JPS62237792A - Etcher of printed board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an etching apparatus for μ printed circuit boards, and more particularly to a horizontal conveyance etching apparatus suitable for etching printed circuit boards with high precision.

[Conventional technology]

In conventional printed circuit board etching equipment, etching liquid discharge nozzles are placed above and below a conveyor that conveys printed circuit boards horizontally, and the printed circuit board is passed between the nozzles.
In order to speed up renewal on the plate surface and to perform more uniform etching, the nozzle fI:a<)4 is moved horizontally or rotated reciprocatingly as described in Japanese Patent No. 1J6-221282. There is.

[Problems that the invention attempts to solve]

The above-mentioned conventional technology lacks consideration for the problem that etching liquid accumulates on the upper side of the printed circuit board, resulting in non-uniform etching on the upper surface.

In particular, as the size of the printed circuit board increases, the effect becomes greater, and the etching accuracy of the upper surface deteriorates.

For example, printed circuit board Piz 500 x 500 mm
In this case, the etching at the center of the upper surface is unevenly etched by about 70 inches at the outer periphery. Therefore, as described in Japanese Patent Publication No. 60-7709, a process of etching one main surface of a double-sided printed board by spraying an etching liquid from below, a process of turning the object to be etched upside down, and another process are performed. A method and device have been devised for double-sided etching by spraying an etching solution onto the main surface from below, but in such a method, the length of the etching device is more than doubled, and the etching process increases. When the top and bottom surfaces of the etching object are turned over, the etching resist film is likely to be scratched, resulting in pattern defects.In addition, the etching solution will also surround the top surface of objects other than long objects, especially the outer periphery of the top surface. There was a problem in that a large amount of etching was performed, and the etching tended to be uneven. .

SUMMARY OF THE INVENTION An object of the present invention is to provide a spray etching apparatus for etching large-sized printed circuit boards with high precision.

[Means for solving problems]

The above object is achieved by adding a repair etching device to the conventional etching device, which is capable of etching more of the portion where the amount of etching is reduced.

In other words, the present invention comprises a main niche/etching device which etches more than half of the required etching amount, and an 1llIi1-etching device which follows the main niche/etching device and performs etching to correct the non-uniformity of the etching amount. Ru.

[Effect]

Spraying the etching solution in the repair etching equipment is carried out only when the printed circuit board is in a predetermined position in the repair etching equipment, and the spraying position is set to the part of the printed circuit board where the amount of etching is small, sometimes to the center of the upper surface. Let it go inside. Does that mean spraying etching solution? , lk will be more etched in the middle, so the amount of etching will be uniform as a whole.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows the configuration of a horizontal conveyance type spray etching apparatus according to an embodiment of the present invention, in which 1 is a main etching chamber, 2 is a repair etching difference, 3 is a recovery washing chamber, and 24 is a cleaning chamber. This is the washing room. Note that 15 is a conveyor roll, 16 is a spray pipe, 17 is an etching liquid, 18 is a recovered running water, 19 is a cooling coil, and 20d is a heater.

FIG. 2 shows details of the main etching chamber 1 and the repair etching chamber 2. The etching chamber 1 also serves as an etching solution storage tank. 7 is a supplementary etching spray pump, 8 is an etching liquid spray distribution I, 9 is a bypass pipe, 10 is an electromagnetic box, and 11 detects when a printed circuit board is flowing. It is a proximity switch, and 12 is a pulp that adjusts the amount of etching liquid to be sprayed.

The operation of this embodiment, which has the above-mentioned structure, will be described below with reference to the drawings.

When the printed circuit board is placed on the conveyor roll 15 of the input section 6, it passes through the main etching chamber 1--repair etching chamber 2, etc. while being processed, and is conveyed to the unloading section 16, where the etching process is completed. do. That is, the printed circuit board first enters the main etching chamber 1,
In the main etching chamber 1, an etching solution (for example, cupric chloride etching solution) is sprayed from above and below the conveyor to etch the wires on the surface of the print and board.

The spray nozzles 21 of this etching chamber 1 are arranged at one interval so that the etching liquid 17 is evenly sprayed on the printed circuit board, and the spray nozzles 21 are arranged at one interval so that the etching liquid 17 is evenly sprayed on the printed circuit board.
In order to rapidly etch the surface of the plate and to achieve more uniform etching, the sougret plate f8 to which the spray nozzle 21 is attached is rotated and reciprocated through 60 to 40 degrees. With such an etching difference, in a printed circuit board of 5QOX500m, the amount of etching in the central part of the upper 11411 surface is about 70% of that in the outer peripheral part. Therefore, taking into consideration the etching amount in the main etching chamber 1, the etching amount in the main etching chamber 1 is 66% at the center of the upper surface and 98% at the center of the lower surface. Set the etching solution spray flow rate and spray time accordingly.

According to the inventor's many years of research, for example, the steel foil thickness is 70 mm.
When etching a μm printed circuit board with a weir-enhanced second steel etching solution (copper concentration: 13 op/l, hydrochloric acid concentration: 6 op/l), the above etching amount is obtained at an etching solution temperature of 45°C and an upper spray pressure of i, 6'. A, Lower lower spray pressure 1 mowing 5 is possible.

Next, the printed circuit board is conveyed to the auxiliary etching chamber 2 by a conveyor roll 15. At this time, the proximity switch 11 detects that the printed circuit board has been conveyed, and the etching liquid 17 is sprayed only while the printed circuit board is at a desired position in the repair etching chamber 2. The spray liquid 22 indicates the etching liquid sprayed from the spray nozzle 21 and its direction. According to the research of one inventor, the proximity switch 11 is
#The capacitive proximity switch does not touch the printed circuit board, does not damage the circuit pattern, and is free from failure.

Moreover, the spray nozzle 21 of this repair etching chamber 2 is
Arrange the printed circuit board so that the etching solution is sprayed onto the center of the upper surface. This makes it possible to etch a large amount of the upper central portion of the printed circuit board.

The amount of etching in the above supplementary etching chamber 2 is:
The etching amount should be 37% of the original desired amount at the center of the upper ml (i.e., the total etching amount.

Etching level (so that it is 100% of 4!1)
Set the ettender liquid spray amount and spray time).

For example, when etching a printed circuit board with a foil thickness of 70 μm using the above-mentioned chlorinated steel etching solution, the etching temperature is 45°C, the spray pressure is 1.6~, and the etching level is 2.1 minutes for 1 hour. The above etching remains can be obtained.

Although the etching solution in the repair etching chamber 2 is sprayed only on the upper surface, the solution also spreads to the lower surface, resulting in about 2 etchings of the original desired amount.

Being pinched. As a result, the total etching rate on the lower surface is also 100% of the desired etching t. Furthermore, an etching depth of approximately 10 inches is added to the outer peripheral portion of the upper surface of the printed circuit board, resulting in 100% of the desired etching amount.

Thereafter, the printed circuit board is thoroughly cleaned in the recovery washing chamber 5 and the water washing chamber 4, and the etching is completed.

Note that the technique of the present invention can also be applied to an etching apparatus that etches only one side. In this case, the lower spray nozzle 21 is not required in the main etching chamber.

〔Effect of the invention〕

According to the embodiment described above, in a horizontal conveyance type etching apparatus, three
It has the effect of being able to etch large printed circuit boards/boards larger than 00x60011t1L with high precision6.

[Brief explanation of drawings]

FIG. 1 is a block diagram of an embodiment of the present invention, and FIG. 2 is a block diagram of an etching chamber according to the present invention. 1...Main etching 2...Repair etching chamber 15 threads conveyor roll 21 threads spray nozzle

Claims (1)

[Scope of Claims] 1. An etching device that horizontally transports a printed circuit board and etches it with a spray nozzle, comprising: a main etching device that etches more than half of the required etching amount; 1. A printed circuit board etching apparatus comprising: a repair etching apparatus for correcting etching for non-uniformity of printed circuit boards. 2. The spray nozzle of the main etching device is arranged to etch at least the upper side of the printed circuit board, and the spray nozzle of the repair etching device mainly repairs the amount of etching on the upper center of the printed circuit board. 2. The printed circuit board etching apparatus according to claim 1, wherein the printed circuit board etching apparatus is arranged so as to perform etching.