JPS62238761A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS62238761A JPS62238761A JP8349686A JP8349686A JPS62238761A JP S62238761 A JPS62238761 A JP S62238761A JP 8349686 A JP8349686 A JP 8349686A JP 8349686 A JP8349686 A JP 8349686A JP S62238761 A JPS62238761 A JP S62238761A
- Authority
- JP
- Japan
- Prior art keywords
- thermal head
- thermal
- substrate
- head substrate
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 239000000919 ceramic Substances 0.000 claims abstract description 21
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000007639 printing Methods 0.000 abstract description 4
- 239000006185 dispersion Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はサーマルヘッドの構造に関し１時に熱応答特性
が優れていて高速印字に適し、印字記録譲度ムラが少な
く、而も小型で低床なサーマルヘッドを提供することに
ある。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to the structure of a thermal head, which has excellent thermal response characteristics, is suitable for high-speed printing, has little unevenness in print recording yield, and is compact and has a low profile. The objective is to provide a thermal head with a high quality.
従来、この魂のサーマルヘッドは、アルミナ。 Conventionally, this soul thermal head is made of alumina.
ホウロウ、炭化硅素等のセラミック４糎上に部分グレー
ズ、全面グレーズ等が蓄熱層として施 され、更に薄膜
状物質あるいは厚膜状物質からなる発熱抵抗体列及び導
電体が前記基板上に形成され。A partial glaze, a full-scale glaze, etc. are applied as a heat storage layer on a ceramic material such as enamel or silicon carbide, and furthermore, a heating resistor array and a conductor made of a thin film material or a thick film material are formed on the substrate.
所望によりこの基板上に発熱抵抗体列を駆動するだめの
駆動ＩＣを搭載又は接続されたものをサーマルヘッド４
ｍとしている。このサーマルヘッド基板は放熱板上に固
定されて、サーマルヘッドとしての所要の機能を提供し
ていた。サーマルヘッドの熱応答特性を高めるためには
１例えば、サーマルヘッド基板と放熱板との間に、第２
のセラミック基板を挿入する方法が考えられろ。If desired, a drive IC for driving the heating resistor array is mounted on or connected to this board as a thermal head 4.
m. This thermal head substrate was fixed on a heat sink and provided the necessary functions as a thermal head. In order to improve the thermal response characteristics of the thermal head, for example, a second
Can you think of a way to insert a ceramic substrate?
上述した従来のサーマルヘッドは、サーマルヘラド基板
の発熱抵抗体列側辺部と第２のセラミック基板の辺部と
が一致して放熱板上に配置されているために、これらの
セラミックの辺部である切断回に生じる垂直方向の凹凸
によってサーマルヘッド基板に局部的な高低差が生じ、
従って印字記録紙に加えられるべきサーマルヘッドから
の押圧力が局部的に差異を生じ、印字記録紙には局部的
な濃度ムラが発生する欠点がある。In the above-mentioned conventional thermal head, since the side edge of the heating resistor array of the thermal helad board and the side edge of the second ceramic substrate are aligned and arranged on the heat sink, Vertical unevenness that occurs during a certain cutting process causes local height differences on the thermal head board.
Therefore, the pressing force from the thermal head to be applied to the printed recording paper locally varies, and the printed recording paper has the disadvantage that local density unevenness occurs.
また、従来のサーマルヘッドにＫいては、サーマルヘッ
ド基板上に直接駆動ＩＣを搭載すると。In addition, in conventional thermal heads, the drive IC is mounted directly on the thermal head substrate.
複雑な−Ａ造工程を所要とする高価なサーマルヘッド基
板の面積が大きくなり、製造されるサーマルヘプトは必
然的に高価とならざるを得ない欠点がある。There is a disadvantage that the area of the expensive thermal head substrate that requires a complicated -A manufacturing process becomes large, and the manufactured thermal head inevitably becomes expensive.
他方、サーマルヘッド基板と安価な配線板（例えば多層
配線プリント版）とを、一定の間隙を有するように平面
的に放熱板上に配置・固定し、この間隙部に多数の駆動
ＩＣを配ａすると、製造されるサーマルヘッドは寸法が
太き（なるという欠点があり、また！＠ＫａＩｃとサー
マルヘッド基板あ魯いは配線板との電気的接続に要ｊる
費用が高くなるという欠点がある。On the other hand, a thermal head board and an inexpensive wiring board (for example, a multilayer wiring printed board) are placed and fixed on a heat sink with a certain gap between them, and a large number of drive ICs are arranged in this gap. As a result, the manufactured thermal head has the disadvantage of being large in size, and also has the disadvantage of increasing the cost of electrical connection between the KaIc and the thermal head substrate or wiring board. .
本発明のサーマルヘッドは、サーマルヘッド基板の発熱
抵抗体列側辺部よりも後退させて前記第２のセラミ・ツ
ク基板をサーマルヘッド基板及び配線板と放熱、仮との
間に挿入するとともに、前記配線板の上に駆動ＩＣを搭
載するものである。In the thermal head of the present invention, the second ceramic board is inserted between the thermal head board, the wiring board, and the heat dissipation board by being set back from the side of the heat generating resistor array of the thermal head board, and A drive IC is mounted on the wiring board.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例の要部の断面を模式的に示し
た図であり、第２図は第１図の平面図である。FIG. 1 is a diagram schematically showing a cross section of a main part of an embodiment of the present invention, and FIG. 2 is a plan view of FIG. 1.
１は部分グレーズ２部に発熱抵抗体列を具備するサーマ
ルヘッド基板であり、単層配線又は多層配線された配朦
仮３と共に第２のセラミック基板４上に配置・固定され
る。ここに８いて、第２のセラミック基破り発熱抵抗体
列側辺部（ｂ）は、サーマルヘッド基板の発熱抵抗体列
側辺部（ａ）よりも後退して放熱＆５上に配置・固定さ
れる。また、駆動ＩＣ６は配線板３上に直接搭載される
。駆動ＩＣとサーマルヘッド基板及び配線板とのべ気的
接続は、ボンディング・ワイヤ７により行なわれる。Reference numeral 1 denotes a thermal head substrate having a heat generating resistor array in a partial glaze 2 portion, and is placed and fixed on a second ceramic substrate 4 together with a layout 3 having single-layer wiring or multi-layer wiring. Here, the second ceramic base-broken heating resistor row side part (b) is set back from the heating resistor row side part (a) of the thermal head board and is arranged and fixed on the heat dissipation &5. Ru. Further, the drive IC 6 is mounted directly on the wiring board 3. The driving IC is electrically connected to the thermal head substrate and the wiring board using bonding wires 7.
未発月は部分グレーズ基板のみならず、全面グレーズ基
板に対しても適用することができる。The unreleased moon can be applied not only to partially glazed substrates but also to fully glazed substrates.
以上説明したように本発明は、サーマルヘッド基板と放
＊ｍとの間に挿入されるべき第２のセラミック板４を配
線１ｆｉ３の下部にも延長させると共に、このセラミッ
ク板−１の辺部（ｂ）をサーマルヘッド基板の発熱抵抗
体列側辺部（ａ）エリも後退させて放熱板上に固定し、
しかも配＋ｔｈ！析３上に直接駆動ＩＣを搭載するもの
である。この結果、高価なサーマルヘッド基板の所要面
積は小さくなり、ｍ造されるサーマルヘッドは小型にな
るとともに廉価ともなる。またサーマルヘッド基版下部
にはセラミック板が配装置されているために１本発明の
サーマルヘッドは熱応答特性が優れたものとなる。更に
またサーマルヘッド基板の辺部（ａ）と放熱版表面との
間には間隙が設けられているために、たとえサーマルヘ
ッド基板の切断辺部（ａ）に垂直方向の凹凸があっても
、サーマルヘッド基板は放熱版表面から一定の距離をも
って放熱板上に配置されることになり、サーマルヘッド
は均一な印字記録濃度を具備する記録紙を提供すること
ができる。またサーマルヘッド基板の発熱抵抗体列側と
は反対の側の配線板の辺部（Ｃ）から後退させて、前記
セラミック板を放熱板上に固定することに裏って、前記
配線板部にコネクタ類を搭載させることもできる。As explained above, the present invention extends the second ceramic plate 4 to be inserted between the thermal head substrate and the radiation *m to the lower part of the wiring 1fi3, and also extends the side part of the ceramic plate-1 ( b) is fixed on the heat sink by retracting the heat generating resistor row side edge (a) of the thermal head board;
Moreover, distribution +th! The drive IC is mounted directly on the analyzer 3. As a result, the area required for the expensive thermal head substrate becomes smaller, and the thermal head manufactured in m becomes smaller and less expensive. Furthermore, since a ceramic plate is disposed below the thermal head base plate, the thermal head of the present invention has excellent thermal response characteristics. Furthermore, since there is a gap between the side (a) of the thermal head substrate and the surface of the heat dissipation plate, even if the cut side (a) of the thermal head substrate has vertical unevenness, The thermal head substrate is placed on the heat sink at a certain distance from the surface of the heat sink, and the thermal head can provide recording paper with uniform printing density. In addition, the ceramic board is moved back from the side (C) of the wiring board on the side opposite to the heating resistor row side of the thermal head board, and the ceramic board is attached to the wiring board part, contrary to fixing the ceramic board on the heat sink. It can also be equipped with connectors.
本発明が上記した効果を呈する以上１本発明に用いられ
る材料や部品類の材質や厚み、形状１寸法、用途１ｗＩ
像度、搭載ＩＣ数、固定方法、ＩＣとサーマルヘッド基
板との接続方法等は特に限定されるべきものではないこ
とは勿論であり、前記セラミック基破の後退距離もまた
特に指定されるべきものではない。The present invention exhibits the above-mentioned effects. 1. Materials and thicknesses, shapes, dimensions, and uses of materials and parts used in the present invention.
Of course, the image resolution, the number of ICs to be mounted, the fixing method, the connection method between the IC and the thermal head substrate, etc. should not be particularly limited, and the retreat distance of the ceramic substrate should also be specified. isn't it.
【図面の簡単な説明】
第１図は本発明の要部を模式的に示す断面図。
第２図は第１図の模式的平面図である。
１・・・・・・サーマルヘラ）”基［、（ａ）・・・・
・・サーマルヘッドの発熱抵抗体列側辺部、２・・・・
・・部分グレーズ。
３・・・・・・配線板、４・・・・・・セラミック板、
（ｂ）・・・・・・セラミック板の発熱抵抗体列側辺
部、（Ｃ）・・・・・・セラミックの発熱抵抗体列側と
は反対側の辺部、５・・・・・・放熱板、６・・・・・
・駆動ＩＣ１７・・・・・・ボンディング・ワイヤ。
代理人 弁理士 内 原 晋
１ ： サーマルへνＦ基板
２ ： 部分り“レース”
３ ： Ｏこ爪陵オ仄
４： でう８７７級
５ ： 方に勇り本（
６： 絽＊ｈＩＣ
東１図
第２図 ４BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view schematically showing the main parts of the present invention. FIG. 2 is a schematic plan view of FIG. 1. 1...Thermal spatula)" group [, (a)...
・・Side part of heating resistor row of thermal head, 2・・・・
...Partial glaze. 3... Wiring board, 4... Ceramic board,
(b)...Side part of the ceramic plate on the side of the heating resistor array, (C)...Side part of the ceramic plate on the side opposite to the heating resistor array side, 5...・Heat sink, 6...
・Drive IC17...Bonding wire. Agent Patent Attorney Susumu Uchihara 1: Thermal to νF board 2: Partial “lace” 3: O-kozume-ryo 4: Deu 877 class 5: Houni Yurimoto (6: 絽＊hIC East 1 map Figure 2 4
Claims (1)
ド基板と放熱板との間に挿入されるべき第２のセラミッ
ク基板が、前記サーマルヘッド基板の発熱抵抗体列側辺
部から後退して前記放熱板上に配置されていることを特
徴とするサーマルヘッド。 ２、特許請求の範囲第１項記載のサーマルヘッドにおい
て、前記発熱抵抗体列側とは反対の側の前記配線板辺部
からも後退して、前記第２のセラミック基板が放熱板上
に配置されていることを特徴とするサーマルヘッド。[Claims] 1. A second ceramic substrate to be inserted between a thermal head substrate and a heat sink, which includes a wiring board and a heat generating resistor array, is placed on the heat generating resistor array side of the thermal head substrate. A thermal head, characterized in that the thermal head is placed on the heat sink so as to be set back from a side portion. 2. In the thermal head according to claim 1, the second ceramic substrate is arranged on a heat sink so as to be set back from a side of the wiring board on a side opposite to the heating resistor row side. A thermal head characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8349686A JPS62238761A (en) | 1986-04-10 | 1986-04-10 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8349686A JPS62238761A (en) | 1986-04-10 | 1986-04-10 | Thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62238761A true JPS62238761A (en) | 1987-10-19 |
Family
ID=13804086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8349686A Pending JPS62238761A (en) | 1986-04-10 | 1986-04-10 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62238761A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5329298A (en) * | 1991-08-19 | 1994-07-12 | Samsung Electronics Co., Ltd. | Thermal print head |
| CN111038111A (en) * | 2018-10-11 | 2020-04-21 | 罗姆股份有限公司 | Thermal print head and method of manufacturing the same |
-
1986
- 1986-04-10 JP JP8349686A patent/JPS62238761A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5329298A (en) * | 1991-08-19 | 1994-07-12 | Samsung Electronics Co., Ltd. | Thermal print head |
| CN111038111A (en) * | 2018-10-11 | 2020-04-21 | 罗姆股份有限公司 | Thermal print head and method of manufacturing the same |
| CN111038111B (en) * | 2018-10-11 | 2021-09-07 | 罗姆股份有限公司 | Thermal print head and method of manufacturing the same |
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