JPS62244154A - Heatsink clip assembly - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application This invention relates to an apparatus for fixing a heat sink to an electronic device package. More particularly, this invention relates to a clip fastening device for attaching heat dissipation devices to dual fog in-line packages and the like.

(b) Background Art In the past, various means have been used to add heat sinks to electronic device packages in close thermal contact. For purposes of this disclosure, a heat sink is used to transport heat from a semiconductor device contained within an electronic device package and rapidly dissipate this heat to the atmosphere by convection and/or radiation. Any object made of metal or similar material placed in contact with the package. For example, it is well known to glue or otherwise adhere heat sinks to electronic device packages. However, assembling heat sinks to electronic device packages is unclean, tedious, labor intensive, requires precise alignment of components, is expensive, and the adhesives typically used are or may cause undesirable health problems. The need to cure adhesives for long periods of time at high temperatures is often required, further increasing manufacturing costs. Also, it is sometimes necessary to remove heat sinks from electronic device packages for repair or replacement.

This becomes extremely difficult, if not impossible, when the heat sink is an adhesive foam seal to the electronic device package.

The heat sink may also be mechanically attached to the electronic device package, such as by a resilient metal clip that is attached to the heat sink and brings the heat sink and the electronic device package into mutual contact. This clip allows the heat sink to be easily removed from the electronic device package. However, such an approach is undesirable in various respects. For example, the clip relies solely on frictional engagement between the clip and the electronic device package to secure the heat sink to the electronic device package. Vibration, gravity, or other mechanical forces tend to loosen the heat sink from the electronic device package. Furthermore, because the heat sink does not actively lock into position on the electronic device package, it is possible for the clip to accidentally contact the leads extending from the electronic device package, thereby causing an electrical short between the leads. There is a tendency to Typically, such a lip is constructed to extend substantially the entire length of the electronic device package.

Therefore, the force pressing against the heat sink and electronic device package is applied at the ends of the electronic device package rather than at the midpoint where heat is generated.

This makes the heat sink very inefficient at dissipating heat from the electronic device package.

SUMMARY OF THE INVENTION This invention provides a heat sink for dissipating heat generated by an electronic device package.
A heat sink clip e-assembly is provided for use in attaching to a package. The heat sink-clip assembly includes a mounting clip preferably constructed of a non-conductive material and located on the underside of an electronic device package. This mounting clip
! Latch means are provided for mechanically coupling to the heat sink which is placed upright in contact with the underside of the child device package.

Among the primary features and advantages of the invention, it securely locks a heat sink into intimate thermal contact with a dual in-line package (DIP) without creating a short circuit between the leads extending from the electronic device package. Included is providing an improved heatsink clip assembly.

Additionally, the heat sink clip e-assembly of the present invention can be removed from a heat sink and quickly and easily secured to a heat sink and electronic device package.

B) EXAMPLES The present invention will be described in detail below based on examples and with reference to the accompanying drawings.

FIG. 1 shows a heat sink clip assembly constructed in accordance with the present invention, which heat sink clip assembly is attached to the underside 12 of an electronic device package 14 containing a semiconductor device (not shown). A mounting clip 10t suitable for adjacent placement is provided. In this embodiment, electronic device package 14 is a D-P package having an integrated circuit (not shown) within a rectangular housing 16. A plurality of leads extend downwardly along both longitudinal edges of the electronic device package 140 in two parallel rows for connection to the integrated circuit board (not shown) or other external circuitry. For use. Upper side 22 of the housing of the integrated circuit
Pads 20t are formed in thermal contact with the integrated circuit within the glove device package 14 for extraction of heat generated by the integrated circuit during use.

Heat sink 24 is adapted to be placed adjacent the top side of electronic device package 14 . Second
A heat sink 24, shown in more detail in FIGS.
An extended base portion 30t is provided on this heat sink suitable for obtaining extended contact. Some electronic device Φ packages 14 lack pads, in which case the bottom of the heat sink is adjacent to the semiconductor device. Place directly on the top side of electronic device package 14.

A pair of laterally spaced parallel front side walls 32t extend vertically from mutually opposing edges of the base portion 30 of the heat sink 240. Each sidewall has upwardly extending fingers 34 suitable for rapidly dissipating heat from the base portion of the heat sink. Of course, other valid heat sink shapes may be used with the electronic device package 14 that may be used with the present invention. When the base portion 30 of the heat sink 240 is placed in good thermal contact with the pads of the electronic device package 14, heat generated from the integrated circuit during use is transferred to the atmosphere for rapid convection and/or radiation. The pad, heat sink 240, base portion 30, and II wall are guided through the wall. Heat sink 24 may be anodized or otherwise surface treated to protect it from corrosion and to enhance its heat dissipation properties.

Details of the attachment clip 10 are shown in FIGS. 5-7. The attachment clip 10 has a generally rectangular body 50 and is preferably made of a high strength, flexible and resilient material. The attachment clip 10 is also preferably made of a non-conductive material to eliminate the drawbacks discussed above with conventional metal clips. Such materials must be able to withstand the high temperatures (120 DEG -125 DEG C.) typically experienced in electronic environments for extended periods of time. A wide variety of polymers are suitable for use in making the attachment clip 10, such as nylon, polyphenylene (pps), and polysulfone.

Alternatively, the mounting clip 10 may be made of a resilient metallic material and coated with a non-conductive material as described above.
0 from the leads of electronic device package 14.

The mounting clip 100 body 50 extends along a longitudinal axis 52 and is narrower than the housing of the integrated circuit;
The mounting clip 10 is connected to the underside 12 of the housing 16 between parallel rows of reed receptacles 18 extending downwardly from the housing 16.
can be placed in contact with. Mounting clip 100
The width of body 50 is preferably sufficiently close to the distance between parallel rows of leads 18 to align mounting clip 10 laterally with respect to the integrated circuit housing.

Latching means are provided for latching the heat sink 24 to the mounting clip 10 to place the heat sink 24 in intimate thermal contact with the electronic device package 14. In the embodiment shown in FIGS. 1-8, this latching means includes a pair of longitudinally spaced barbs (reversing the tip of the fishhook) projecting from and preferably integral with the body 50 of the attachment clip 10. barb
) shaped member 54? We are prepared. This hook-shaped member 54! −
j. Attach the mounting clip 10 to the electronic device package 1.
When the mounting clip 10 is positioned below the electronic device package 14 in longitudinal alignment with respect to It is better to let Each barb 54 is symmetrically arranged about a longitudinal axis 520 of the body 50 of the mounting clip and a distance 5
A pair of hook-like pieces 56'It are provided separated by B. Each barb 56 terminates in a barb 60. Each barb-shaped portion 60 is provided with a distance 5 that exposes the barb-shaped piece 56 as much as possible.
A laterally facing inclined surface 62 having a width no wider than half of 8 is provided. It will be appreciated that these barbs 60 may be constructed with any other useful shape or contour.

The latching means further includes mounting flanges 36tl- extending longitudinally in opposite directions from the base portion 30 of the heat sink 240 between the side walls thereof. Each installation has flange 36
has longitudinally aligned holes 38 (or miso holes) therein. In this preferred embodiment, the oppositely oriented mounting causes the flanges 36 to each slope upwardly at an acute angle with respect to the base portion 30 of the heat sink.

As shown in FIG. 1, when the heat sink 24 and mounting clip 10 are mounted on opposite sides of the electronic device package 140 with their longitudinal axes parallel to each other, the barbs 54 at each end of the mounting clip 10 , the attachment of heat sink 24 is vertically aligned with one of the holes 38 in flange 36 .

Additionally, the attachment clip 10 essentially serves to align the heaton/reel 240 base portion 30 with the pad 20 of the electronic device package 14.

In this position, the mounting flange 36 simultaneously flexes downwardly so as to be substantially parallel to the top surface of the electronic device package 14. The attachment forms tab-like pieces 42 on the ends of the flanges 36 to assist in manually applying force to these attachment flanges as they flex. For installation, the deflection of the flange 36 is determined by the mounting clip 10.
Each barb 54t-addition engages an aligned hole 38 in one of the flanges 36. Hook-like member 54
When inserted into the hole 38, the mutually opposing inclined surfaces 62 of the barbed portion 60 are pushed inwardly toward each other. Once the barb 60 has passed the hole 38t, the barb 56 resiliently springs back to the released position as shown in FIG. 81, thereby securing the heat sink 24 to the mounting clip 10. Heat sink 24t - Attachment of heat sink 24 is accomplished by manually deflecting barbs 56 inwardly from electronic device package 14 and moving barbs 54 downwardly out of engagement with holes 38 in flange 36. It is possible to separate it by lowering it so that it meets the latching means.

An alternative barb member 54' is shown at No. 8 AI''9. This barb member 54' is also provided with a barb piece 56 having a second pair of barb portions 60 each formed with an inclined surface 62.

The second set of hook-like portions are attached to the additional clip 10,
Enables the accommodation of electronic device packages with varying thicknesses. For example, it is known that electronic device packages made of plastic are generally thicker (as shown at 14' in port 8A) than ceramic packages for a given semiconductor device. be.

The additional flanges 36, when they are in the deflected position, exert an elastic force on the base portion 30 of the heat sink 24 for thermal contact with the pad 20 for alignment of the electronic device package. Make contact. The force with which the heat sink 24 is brought into contact with the electronic device package 14 is determined by the choice of attachment, size, slope angle, and shape of the flange 36. One of the primary advantages of the present invention is that when the electronic device package 14 is so equipped, the force that secures the heat sink 24 to the electronic device package 14 is absorbed by the heat sink 240 base portion 30 and It is applied directly to the hot pad 20 of the electronic device package. This maximizes heat transfer between electronic device package 14 and heat sink 24. Although not described, a layer of thermally conductive material, such as grease or a polymer sheet, may be interposed between the base portion 30 of the heat sink 240 and the electronic device package 14.
Heat transfer can be enhanced. Another advantage of the present invention is that the mounting clip 10 secures the heat sink 24 to the electronic device package 14 in a desired location and provides positive alignment of the heat sink 24, which allows the mounting clip 10 to secure the heat sink 24 to the electronic device package 14 in a desired location. electronic devices and
This is in stark contrast to conventional clips, which rely solely on frictional contact with the package.

FIG. 9 shows another embodiment of the invention. In this case, the body 50' of the attachment clip is formed convexly or arcuately with respect to the longitudinal axis of the attachment clip. In this embodiment, the heat sink mounting flange is formed in a horizontal plane with the base portion and parallel to the top side of the electronic device package when adjacent the electronic device package. When the mounting clip is added to the heat sink, the body of the mounting clip flexes to become parallel to the underside of the electronic device package.

In this position, the mounting clip exerts an elastic force on the heatsink to secure the base of the heatsink to the electronic device.
Make good thermal contact with the package. In that regard, the attachment clip for this embodiment is as described above.

FIG. 10 shows another embodiment of the invention in which the heat sink-clip assembly is attached to the mounting clip 10 of FIG.
It has a mounting clip 110 that is substantially similar to the one shown in FIG. This mounting clip 110 is attached to a semiconductor device (not shown).
- Suitable for placement adjacent to the underside of the containing electronic device package 114; In this embodiment, the electronic device package 114 is a D-P package having an integrated circuit within a rectangular box 116. Multiple glue-r line 118t-1 electronic device package 1140
Extending downward in two parallel rows along both longitudinal edges. Pads 12 are formed on the top surface 122 of the electronic device package 114 to make thermal contact with the integrated circuit within the electronic device package to extract heat generated by the integrated circuit during use.

The heat sink 124 is connected to the electronic device package 11
4. Suitable to be placed adjacent to the upper side of 4.

The heat sink 124 includes a base portion 130 with standoffs 132 formed on the underside of the heat sink 124 to provide approximately coextensive contact with the Para-F 120 when placed on the electronic device package 114.
t-to have. A plurality of upwardly extending horizontal fins 13
4 protrudes from the upper side of the heat sink 1240 base portion 13G to accommodate rapid dissipation of heat from the heat sink 1240 base portion 130. Of course, all other heat sink configurations may be used, including a plurality of upwardly projecting parallel fins extending vertically along the base portion 130 of the heat sink 1240. However, this shape with upwardly extending transverse fins can be achieved by an efficient manufacturing process, such as extrusion, on the heat sink 124.
make it possible to create By placing the standoffs 132 of the base portion 130 of the heat sink 124 in intimate thermal contact with the pads 120 of the electronic device package 114, heat generated by the semiconductor devices within the electronic device package 114 during use is quickly transferred to the atmosphere. Convection and/or
Alternatively, the radiation may be directed through the pad 120, the base portion 130 of the heat sink 124, and the fins 13m1. Heat sink 124 may be anodized or otherwise surface treated to protect it from corrosion and enhance its heat dissipation properties.

Attachment clip 110 has a generally rectangular body 150 made of a resilient material with preferably high strength. Attachment clip 110 is preferably made of a non-conductive, heat-resistant material. Alternatively, the mounting clip 110 may be made of a resilient metallic material coated with a non-conductive material to insulate it from the IJ-)" wires 118 of the electronic device package 114.

Mounting clip 1100 Mounting clip 150 attaches mounting clip 110 to bottom side 11 of electronic device package +14.
The width is narrower than that of the electronic device package 114 so that it can be placed in close contact with the lower surface 112 between parallel rows of lead wires 118 extending downwardly from the electronic device package 114. This width is preferably sufficiently close to the distance between the rows of parallel leads 118 of the electronic device package 114;
Attachment clip 110 to electronic device package 11
It is preferable to align them horizontally with respect to 4.

heat sink 124 to electronic device package 114
heat sink 124 to be in close thermal contact with
' is provided with latching means for latching the mounting clip 110. In the embodiment shown in FIGS. 10-14, this latching means includes a pair of longitudinally spaced barbs 154 projecting from the mounting clip. Additionally, barb 154 preferably connects mounting clip 110t-electronic device package 114.
When the mounting clip 110 is positioned so as to be vertically aligned with the integrated circuit housing, the mounting clip 1100 may be positioned on the body 150 so as to be closely adjacent the ends of the integrated circuit housing. Each barb-shaped member 154 corresponds in function and structure to the barb-shaped member 54 shown and described in FIGS. 1 to 8A, and therefore the details thereof will be omitted.

The latching means of the present invention further includes a spring clip 180' shown in detail in FIGS. 11-16. : Prepared. The spring clip 180 includes a base portion 182 and a vertically extending spring member 184 that is deflected upwardly and projects from an opposite end of the base portion 182 . Each spring member 184 has a hole 1
Has 86. This spring clip 180, as opposed to the mounting clip 110, is attached to the electronic device package 1140.
Place it on top. The spring clip 180 can be manually deflected downward to remove the barb 15 of the mounting clip 110.
4 is the hole 186 for aligning the f'L spring member 184.
or may be adapted to pass through and engage one of the two.

In this manner, spring clip 180 can be secured to mounting clip 110 with the electronic device package positioned therebetween.

Spring clip 180 also has a central hole 188 that exposes pad 120 of electronic device package 114 when it is attached to electronic device Φ package 114 . Spring clip 180 is integrally formed with a pair of laterally spaced, upwardly extending side flanges 190. Each side flange 190 has an inwardly projecting tongue (ta).
ng) has 192. As shown in FIG. 14, the side flanges 190 receive the base portion 130 of the heat sink 124 between them, in this case the tongues 192 of which are formed by a pair of upwardly projecting fins. 134 and contacts the top of the heat sink 1240 base portion 130 to secure it to the heat sink 124t spring clip 180. heat sink 124 to side flange 190
, 190 to engage the spring clip 180 and, if desired, by manually deflecting the side flanges 190 outwardly to release the base portion 130 of the heat sink 124. It can also be removed.

Once the standoffs 132 of the heat sink 124 are engaged with the spring clips 180, the mounting clips 11
The elastic force provided by the spring clip 180 in cooperation with the center hole isa't of the spring clip 180
- is resiliently biased downwardly through and into intimate thermal contact with the para 120 of the electronic device package 114. The force that forces the heat sink 124e into contact with the electronic device package 114 is determined by the selection of the flange material, dimensions, angle and slope of the attachment. In this example, the height of the standoffs 132 of the heat sink 124 is:
When heat sink 124 and spring clip 180 are preassembled together prior to engagement with mounting clip 110 and electronic device package 114, clearance is provided for the spring member of spring clip 180 to deflect upwardly. do. It goes without saying that the spring member of the spring clip 180 in the embodiment shown in FIGS. 10-14 may be formed without upward deflection, and as described in the embodiment of FIG. without affecting the structure and function of the remaining parts of this invention.
It will be appreciated that attachment clips 110 may be provided.

Alternatively, spring clip 180 and attachment clip 11
0 can also be preassembled with each other, with the electronic device package 114t inserted and then the heat sink 124 engaged with the spring clip 180.

In such cases, the standoffs 132 of the heat sink 124 may be reduced or increased.

It will be appreciated that heat sink 124 can take many shapes. All that is required is that the heat sink 1240 base portion 130 have a portion adapted to be in intimate contact with the electronic device package 114 to remove heat. As shown in FIGS. 1-4, base portion 30 and mounting flange 36 are an integral part of heat sink 24. As shown in FIGS. However, as can be easily seen, the basal part 3
0 and the mounting flange 3B can also be formed as a separate single part, to which additional heat dissipating elements, for example stamped on extruded parts, can be fixed. It will further be appreciated that base portion 30 need not be in direct contact with electronic device package 14. Instead, separate heat sink bodies are used for the base portion 30 and the electronic device.
It may also be inserted between the packages 14. Such a heat sink body may be permanently secured to the base portion 30, or alternatively, the attachment may simply be by means of latching means attached to the flange 36 and secured in place by pressure applied thereto. However, regardless of the arrangement, the heat sink
The portion of the clip assembly that contacts the electronic device package is considered to be the bottom of the heat sink for purposes of describing and claiming this invention.

The present invention is particularly relevant to latching means which include a barb or similar member in a lower mounting clip body that mates with a base portion of a heat sink or a spring clip hole, dowel hole or the like. Although described above, it will be readily apparent that the arrangement of the latching means may be reversed.

For example, the body of the mounting clip can be formed with a pair of longitudinally spaced holes or slots, and the heat sink or spring clip can be formed with a pair of barbs similar to the barbs of FIGS. 8 or 8A. It may also have an aligned monthly latch member. The heat sink can be attached to the mounting clip by engaging each barb with one of the alignment holes or the size of a bean paste in the body of the attachment clip.

Although the invention has been described above with reference to specific preferred embodiments, these embodiments are provided for illustrative purposes only and are not intended to limit the scope of the invention. The terms bottom and top, along with other directional terms, should not be used to limit the possible orientations during use of electronic device packages, heat sinks, or mounting clips. One or more barbs or other latching means may be formed at each end of the mounting clip for engaging the heat sink mounting with a mating device of the same number of flanges. Similarly, each barb member may be formed from a single barb piece suitable for engaging a hole in the heat sink mounting portion. Furthermore, the barb-shaped portions of the various latches can be oriented inwardly or outwardly. In the mounting clip embodiments shown in Figures 1 through 8A, the flange may be omitted and holes for the barbs may be formed in the base or other portion of the heat sink. Good too. Therefore, the form of the invention described in detail above is to be understood as a preferred embodiment, and various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims. You will understand.

[Brief explanation of drawings]

FIG. 1 is an exploded perspective view of a heat sink clip assembly according to the present invention with an electronic device-package metal bias; FIG. 2 is a top view of the heat sink of FIG. 1; and FIG. 6 is a top view of the heat sink of FIG. 4 is an end view of the heat sink in FIG. 2, FIG. 5 is a side view of the mounting clip in FIG. 1, and FIG. 6 is a top view of the mounting clip in FIG. 5. 7 is an end view of the mounting clip of FIG. 5; FIG. 8 is a detailed end view of the heat sink clip assembly of the present invention attached to an electronic device package; and FIG. 8A is a detailed end view of the heat sink clip assembly of the present invention attached to an electronic device package. FIG. 9 is a detailed IIB end view of another embodiment of the mounting clip of the present invention, FIG. 9 is a side view I11 of yet another embodiment of the mounting clip of the present invention, and FIG. 11 is a top view of the spring clip of FIG. 10; FIG. 12 is a side view of the spring clip of FIG. 10; FIG. 13 is a side view of the spring clip of FIG. FIG. 14 is a cross-sectional view taken along plane 13-13 of the spring clip of FIG. 10, and FIG. 14fl is a side view of the heat sink clip assembly of FIG. 10...Mounting clip, 12...bottom side of 14,
14... Electronic device package, 16... Housing, 18... Lead storage, 20... Pad, 22
...Top side of 16, 24...heat sink, 28.
... 24 vertical axis, 30 ... base part, 32 ... side wall, 34 ... finger-shaped piece, 36 ... mounting on flange, 3
8...36 holes, 42...knobs, 50...10
body, 54... hook-shaped member, 56... hook-shaped piece, 58... distance between 56, 60... hook-shaped part,
62-... 60 inclined surface, 124... heat sink,
130... Base portion, 132... Standoff protrusion, 134... Fin, 180... Spring clip,
182-- Base portion, 184... Spring member, 188
...Center hole, 190...Side flange, 192...
-Lingage. Fig, 10

Claims (13)

[Claims] (1) (a) a heat sink having a base portion for contact with the electronic device package to dissipate heat from the electronic device package; and (b) adjacent to the electronic device package and opposite the heat sink. (c) inserting the electronic device package between the mounting clip and the heat sink; and inserting the electronic device package into the heat sink. and latching means for securing the mounting clip to the heat sink in intimate thermal contact. (2) said latching means includes: (a) a pair of longitudinally spaced barbs extending from one of said heat sink and said mounting clip; and (b) one of said heat sink and said mounting clip; a pair of holes formed in the other of the barbs to secure the heat sink to the mounting clip by bringing a base portion of the heat sink into intimate thermal contact with the electronic device package. Apparatus for dissipating heat from an electronic device package as claimed in claim 1, wherein the device comprises: engaging one of the holes. (3) said latching means includes: (a) a spring clip having a base portion for positioning adjacent an electronic device package and opposite said mounting clip; and securing means for securing said heat sink; a) a pair of vertically spaced barbs extending from one of the mounting clip and the spring clip; (c) a pair of barbs formed on the other of the mounting clip and the spring clip; a pair of holes, each barb engaging one of the holes to secure the spring clip to the mounting clip with the heat sink in intimate thermal contact with the electronic device package. The electronic device according to claim (1), comprising:
A device that dissipates heat from the package. (4) the securing means for securing the heat sink to the spring clip includes a pair of laterally spaced side flanges extending from a base portion of the spring clip, the heat sink being secured between the side flanges; and wherein each side flange is provided with an inwardly extending tongue for engaging a base portion of the heat sink when adjacent the spring clip. An apparatus for dissipating heat from an electronic device package according to paragraph (3). (5) (a) a body adapted to be placed adjacent one surface of an electronic device package; (b) a pair of longitudinally spaced barbs projecting from the body; and (c ) a pair of holes formed in the heat sink to receive the barbs so that the electronic device package is inserted between the heat sink and the mounting clip and in intimate thermal contact with the heat sink; . An apparatus for attaching a heat sink to an electronic device package, the heat sink being secured to the mounting clip. (6) An apparatus for attaching a heat sink to an electronic device package according to claim (5), wherein the main body is elongated and made of an electrically insulating material. (7) (a) an electronic device package; (b) a heat sink formed with a pair of vertically spaced holes and disposed on one side of the electronic device package; a mounting clip located on an opposite side of the device package, the mounting clip extending from the mounting clip and secured within the hole of the heat sink and vertically spaced to bias the electronic device package into contact with the heat sink; A combination device having a mounting clip with a pair of hook-like members placed on it. (8) The combination device according to claim (7), wherein the mounting clip is non-conductive. (9) the heat sink includes: (a) a base portion for contacting the electronic device package to conduct heat from the electronic device package; and (b) for dissipating heat from the heat sink. ,
a plurality of heat dissipating members extending from said base portion; (c) a pair of mounting flanges extending longitudinally oppositely from said base portion, one of said mounting flanges being longitudinally spaced apart; 7. The combination device according to claim 7, further comprising a mounting flange in which each of the holes is formed. (10) the base portion is in contact with the electronic device package such that when the barb member is engaged with the heat sink, the base portion is elastically biased toward the electronic device package; 10. The combination device of claim 9, wherein the mounting flange of the heat sink is angled away from the electronic device package when the electronic device package is located at the bottom of the electronic device package. (11) a mounting clip having a body adapted to be positioned adjacent to one side of the electronic device package; (b) a mounting clip adapted to grip a heat sink;
(c) a spring clip positioned adjacent to the package and opposite the mounting clip; (c) with the electronic device package inserted between the mounting clip and the spring clip; and latching means for latching the mounting clip to the spring clip, thereby securing the heat sink in intimate thermal contact with the electronic device package. ·clip·
assembly. (12) the latching means includes: (a) a pair of longitudinally spaced barbs extending from one of the spring clip and the mounting clip; (b) the spring clip and the mounting clip; a pair of holes formed in the other of the spring clips, each barb being suitable for engaging one of the holes to secure the spring clip to the mounting clip; A heat sink clip assembly according to claim (11). (13) (a) an electronic device package; (b) a heat sink having a base portion located on one side of the electronic device package and in intimate thermal contact with the electronic device package; c) a spring clip located on the electronic device package adjacent to the heat sink to grip the heat sink; and (d) a mounting clip located on the electronic device package on an opposite side of the heat sink and the spring clip. (e) attaching the mounting clip to the spring clip with the electronic device package inserted between the mounting clip and the spring clip and with the heat sink in intimate thermal contact with the electronic device package; and a latching means for latching the device.