JPS62240160A - Vapor type soldering device - Google Patents

Abstract

PURPOSE:To improve a liquid recovery efficiency by condensating the remaining vapor portion only inside a condensation tank, by providing a mist removing body for removing the mist particle in a vapor on the vapor introducing part communicated to the condensation tank. CONSTITUTION:A vapor introducing hose 22 as for a vapor introducing part is connected to the pipe connection part 31 provided on the right and left side faces of a condensation tank 23 and a mist removing body 32 is provided at the inner part of this hose 22. At the stage when the vapor is sucked into the condensation tank 23 via the vapor introducing hose 22 from the vapor tank, the mist particle contained in the vapor is separated from the vapor flow by being caught by the mist removing body 32 and dropped to the lower part of the condensation tank 23 via a connection pipe 31. On the other hand, only the remaining very fine vapor portion which can't be caught by the mist removing body 32 moves toward the exhaust pipe 25 at the upper part of the tank 23, being condensed on the surface of a condensation coil 24 and collects at the lower part of the tank 23 by dropping from the coil face. The air only is then exhausted to the external part via the exhaust pipe 25.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a vapor phase soldering apparatus having a feature of a liquid recovery system.

(Prior Art) In a conventional vapor phase soldering apparatus, as shown in FIG. 2, a liquid tank section 12 is integrally provided at the bottom of a steam tank 11.
A vapor phase 15 is formed in the vapor tank 11 by evaporating the liquid (fluorine-based inert solvent) 13 housed inside the liquid tank section 12 using the heater 14. A printed wiring board 1 as an object to be soldered is inserted through a loading port 16 provided on one side of the steam tank 11.
7 is carried in, the board-mounted components are reflow soldered to the board 17 using the latent heat of vaporization of the vapor phase 15, and the board 17 is exposed to the outside through the outlet 18 provided on the other side of the steam tank 11. A cooling coil 19 is provided inside the carry-in port 16 and the carry-in port 18 to prevent the vapor phase 15 from leaking outside due to the condensing action of the cooling coil 19. However, the cooling coil 19 alone is not sufficient to prevent leakage of steam.

Therefore, conventionally, a liquid recovery system 21 shown in FIG. 2 has been provided. This liquid recovery system 21 sucks steam into the condensation tank 23 by using a steam introduction hose 22 from near the openings of the carry-in port 16 and the carry-out port 18, and transfers the vapor to a condensing coil (an evaporator in a refrigerated recycler). ) 24, and the air from which the liquid content has been removed by the condensing coil 24 is forcibly exhausted to the outside through the trachea 25 by a fan. Then, the water is dripped from the condensing coil 24 to the tank 2.
The liquid 13a accumulated in the tank 3 is circulated and supplied to the liquid tank section 12 via a liquid supply pipe 28 by a pump 27.

(Problems to be Solved by the Invention) The steam introduced into the condensation tank 23 contains mist with large particle diameters.

A large amount of these mist particles adhere to the condensing coil 24, lowering the steam condensing efficiency (liquid recovery efficiency) of the condensing coil 24, and causing a problem that a large amount of steam is contained in the exhaust gas to the outside. . This liquid 13 that becomes vapor is very expensive.

An object of the present invention is to improve the liquid recovery efficiency in a vapor phase soldering apparatus.

[Structure of the invention]

(Means for Solving the Problems) The present invention evaporates the liquid 13 contained in the liquid tank portion 12 of the steam tank 11 to form a vapor phase 15 in the vapor tank 11, and The soldering material 17 is carried in and reflow soldering is performed using the latent heat of vaporization of the vapor phase 15, and the vapor sequentially generated in the vapor tank 11 is introduced into the condensation tank 23 and liquefied, and the liquid 13a is The liquid tank section 1
In this vapor phase soldering apparatus, a mist removing body 32 for removing mist particles in the vapor is provided in the vapor introduction section 22 to the condensing tank 23.

(Function) According to the present invention, when steam is introduced from the steam tank 11 into the condensing tank 23 via the steam introduction section 22, mist particles contained in the steam are recovered from the steam by the mist removing body 32. , immediately falls to the bottom of the condensation tank 23, and only the remaining vapor is condensed within the tank 23.

(Example) Hereinafter, the present invention will be explained in detail with reference to an example shown in FIG. Note that the vapor phase soldering device and the liquid recovery system are the same as those shown in FIG. 2, so illustration and description thereof will be omitted.

Pipe connection portions 3 provided on the left and right sides of the condensation tank 23
1 is connected to a steam introduction hose 22 as the steam introduction section, and a mist removal body 32 is provided inside this hose 22.

As the mist removing body 32, a material such as a fine wire mesh is filled inside the hose 22.

Then, mist particles (large particle size) in the steam
The steam tank 1 easily collides with obstacles and is easily captured by obstacles and separated from the steam flow even without cooling.
At the stage where steam is sucked into the condensation tank 23 from near the openings of the carry-in port 16 and the carry-out port 1B through the steam introduction hose 22, the mist particles contained in this steam are removed from the mist removing body 32. is captured and separated from the vapor flow and immediately falls through the pipe connection 31 to the lower part of the condensation tank 23. On the other hand, only the remaining fine vapor that cannot be captured by the mist remover 32 is transferred to the condensing tank 3.
When moving toward the exhaust pipe 25 at the top of the tank 3, it comes into contact with the condensing coil 24 and is condensed on the surface of the coil 24, dripping from the coil surface and collecting at the bottom of the tank 23. Then, only air is exhausted to the outside through the exhaust pipe 25.

The mist removing body 32 is not limited to the wire mesh of the embodiment, but may be any other material as long as it allows steam to pass through and is an obstacle for mist particles.

[Effects of the Invention] According to the present invention, since the mist removing body for removing mist particles in the steam is provided in the steam introduction part to the condensing tank, the mist particles contained in the steam are removed before entering the condensing tank. After being collected by the removal body, only the remaining vapor can be effectively condensed in the condensation tank, thereby increasing the liquid recovery efficiency.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing one embodiment of the present invention, and FIG. 2 is a sectional view of a vapor phase soldering apparatus. 11. Steam tank, 12. Liquid tank section, 13. Liquid, 15.
・Steam phase, 17.. Printed wiring board as an object to be soldered, 22.. Steam introduction hose as a steam introduction part,
23...Condensation tank, 32...Miss]・Removal body.

Claims (1)

[Claims] (1) The liquid stored in the liquid tank part of the steam tank is evaporated to form a vapor phase in the steam tank, the objects to be soldered are carried into this vapor phase, and the latent heat of vaporization of the vapor phase is used to perform reflow soldering. In a vapor phase soldering apparatus, in which the vapor sequentially generated in the vapor tank is introduced into a condensing tank and liquefied, and the liquid is circulated to the liquid tank, a vapor introduction part to the condensing tank is provided. A vapor phase soldering device characterized in that a mist removing body is provided for removing mist particles in vapor.