without impairing the properties of PPO by crosslinking (curing) it. These may be used alone or in combination, but their combined use is more effective in improving characteristics.

In addition, although an initiator is usually used in PPO resin compositions, it is not necessary to use an initiator. As an initiator, dicumyl peroxide, tert-butylcumyl peroxide, di-tert-butyl peroxide, 2.5
-dimethyl-2,5-di(tert-butylperoxy)hexyne-3,2,5-dimethyl-2,5-di(
tert-butylperoxy)hexane, α・α′-bis(tert-butylperoxy-m-isopropyl)
Benzene [1,4 (or 1,3)-bis(tert-
dialkyl peroxides such as butylperoxyisopropyl (also called benzene), hydroperoxides such as t-butyl hydroperoxide, cumene hydroperoxide, etc., as well as benzoin, hensyl, allyl diazonium fluoroacetic acid, etc. salt, benzyl methyl ketal, 2,2-ethoxyacetophenone, benzoyl isobutyl ether, p-tert-butyltrichloroacetophenone, benzyl (0-ethoxycarbonyl)-α-monoxime, biacetyl, acetophenone, benzophenone, tetramethylthiuram sulfide,
Azobisisobutyronitrile, benzoyl peroxide, ■-Hydroxycyclohexylphenyl edone, 2
-Hydroxy-2-methyl-1-phenyl-propane-
1-one, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 2-chlorothioxanthone, methylbenzoyl formate, 4.
4-bisdimethylaminohensiphenone (Michler's ketone), benzoin methyl ether, methyl-〇-benzoyl benzoate, α-aziroxime ester, etc.
Examples include Nippon Oil's Vistamil, which is expressed by the following formula, and may be used alone or in combination of two or more, but is not limited thereto.

The blending ratio of the above raw materials is not particularly limited, but PP
O resin composition contains P out of 100 parts by weight in total of PP01 and crosslinkable polymer and/or crosslinkable monomer.
7 to 95 parts by weight of PO (more preferably 50 to 95 parts by weight), 5 to 95 parts by weight of crosslinkable polymer and/or crosslinkable monomer
It is preferable to contain each in a proportion of 93 parts by weight (more preferably 5 to 50 parts by weight). When an initiator is used, the PPO resin composition should contain 0.1 to 5.0 parts by weight of the initiator based on 100 parts by weight of the total of PP01 and the crosslinkable polymer and/or crosslinkable monomer. is preferred. Note that, although not particularly limited, 20 parts by weight of the crosslinkable polymer per 1 part by weight of the crosslinkable monomer.
Preferably, the proportion is less than parts by weight.

However, when PPO is used in combination with polystyrene and/or styrene-butadiene copolymer, it is preferable to use the following blending weight ratio.

PPO, styrenic thermoplastic polymer, and TAC and/or TAI are used as raw materials for the PPO resin composition.
If you select C, the blending ratio of these three components should be PPO 7% or more and less than 93% by weight, styrenic thermoplastic polymer 7% or more and less than 93% by weight, based on the total of these three components.
Also, it is preferable that the weight of TAC and/or TAIC is 70% or less.

The raw materials having the above composition are usually dissolved in a solvent and mixed (solution mixing). When dissolved in a solvent, PPO
The resin solid content of the resin composition is 10 to 30% of the solvent.
% range is preferred. After mixing, a PPO resin composition is obtained by removing the solvent. Examples of the solvent include halogenated hydrocarbons such as trichloroethylene, trichloroethane, chloroform, methylene chloride, and chlorobenzene, aromatic hydrocarbons such as benzene, toluene, and xylene, acetone, and carbon tetrachloride. Preferably, these can be used alone or in combination of two or more, but the invention is not limited thereto. Note that the mixing may be performed by other methods.

The PPO resin composition used in the present invention can be prepared by, for example, dissolving and mixing raw materials in a solvent as described above, forming a thin layer by casting or coating on an appropriate object, and then drying it to remove the solvent. By removing it (casting method), it can be made into a solidified product. According to this casting method, there is no need to melt the resin, and a film of the PPO resin composition can be produced at low temperatures without using the costly calendar method. Usually, in such a casting method, the solidified product becomes a film (sheet), but the solidified product is not limited to a film. Note that the solidified product also includes a cured product.

The film made of the PPO resin composition used in the present invention can be produced, for example, by the above-mentioned casting method, but methods other than this method may also be used.

To explain the above casting method in detail, please refer to the above P.
A mixed solution of the PO resin composition or its raw materials dissolved in the above solvent is placed on a mirror-treated iron plate or a carrier film for casting, for example, for 5 to 50 minutes.
The film is obtained by casting (or coating) to a thickness of 700 (preferably 5 to 500) μm and thoroughly drying to remove the solvent. Note that the term "film" here includes what is called a sheet membrane, tape, etc., and there are no particular limitations on the extent of the surface orthogonal to the thickness direction or the length, and the thickness can be set in various ways depending on the application. Is possible. The carrier film for casting is not particularly limited, but may be polyethylene terephthalate (hereinafter referred to as rPE).
(abbreviated as TJ) film, polyethylene film, polypropylene film, polyester film, polyimide film, etc. are preferably insoluble in the above solvents, and
Those that have been subjected to mold release treatment are preferable.

Cast onto a carrier film for casting (or
The solvent is removed from the applied PPO resin composition solution by air drying and/or drying with hot air. The upper limit of the set temperature during drying is preferably lower than the boiling point of the solvent or lower than the heat resistance temperature of the carrier film for casting (when drying is performed on a carrier film for casting), and the lower limit is lower than the boiling point of the solvent or lower than the heat resistance temperature of the carrier film for casting. For example, when trichlorethylene is used as a solvent and PET film is used as a carrier film for casting, the temperature is determined by the time and processability.
A range of up to 0'C is preferable, and if the temperature is increased within this range, the drying time can be shortened.

The solidified product (for example, a film) of the PPO resin composition produced in this way can be further improved in tensile strength by thermal crosslinking using a radical initiator, photocrosslinking, crosslinking using radiation, etc. It can improve strength, impact strength, bursting strength, heat resistance, etc.

Films made of the above-mentioned PPO resin compositions are used for various purposes such as laminates, circuit protection films, and adhesive films.

The prepreg mentioned above may be produced by any method, but generally it can be produced by the following method.

That is, the PPO resin composition or its raw material is completely dissolved in the above-mentioned solvent, for example, at a ratio of 5 to 50% by weight, and the base material is immersed in this solution (dipping). A PPO resin composition is impregnated and attached. In this case, the solvent may be simply removed by drying or the like, or the material may be semi-cured to a so-called B stage. The resin content of the prepreg made in this way is
Although not particularly limited, it is preferably 30 to 50% by weight. Base materials include glass cloth, aramid cloth, polyester cloth, nylon cloth, etc. that can be impregnated with resin or loss-like materials, cloak-like materials made of these materials and/or fibrous materials such as non-woven fabrics, paper such as kraft paper, linter paper, etc. are used, but are not limited to these. If the prepreg is produced in this way, there is no need to melt the resin, so it can be done more easily at a relatively low temperature.For example, a PPO core material using a film and/or prepreg of the above-mentioned PPO resin composition. , is produced as follows, but is not limited thereto. If the film of the PPO resin composition is a cast film produced as described above, it should be thoroughly dried at a temperature lower than the decomposition temperature of the initiator blended and higher than the boiling point of the solvent used to eliminate any residual Eliminate solvents. The films produced in this way and/or the prepregs produced in the above manner are combined in a predetermined number so as to have a predetermined design thickness, and if necessary, metal foil is also combined and laminated, followed by heat pressing, etc. A laminate is obtained by melting the resin and adhering films to each other, films to prepreg, prepregs to each other, films and metal foil, and prepreg and metal foil to each other. Strong adhesion can be obtained by this fusion alone, but even stronger adhesion can be obtained if a crosslinking reaction using a radical initiator is performed by heating at this time. The crosslinking reaction may be carried out by ultraviolet irradiation or the like. When thermal crosslinking and photocrosslinking are not performed, crosslinking by radiation irradiation may be performed. Also thermal crosslinking.

Crosslinking by radiation irradiation may be performed after photocrosslinking. Therefore, between films, between prepregs,
It is possible to realize adhesion with excellent heat resistance between a film and prepreg, a film and metal foil, and a prepreg and metal foil.

Here, regarding the combination of a film and a prepreg when used together, although not particularly limited, a vertically symmetrical combination is preferable from the viewpoint of preventing warpage after molding and secondary processing (etching, etc.). Further, from the viewpoint of adhesive strength, it is preferable to combine the film so that it is on the adhesive interface with the metal foil.

Since the heat fusion properties of the film can be used to bond the metal foil and the film, the lamination and pressing temperature is preferably higher than the glass transition point of the film, and is preferably in the range of about 160 to 300°C. In a solidified product of a PP◯ resin composition, the resin flows slightly before curing, so it exhibits good fusion properties to metals. However, an adhesive may be used in combination.

As the metal foil, copper foil, aluminum foil, etc. are used.

Pressing is performed to bond films to each other, films to prepregs, prepregs to each other, metal foils to films, metal foils to prepregs, and to adjust the thickness of the laminate, so the pressing conditions are selected as necessary. Furthermore, when crosslinking is carried out by heating, the crosslinking reaction depends on the reaction temperature of the initiator used, so it is preferable to select the heating temperature depending on the type of initiator. The heating time may also be selected depending on the type of initiator, etc. For example, at a temperature of 150 to 300°C for 3 hours and 10 to 90 minutes (
More preferably, it is about 10 to 60 minutes). The clamping pressure is preferably about 10 to 150 kglcta. A predetermined number of films and/or prepregs may be heat-laminated in advance, metal foil may be superimposed on one or both sides of the film, and then heat-pressed again.

The PPO core material produced as described above has characteristics such as good high frequency properties, good heat resistance, flexibility even when combined with glass cloth, etc., and low cost.

The conductor may be provided by pasting a metal foil as described above, but may also be provided by other methods such as vapor deposition. When using a method such as vapor deposition, it is also possible to leave a pattern of desired circuits, electrodes, etc. as a mask in advance, and then form desired conductors such as circuits, electrodes, etc. Further, desired conductors such as circuits and electrodes may be formed by a subtractive method, an additive method (full additive method, semi-additive method), etc.

The purpose of attaching the above resin composition to the surface of the PPo core material is not particularly limited, but examples include rust prevention of zero circuits, prevention of surface oxidation during soldering (solder resist), etc. ■ Silver paste , Forming a circuit using copper paste, etc., ■ Forming a resistance circuit using carbon paste, etc.

Therefore, a common problem in these processes is the adhesion of the PPO core material.

Here, phenol resin, epoxy resin, imide resin, polyester resin, acrylic resin, PPO resin, etc. are preferable as the resin with good adhesion to the PPO core material core material. Among them, as the resin with particularly good adhesion, phenol Resin and PPO resin are preferred.

Furthermore, if the circuit is used for high frequency applications, it is preferable to use PPO resin.

In addition to the above resins, epoxy acrylate, melamine acrylate, polyester acrylate, polybutadiene acrylate, polyurethane acrylate, silicone acrylate, etc. are also suitable.

The above-mentioned resin composition is applied to the PPO core material by printing and/or coating, pasting in the form of a film, or the like. The deposited resin composition may be dried and solidified as it is, or it may be cured and fixed.

Examples of the resin composition include, but are not limited to, conductive pastes and resist agents such as solder resists. Conductive pastes include, for example, conductive pastes such as silver, copper, graphite, carbon black, and nickel, binders, and solvents, as well as additives, hardeners, etc. as necessary. There are commercially available pastes, copper pastes, carbon pastes, etc.

When the PPO circuit board obtained by the manufacturing method according to the present invention is to be made flexible, the thickness of the PPO circuit board is preferably about 50 to 300 μm, but the thickness is not limited thereto.

The method for manufacturing a PPO circuit board according to the present invention involves attaching a resin composition to the surface of the PPO core material, thereby protecting the surface of the conductor without impairing the properties of the PPO core material.
Functions can be added to the conductor. Obtained PPO
The system circuit board has good adhesion with the PPO-based core material core resin composition, and also has the above-mentioned characteristics.

Examples will be described below.

(Example 1) In a reactor equipped with a defoaming device No. 21, 110 g of PPO, 80 g of styrene-butadiene brosoxcobolimer (SBS), and Log of TAIC were put, and in addition, trichlene (trichloroethylene manufactured by Toagosei Chemical Co., Ltd.) was added. 800 g was added, and the mixture was thoroughly stirred and mixed until a homogeneous solution was obtained. Thereafter, defoaming was performed, and the resulting solution of the PPO resin composition was applied onto a PET film to a thickness of 500 μm using a coating machine. After drying in the air and then at 50°C, the resulting film was released from the PET film and further dried at 120°C for 30 minutes. The thickness of the film-like PPO resin composition after drying was about 100 μm.

Copper foil was placed on one side of this film and pressed, and cured in a dryer at 260° C. for 30 minutes to obtain a PPO core material covered with copper foil on one side.

After degreasing the single-sided copper foil-covered PPO core material foil surface and the PPO resin surface using chlorocene (manufactured by Asahi Kasei Kogyo ■, 1° 1.1-) dichloroethane), phenol novolac resin, +81 formula Epoxy resin, melamine resin of the formula (b), and polyester resin of the formula (C1) were each separately prepared using a 20111X2 screen of 200 mesh.
A PPO-based circuit board as shown in FIG. 1 was obtained by printing on a 01 m square and curing it according to the respective curing conditions. In the figure, 1 is a PPO-based core material.
2 is a conductor (in this example, copper foil), and 3 is a resin composition (in this example, the above-mentioned resin). After that, 1 every 11 ■
0x10 squares were made and a peel test was conducted using adhesive tape. The same test was conducted on the copper foil surface and the PPO resin surface, and no problems were found in all of them. That is, no peeling occurred.

(bl (Example 2) PP0120g, styrene-butadiene copolymer 40g,
TAIC40g and 2,5-dimethyl-2,5-
Di(t-butylperoxy)hexyne-3 (NOF-
1 g of Verhexin 25B) was dissolved in 1 kg of trichloroethylene (manufactured by Toagosei Kagaku Kogyo ■). A glass cloth with a thickness of 100 μm was impregnated with this solution to obtain a resin-impregnated base material in a conventional manner. This resin-impregnated base material Copper foil is layered on one side of the material and sandwiched between mold release treated mirror plates.
A PPO core material made of a resin-impregnated cured substrate with a thickness of 125 μm and a copper foil formed on one side by heating and pressing at 260° C. with a press was prepared.

After degreasing the single-sided copper foil-covered PPO core material core material foil surface and the PPO resin surface using chlorocene (manufactured by Asahi Kasei Kogyo 01, 1°1.1-)lichloroethane), phenol novolac resin, (a) The epoxy resin of the formula (b), the melamine resin of the formula (b), and the polyester resin of the +81 formula were each separated into 2Q mm x 2 pieces using a 200 mesh screen.
A PPO-based circuit board as shown in FIG. 1 was obtained by printing Qi+m+ squares and curing them according to the respective curing conditions. In the figure, 1 is an example of a PPO core core material,
2 is a conductor (in this example, copper foil), and 3 is a resin composition (in this example, the above-mentioned resin). Thereafter, loXIO squares were made for each dragon, and a peel test was performed using adhesive tape. The same test was conducted on the copper foil surface and the PPO resin surface, and no problems were found in all of them. That is, no peeling occurred.

(Example 3) 110 g of PPO, 80 g of styrene-butadiene brosoxycopolymer (SBS), and Log of TAIC were placed in a reactor equipped with a defoaming device in No. 21, and in addition, trichlene (trichlorethylene manufactured by Toagosei Chemical Industry ■) was added. 800 g was added, and the mixture was thoroughly stirred and mixed until a homogeneous solution was obtained. Thereafter, defoaming was performed, and the resulting solution of the PPO resin composition was applied onto a PET film to a thickness of 200 μm using a coating machine. After air drying as it was and then drying at 50°C, the resulting film was released from the PET film and further dried at 120°C for 30 minutes. The thickness of the film-like PPO resin composition after drying was about 40 μm.

Next, the solution of the PPO resin composition was applied to a 100 μm thick glass cloth (2162/1050 manufactured by Asahi Schubel Co., Ltd.).
/AS103). This impregnated cloth was dried under the same conditions as the above-mentioned PPO resin composition film to produce a prepreg. Using the thus produced PPO resin composition film and prepreg, 18 μm thick copper foil - 40 μm thick PPO resin Film of composition - prepreg - 40 μm thick film of PPO resin composition - 18
Laminated in the order of μm thick copper foil, 250”c, 100k
This was pressed for about 30 minutes under the conditions of g/ctl to obtain a laminate A having a thickness of about 200 μm and having both sides covered with copper foil.

On the other hand, 18 μm thick copper foil, 5 40 μm thick PPO resin composition films, and 18 μm thick copper foil were laminated in this order to obtain a laminate B with copper foil on both sides under the same conditions as before.

Next, a circuit pattern was printed on one side of the laminates A and B, and a circuit was formed by etching. After washing this circuit surface with chlorocene (1.1.1-)lichloroethane manufactured by Asahi Kasei Kogyo ■ and drying it thoroughly, the above 40 μm thick film of the PPO resin composition was placed on it.
50”C1l.

It was pressed for about 30 minutes at a pressure of Okg/ca to obtain a film-overcoated PPO type treadle plate as shown in Fig. 2. In the figure, 1 is a PPO core material (in this example,
Those using laminate A are those in which a PPO resin composition film and prepreg are laminated and cured, those using laminate B are in which a PPO resin composition film is laminated and cured), 2 is a conductor (in this example, copper foil), 3
6 is a resin composition (in this example, a cured film of the above-mentioned PPO resin composition), and 6 is a circuit pattern.

An adhesion test was conducted on these overcoated surfaces in the same manner as in Example 1, and as a result, no peeling occurred.

(Example 4) An electrode pattern 4 as shown in FIG. 5 was etched on the double-sided copper foil-covered laminate A produced in Example 3, and chlorocene (Asahi Kasei Corporation 1) was etched. 1-) After cleaning with (resistance base) TU-IK-5 manufactured by Asahi Chemical Research Institute Co., Ltd., and drying at 190°C for about 20 minutes, a PPO system with a resistor formed was obtained. I got the circuit board.

When we tested the adhesion of the resistor, we found that it did not peel off at all in the adhesive tape test.

Next, instead of the above resistance paste, we printed LLS-504J made by Asahi Chemical Research Institute Co., Ltd.
It was dried at 50° C. for 30 minutes to obtain a PPO circuit board on which silver circuits 5 were formed as shown in FIGS. 3 and 6. When the adhesion of this silver circuit was tested, it did not peel off at all in the adhesive tape test.

In addition to the above, the PPO circuit board obtained by the manufacturing method according to the present invention includes, for example, one in which a desired conductor 7 such as a circuit is solder resisted with the resin composition 3, as shown in FIG. The conductor 7 is, as in this embodiment,
It may also be formed by a semi-additive method.

Note that the manufacturing method according to the present invention is not limited to the above embodiments. The resulting PPO circuit board is not limited to those shown above.

〔Effect of the invention〕

As described above, the method for producing a polyphenylene oxide circuit board according to the present invention involves preparing a polyphenylene oxide core material having a desired conductor on its surface, and attaching a resin composition to the surface of the polyphenylene oxide core material. Without impairing the properties of the polyphenylene oxide core material, it is possible to protect the circuit after it has been formed, add functions such as secondary formation of the circuit, etc. Further, the adhesion between the polyphenylene oxide core material and the resin composition attached to its surface is good.

[Brief explanation of drawings]

Figures 1 to 4 show PPO obtained by the manufacturing method of this invention.
A cross-sectional view of the system circuit board, Figure 5 shows the PPO with the desired conductors.
Figure 6 is a plan view of a PPo type circuit board obtained by the manufacturing method of the present invention. 1... PPO-based core material Core material... Conductor 3... Resin composition 4... Electrode pattern (desired conductor) 5...
Root circuit. (Resin composition) 6...Circuit pattern (desired conductor) L...PPO circuit board agent Patent attorney Takehiko Matsumoto Figure 5 Figure 6 Procedural amendment (viewed July 12, 1986) Day 2, Name of invention Process for manufacturing polyphenylene oxide circuit board 3, Relationship with the amended case Patent applicant address 1048 Oaza Kadoma, Kadoma City, Osaka Name (583) Representative of Matsushita Electric Works Co., Ltd. ((Jm Sadao Fujii 4, No agent 6, Specification subject to amendment 7, Contents of the amendment■ On page 15, line 14 of the specification, the word "rupture" is corrected to "tear."

Claims (6)

[Claims] (1) A method for producing a polyphenylene oxide circuit board, in which a polyphenylene oxide core material having a desired conductor on the surface is prepared, and a resin composition is adhered to the surface of the polyphenylene oxide core material. (2) The method for producing a polyphenylene oxide circuit board according to claim 1, wherein the resin composition is applied by printing and/or coating. (3) The method for producing a polyphenylene oxide circuit board according to claim 1 or 2, wherein the resin composition is applied to protect the surface of the conductor. (4) The method for manufacturing a polyphenylene oxide circuit board according to claim 1 or 2, wherein the resin composition is applied to impart a function to the conductor. (5) A polyphenylene oxide core material obtained by curing a film of a polyphenylene oxide resin composition,
and/or the method for producing a polyphenylene oxide circuit board according to any one of claims 1 to 4, wherein a polyphenylene oxide resin composition is impregnated into a base material and cured. (6) The polyphenylene oxide resin composition comprises polyphenylene oxide, a crosslinkable polymer and/or
Alternatively, the method for producing a polyphenylene oxide circuit board according to claim 5, which contains a crosslinkable monomer.