JPS62239534A - Rotary drier for semiconductor wafer - Google Patents

Abstract

PURPOSE:To mininize the space necessary for opening and closing a cover by a method wherein, within a rotary drier of semiconductor wafer, a cover opening and closing mechanism is equipped with a four link rod mechanism. CONSTITUTION:A cover 13 is fixed on the main body of a rotary drier by two each of links 11, 12 held by bearings making both ends rotatable. The length of links 11, 12 and the fixed positions thereof to a cover 13 or the rotary drier are designed so that the loci of motions thereof may be described as represented by the numbers 13, 14, 15 and 16 during the opening and closing operations of cover 13. In the opened state 16 of the cover 16, the uppermost part of cover 13 is designed to be level with that of the rotary drier or lower than that of the same. Through these procedures, the space necessary for opening and closing the cover 13 can be minimized.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a lid opening/closing mechanism for a rotary drying apparatus used for drying semiconductor wafers after wet processing such as etching or washing with water.

(Prior Art) FIGS. 2 and 3 are diagrams showing an example of a lid opening/closing mechanism of a conventional rotary wafer drying apparatus. FIG. 2 shows a case where a rotary wafer drying device is installed in a manual cleaning machine in which an operator mainly takes the wafer carrier 3 in and out by hand. The lid 1 is opened and closed by an air cylinder 2 from the side in front of the operator. Also,
FIG. 3 shows a case where a rotary wafer drying device is installed in an automatic cleaning machine that automatically transports a wafer carrier 7 mainly through a wafer carrier transport port 4. The lid 5 is opened and closed by an air cylinder 6 on the transfer robot side.

All conventional lid opening/closing mechanisms have been hinge-type.

(Problems to be solved by the invention) However, according to the conventional hinge-type lid opening/closing mechanism,
Because space is needed to open the lid, the ceiling of the rotary dryer must be made high. In addition, in the case of a lid that opens on the back side, there is a problem that maintenance work such as cleaning inside the device is difficult to do.

(Means for Solving the Problems) In order to solve the above problems, the present invention uses a four-bar link mechanism for the lid opening/closing mechanism in a semiconductor wafer rotary drying apparatus.

(Function) The semiconductor wafer rotary drying apparatus of the present invention uses a four-bar linkage mechanism to open and close the lid, and the lid can be opened and closed with a minimum amount of space. Moreover, when the lid is opened, the highest part of the lid is lowered to a position lower than the highest part of the main body of the drying apparatus along the side surface of the drying apparatus.

(Embodiment) FIG. 1 shows a rotary drying apparatus for semiconductor wafers showing an embodiment of the present invention. The lid 13 is attached to the main body of the rotary dryer by two links 11 and 12 supported by bearings so that both ends can rotate. The lengths of the links 11 and 12 and the mounting positions on the lid or rotary dryer are such that the trajectory of their movement when opening and closing the lid is from 13 to 14.1.
As shown in 5.16, the top of the lid is designed to be at the same level or lower than the top of the rotary dryer in the open state 16.

To drive this mechanism, a spur gear 17 is provided on the rotating shaft of the link 11 on the main body side, and another spur gear 18 is meshed with this. Furthermore, a pivot is provided near the outer periphery of the spur gear, and by driving this pivot with an air cylinder 14, the spur gear 18 is rocked, and the link 1 is rocked.

In this embodiment, the necessary swing angle of the link 11 is 180°.
It is the rank. On the other hand, the rocking angle given by the air cylinder 14 of the spur gear 18 is considered to be limited to about 90°, taking into account fluctuations in the torque of the spur gear 18. Therefore, the gear ratio of spur gears 17 and 18 is set to 1:2.

Links 11 and 12 are similarly installed on the back side of FIG. 1, and smooth movement is achieved by connecting the rotation axis of the link 11 on the main body side with the rotation axis of the front link 11. It has gained.

(Effects of the Invention) As described above in detail, according to the present invention, by using the four-bar link mechanism, the space required for opening and closing the lid is minimized. Furthermore, when the lid is opened, it lowers along the side of the device body to a position lower than the device body, which improves workability during maintenance such as cleaning the inside of the device.

[Brief explanation of drawings]

FIG. 1 is a schematic explanatory diagram of a semiconductor wafer rotary drying apparatus showing an embodiment of the present invention, and FIGS. 2 and 3 are schematic explanatory diagrams of a conventional semiconductor wafer rotary drying apparatus. 1.5...Lid, 2,6...Air cylinder, 3.7.
...Wafer carrier, 4...Transfer robot, 13...
・Lid, 14...Air cylinder, 17.18...Spur gear. Patent applicant Oki Electric Industry Co., Ltd. 1: L 2: 17 series) DA 3: 1 1 Peeling 7 Supplement 7 Sheet guide 1 Wafer rotary loading device Figure 2

Claims (1)

[Claims] A pair of first connectors connect both sides of the main body and both sides of the lid.
, a second arm, one end of which is connected to a drive source that performs rotational motion; a first arm that is connected to both ends of the shaft; The rotary link mechanism is equipped with a second arm that performs a rotational movement in the same way as the arm, and when opened from a closed horizontal position, the rotational movement of the first and second arms causes it to stop in a state parallel to the front of the device. A rotary drying device for semiconductor wafers, which is characterized by: