JPS6223656B2 - - Google Patents
Info
- Publication number
- JPS6223656B2 JPS6223656B2 JP56165680A JP16568081A JPS6223656B2 JP S6223656 B2 JPS6223656 B2 JP S6223656B2 JP 56165680 A JP56165680 A JP 56165680A JP 16568081 A JP16568081 A JP 16568081A JP S6223656 B2 JPS6223656 B2 JP S6223656B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- polypropylene
- weight
- metal
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- -1 polypropylene Polymers 0.000 claims description 68
- 239000004743 Polypropylene Substances 0.000 claims description 59
- 229920001155 polypropylene Polymers 0.000 claims description 59
- 229910052751 metal Inorganic materials 0.000 claims description 36
- 239000002184 metal Substances 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 24
- 150000001451 organic peroxides Chemical class 0.000 claims description 22
- 239000000203 mixture Substances 0.000 claims description 14
- 238000002844 melting Methods 0.000 claims description 13
- 230000008018 melting Effects 0.000 claims description 13
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 claims description 12
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 12
- 238000004132 cross linking Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 7
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 claims description 7
- 150000001735 carboxylic acids Chemical class 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 10
- 239000000057 synthetic resin Substances 0.000 description 6
- 229920003002 synthetic resin Polymers 0.000 description 6
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 5
- 229920005604 random copolymer Polymers 0.000 description 5
- 229920001400 block copolymer Polymers 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 239000004322 Butylated hydroxytoluene Substances 0.000 description 3
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- 229940095259 butylated hydroxytoluene Drugs 0.000 description 3
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 3
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 3
- 239000008116 calcium stearate Substances 0.000 description 3
- 235000013539 calcium stearate Nutrition 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920000098 polyolefin Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- ODBCKCWTWALFKM-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhex-3-yne Chemical compound CC(C)(C)OOC(C)(C)C#CC(C)(C)OOC(C)(C)C ODBCKCWTWALFKM-UHFFFAOYSA-N 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 238000005453 pelletization Methods 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- KDGNCLDCOVTOCS-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy propan-2-yl carbonate Chemical compound CC(C)OC(=O)OOC(C)(C)C KDGNCLDCOVTOCS-UHFFFAOYSA-N 0.000 description 1
- BEWIWYDBTBVVIA-SNAWJCMRSA-N (e)-4-(butylamino)-4-oxobut-2-enoic acid Chemical compound CCCCNC(=O)\C=C\C(O)=O BEWIWYDBTBVVIA-SNAWJCMRSA-N 0.000 description 1
- OZMRKDKXIMXNRP-BQYQJAHWSA-N (e)-4-(dibutylamino)-4-oxobut-2-enoic acid Chemical compound CCCCN(CCCC)C(=O)\C=C\C(O)=O OZMRKDKXIMXNRP-BQYQJAHWSA-N 0.000 description 1
- BZVFXWPGZHIDSJ-AATRIKPKSA-N (e)-4-(diethylamino)-4-oxobut-2-enoic acid Chemical compound CCN(CC)C(=O)\C=C\C(O)=O BZVFXWPGZHIDSJ-AATRIKPKSA-N 0.000 description 1
- HBQGCOWNLUOCBU-ONEGZZNKSA-N (e)-4-(ethylamino)-4-oxobut-2-enoic acid Chemical compound CCNC(=O)\C=C\C(O)=O HBQGCOWNLUOCBU-ONEGZZNKSA-N 0.000 description 1
- FSQQTNAZHBEJLS-OWOJBTEDSA-N (e)-4-amino-4-oxobut-2-enoic acid Chemical compound NC(=O)\C=C\C(O)=O FSQQTNAZHBEJLS-OWOJBTEDSA-N 0.000 description 1
- BSSNZUFKXJJCBG-OWOJBTEDSA-N (e)-but-2-enediamide Chemical compound NC(=O)\C=C\C(N)=O BSSNZUFKXJJCBG-OWOJBTEDSA-N 0.000 description 1
- BEWIWYDBTBVVIA-PLNGDYQASA-N (z)-4-(butylamino)-4-oxobut-2-enoic acid Chemical compound CCCCNC(=O)\C=C/C(O)=O BEWIWYDBTBVVIA-PLNGDYQASA-N 0.000 description 1
- OZMRKDKXIMXNRP-FPLPWBNLSA-N (z)-4-(dibutylamino)-4-oxobut-2-enoic acid Chemical compound CCCCN(CCCC)C(=O)\C=C/C(O)=O OZMRKDKXIMXNRP-FPLPWBNLSA-N 0.000 description 1
- BZVFXWPGZHIDSJ-WAYWQWQTSA-N (z)-4-(diethylamino)-4-oxobut-2-enoic acid Chemical compound CCN(CC)C(=O)\C=C/C(O)=O BZVFXWPGZHIDSJ-WAYWQWQTSA-N 0.000 description 1
- HBQGCOWNLUOCBU-ARJAWSKDSA-N (z)-4-(ethylamino)-4-oxobut-2-enoic acid Chemical compound CCNC(=O)\C=C/C(O)=O HBQGCOWNLUOCBU-ARJAWSKDSA-N 0.000 description 1
- BSSNZUFKXJJCBG-UPHRSURJSA-N (z)-but-2-enediamide Chemical compound NC(=O)\C=C/C(N)=O BSSNZUFKXJJCBG-UPHRSURJSA-N 0.000 description 1
- UBRWPVTUQDJKCC-UHFFFAOYSA-N 1,3-bis(2-tert-butylperoxypropan-2-yl)benzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC(C(C)(C)OOC(C)(C)C)=C1 UBRWPVTUQDJKCC-UHFFFAOYSA-N 0.000 description 1
- PQUXFUBNSYCQAL-UHFFFAOYSA-N 1-(2,3-difluorophenyl)ethanone Chemical compound CC(=O)C1=CC=CC(F)=C1F PQUXFUBNSYCQAL-UHFFFAOYSA-N 0.000 description 1
- JNPCNDJVEUEFBO-UHFFFAOYSA-N 1-butylpyrrole-2,5-dione Chemical compound CCCCN1C(=O)C=CC1=O JNPCNDJVEUEFBO-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- HQOVXPHOJANJBR-UHFFFAOYSA-N 2,2-bis(tert-butylperoxy)butane Chemical compound CC(C)(C)OOC(C)(CC)OOC(C)(C)C HQOVXPHOJANJBR-UHFFFAOYSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- VAPQAGMSICPBKJ-UHFFFAOYSA-N 2-nitroacridine Chemical compound C1=CC=CC2=CC3=CC([N+](=O)[O-])=CC=C3N=C21 VAPQAGMSICPBKJ-UHFFFAOYSA-N 0.000 description 1
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- MKTOIPPVFPJEQO-UHFFFAOYSA-N 4-(3-carboxypropanoylperoxy)-4-oxobutanoic acid Chemical compound OC(=O)CCC(=O)OOC(=O)CCC(O)=O MKTOIPPVFPJEQO-UHFFFAOYSA-N 0.000 description 1
- OIYTYGOUZOARSH-UHFFFAOYSA-N 4-methoxy-2-methylidene-4-oxobutanoic acid Chemical compound COC(=O)CC(=C)C(O)=O OIYTYGOUZOARSH-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- RBNPOMFGQQGHHO-UWTATZPHSA-N D-glyceric acid Chemical compound OC[C@@H](O)C(O)=O RBNPOMFGQQGHHO-UWTATZPHSA-N 0.000 description 1
- IEPRKVQEAMIZSS-UHFFFAOYSA-N Di-Et ester-Fumaric acid Natural products CCOC(=O)C=CC(=O)OCC IEPRKVQEAMIZSS-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- IEPRKVQEAMIZSS-WAYWQWQTSA-N Diethyl maleate Chemical compound CCOC(=O)\C=C/C(=O)OCC IEPRKVQEAMIZSS-WAYWQWQTSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- XLYMOEINVGRTEX-ARJAWSKDSA-N Ethyl hydrogen fumarate Chemical compound CCOC(=O)\C=C/C(O)=O XLYMOEINVGRTEX-ARJAWSKDSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 235000013361 beverage Nutrition 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- FSRYENDEMMDKMT-UHFFFAOYSA-N butoxy ethaneperoxoate Chemical compound CCCCOOOC(C)=O FSRYENDEMMDKMT-UHFFFAOYSA-N 0.000 description 1
- HAISMSJTPGJFIP-UHFFFAOYSA-N butyl 4-tert-butyl-4,5,5-trimethylhexaneperoxoate Chemical compound CCCCOOC(=O)CCC(C)(C(C)(C)C)C(C)(C)C HAISMSJTPGJFIP-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- SPTHWAJJMLCAQF-UHFFFAOYSA-M ctk4f8481 Chemical compound [O-]O.CC(C)C1=CC=CC=C1C(C)C SPTHWAJJMLCAQF-UHFFFAOYSA-M 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- ZEFVHSWKYCYFFL-UHFFFAOYSA-N diethyl 2-methylidenebutanedioate Chemical compound CCOC(=O)CC(=C)C(=O)OCC ZEFVHSWKYCYFFL-UHFFFAOYSA-N 0.000 description 1
- CIKJANOSDPPCAU-UHFFFAOYSA-N ditert-butyl cyclohexane-1,4-dicarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1CCC(C(=O)OOC(C)(C)C)CC1 CIKJANOSDPPCAU-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- XLYMOEINVGRTEX-UHFFFAOYSA-N fumaric acid monoethyl ester Natural products CCOC(=O)C=CC(O)=O XLYMOEINVGRTEX-UHFFFAOYSA-N 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- VLKZOEOYAKHREP-UHFFFAOYSA-N hexane Substances CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000012770 industrial material Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- FSQQTNAZHBEJLS-UPHRSURJSA-N maleamic acid Chemical compound NC(=O)\C=C/C(O)=O FSQQTNAZHBEJLS-UPHRSURJSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 150000004972 metal peroxides Chemical class 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- OJURWUUOVGOHJZ-UHFFFAOYSA-N methyl 2-[(2-acetyloxyphenyl)methyl-[2-[(2-acetyloxyphenyl)methyl-(2-methoxy-2-oxoethyl)amino]ethyl]amino]acetate Chemical compound C=1C=CC=C(OC(C)=O)C=1CN(CC(=O)OC)CCN(CC(=O)OC)CC1=CC=CC=C1OC(C)=O OJURWUUOVGOHJZ-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pentâ4âenâ2âone Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000000864 peroxy group Chemical group O(O*)* 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005606 polypropylene copolymer Polymers 0.000 description 1
- 229920005629 polypropylene homopolymer Polymers 0.000 description 1
- LLLCSBYSPJHDJX-UHFFFAOYSA-M potassium;2-methylprop-2-enoate Chemical compound [K+].CC(=C)C([O-])=O LLLCSBYSPJHDJX-UHFFFAOYSA-M 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229940047670 sodium acrylate Drugs 0.000 description 1
- SONHXMAHPHADTF-UHFFFAOYSA-M sodium;2-methylprop-2-enoate Chemical compound [Na+].CC(=C)C([O-])=O SONHXMAHPHADTF-UHFFFAOYSA-M 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- VEQHTYHLJYNSTG-UHFFFAOYSA-N tert-butyl 9-tert-butylperoxy-9-oxononanoate Chemical compound CC(C)(C)OOC(=O)CCCCCCCC(=O)OC(C)(C)C VEQHTYHLJYNSTG-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tertâbutyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000005028 tinplate Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- WCAGGTLUGWSHOV-UHFFFAOYSA-N tris(tert-butylperoxy)-ethenylsilane Chemical compound CC(C)(C)OO[Si](OOC(C)(C)C)(OOC(C)(C)C)C=C WCAGGTLUGWSHOV-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Description
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ãç©å±€ç©ã®è£œé æ¹æ³ã«é¢ãããDETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for producing a laminate comprising a polypropylene resin and a metal.
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ããšããåé¡ãçããã It is a laminate of synthetic resin and metal, and is widely used by taking advantage of the characteristics of each. For example, by coating the surface of a metal molded article with a synthetic resin thin film, corrosion and rusting of the metal can be prevented. In addition, the metal sandwich panel, which has a synthetic resin sheet between two metal thin films, has a metal surface, is light as a synthetic resin, and has far superior mechanical properties than molded products made of synthetic resin alone. It has heat resistance and heat resistance, making it possible to reduce weight and cost by using it as, for example, automobile parts. Polypropylene has the lowest specific gravity among synthetic resins, has excellent mechanical properties such as rigidity and heat resistance, and is inexpensive.Therefore, there has been a strong demand for lightweight and low-cost automobiles, and it has become popular in metal sandwich panels. Studies are underway as an intermediate layer resin. However, since polypropylene is nonpolar, it exhibits almost no adhesion to metals, and as it is, it is not possible to obtain a laminate that firmly adheres to metals. Conventionally, in order to improve adhesion, surface treatments such as corona discharge treatment, chromic acid treatment, flame treatment, and etching are applied to the surface of polypropylene and/or metal, and modified polyolefins, which are polyolefins grafted with maleic anhydride, have been used. methods (e.g., Japanese Patent Publication Nos. 10757/1982 and 4822), methods using compositions in which acid-modified polyolefin is blended with synthetic hydrocarbon elastomers and ethylene polymers (e.g., Japanese Patent Publication Nos. 80334/1983, 56-21850) are known. However, when the polypropylene/metal laminate produced by these methods reaches a temperature above the melting point of polypropylene,
It easily deforms due to its own weight or external force, resulting in a problem of poor high-temperature heat resistance.
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ã補é ããããšã¯æ®ãã©äžå¯èœã§ããã It is generally well known that by crosslinking polymeric substances, melt deformation resistance and high temperature heat resistance are greatly improved. However, polypropylene is a thermally decomposable polymer, and when mixed with an organic peroxide and heated, crosslinking does not occur, but on the contrary, it decomposes and its viscosity decreases. Therefore, in order to thermally crosslink polypropylene, a method has been adopted in which a crosslinking aid such as divinylbenzene or liquid 1,2 polybutadiene is mixed with a radical generator and heated. However, the crosslinked polypropylene obtained in this way not only does not adhere to metal at all, but it is extremely difficult to form it into a film or sheet, for example, and it is almost impossible to use it to produce a laminate with metal. It's impossible.
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ãç©å±€ç©ã®è£œé æ¹æ³ãæäŸãããã The inventors of the present invention have conducted intensive studies on a method for producing a polypropylene/metal laminate with good high-temperature resistance, and have developed the present invention by using a specified organic peroxide on modified polypropylene and press-bonding it under specific conditions. I was able to complete it. That is, the present invention provides a composition comprising a modified polypropylene partially or entirely grafted with unsaturated carboxylic acids, a crosslinking aid, and an organic peroxide whose 1-minute half-life temperature is 10° C. or more higher than the melting point of the modified polypropylene. A polypropylene resin that presses an object and a metal at a temperature higher than the melting point of the modified polypropylene and lower than the one-minute half-life temperature of the organic peroxide, and then heated to a temperature equal to or higher than the one-minute half-life temperature of the organic peroxide. This is a method for manufacturing a laminate including a layer and a metal layer. According to the present invention, the polypropylene composition is formed into, for example, a film or a sheet (collectively referred to as a sheet-like material) at a temperature lower than the 1-minute half-life temperature of the organic peroxide, and then the metal and the organic Also provided is a method for producing a laminate in which the laminate is press-bonded at a temperature equal to or higher than the 1-minute half-life temperature of peroxide.
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æäœäžç°¡äŸ¿ã§ãããã奜ãŸããçšããããã The modified polypropylene used in the present invention can be obtained by grafting unsaturated carboxylic acids onto polypropylene by any method. The content of graft unsaturated carboxylic acids in the modified polypropylene is generally preferably from 0.005 to 5% by weight. The content of graft unsaturated carboxylic acids is
If it is less than 0.005% by weight, the adhesive strength with metal will be weak, and if it exceeds 5% by weight, not only will the manufacturing cost increase, but the adhesive strength will reach saturation. Methods for producing modified polypropylene include, for example, a method of reacting in a molten state (for example, Japanese Patent Publication No. 43-27421);
A method of reacting in a solution state (for example,
15422), a method of reacting in a slurry state (for example, Japanese Patent Publication No. 18144-1977), and a method of reacting in a gas phase (for example, Japanese Patent Application Publication No. 77493-1987).
Among these methods, the melt-kneading method using an extruder is preferred because it is easy to operate.
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ãå€åããããäžè¬ã«130ã170âã®ç¯å²ã«ããã The polypropylene used to produce modified polypropylene is not particularly limited, and includes homopolypropylene, propylene-ethylene block copolymer, propylene-ethylene random copolymer, copolymer of propylene and α-olefin,
and mixtures thereof are used. Among these, propylene-ethylene random copolymers and propylene-ethylene block copolymers are particularly preferably used. The melting point of these polypropylenes varies depending on the tacticity and comonomer content, but is generally in the range of 130 to 170°C.
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žãçšããã®ãæã奜ãŸããã Examples of unsaturated carboxylic acids used to produce modified polypropylene include acrylic acid, methacrylic acid, maleic acid, fumaric acid, itaconic acid, citraconic acid, and their acid anhydrides, esters, amides, imides, Metal salts, such as maleic anhydride, citraconic anhydride, itaconic anhydride, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, butyl acrylate, butyl methacrylate, glycidyl acrylate, glycidyl methacrylate,
Maleic acid monoethyl ester, maleic acid diethyl ester, pumalic acid monomethyl ester, pumalic acid dimethyl ester, itaconic acid monomethyl ester, itaconic acid diethyl ester, acrylamide, methacrylamide, maleic acid monoamide, maleic acid diamide, maleic acid N-mono Ethylamide, maleic acid-N,N-diethylamide, maleic acid-N-monobutylamide, maleic acid-N,N-dibutylamide, fumaric acid monoamide, fumaric acid diamide, fumaric acid-N-monoethylamide, fumaric acid -N,N-diethylamide, fumaric acid-N-monobutylamide, fumaric acid-N,N-dibutylamide, maleimide, N-
Butylmaleimide, N-phenylmaleimide, sodium acrylate, sodium methacrylate,
Examples include potassium acrylate and potassium methacrylate. Among these, it is most preferable to use maleic anhydride.
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It may contain heat stabilizers, weather stabilizers, lubricants, antistatic agents, nucleating agents, pigments, dyes, flame retardants, antiblocking agents, and the like.
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æ§ã®äœäžãèãã奜ãŸãããªãã The crosslinking aid used in the present invention is a compound having two or more double bonds in one molecule, such as a compound with a number average molecular weight of 500, containing divinylbenzene, diallyl phthalate, triallyl glycerate, or diene monomer as the main component. ~10000 liquid rubber, e.g. 1,
2-polybutadiene, 1,4-polybutadiene,
Styrene-butadiene copolymer, acrylonitrile-butadiene copolymer, or 1,2-polybutadiene having functional groups such as carboxyl group, hydroxyl group, mercapto group, halogen atom, amino group, aziridino group, and epoxy group in the molecule,
Examples include 1,4-polybutadiene, polyisoprene, polychloroprene, 1,2-polypentadiene, styrene-butadiene copolymer, acrylonitrile-butadiene copolymer, butadiene-isoprene copolymer, butadiene-pentadiene copolymer, and divinylbenzene and liquid 1,2 -Polybutadiene is preferably used. The amount of crosslinking aid added is based on modified polypropylene.
The amount is 1 to 50 parts by weight per 100 parts by weight, preferably 3 to 30 parts by weight per 100 parts by weight of modified polypropylene. If the amount of the crosslinking aid added is less than 1 part by weight, the effect of improving high temperature heat resistance will be small, and if it exceeds 50 parts by weight, the rigidity at temperatures below the melting point of the modified polypropylene will be significantly lowered, which is undesirable.
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ã奜ãŸãããªãã In the present invention, as an organic peroxide, the 1-minute half-life temperature (temperature at which it decomposes by half in 1 minute) is the melting point of modified polypropylene (the peak temperature of the endothermic curve measured with a differential scanning calorimeter at a heating rate of 10°C/min). Than
It is necessary to use a temperature higher than 10â. As mentioned above, the melting point of modified polypropylene is generally
Since the temperature is in the range of 130 to 170°C, an organic peroxide whose half-life temperature in 1 minute is generally 140°C or higher is used. Examples of such organic peroxides include 2,
4,4-trimethylpentyl-2-hydroperoxide, diisopropylbenzene hydroperoxide, cumene hydroperoxide,
t-Butyl hydroperoxide, dicumyl peroxide, 2,5-dimethyl-2,5-di-
(t-butylperoxy)-hexane, 1,3-bis-(t-butylperoxy-isopropyl)-benzene, t-butylcumyl peroxide, di-
t-Butyl peroxide, 2,5-dimethyl-
2,5-di-(t-butylperoxy)-hexyne-3.1,1-di-t-butylperoxy-3,
3,5-trimethylcyclohexane, 1,1-di-t-butylperoxycyclohexane, 2,2
-di-(t-butylperoxy)-butane, 4,4
-di-t-butylperoxyvaleric acid-n-butyl ester, di-t-butylperoxy-hexahydroterephthalate, di-t-butylperoxyazelate, t-butylperoxy-3,5, 5-Tolumethylhexoate, t-
These include butyl peroxyacetate, t-butylperoxybenzoate, t-butylperoxyisopropyl carbonate, succinic acid peroxide, vinyltris-(t-butylperoxy)silane, and the like. The amount of organic peroxide added varies depending on the amount of crosslinking aid added, but is generally preferably 0.1 to 10 parts by weight per 100 parts by weight of modified polypropylene. If the amount of organic peroxide added is less than 0.1 parts by weight, the degree of crosslinking will be low, and if it exceeds 10 parts by weight, decomposition will occur and the effect of improving high temperature heat resistance will be small, which is not preferable.
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ããã In the present invention, a polypropylene composition is obtained by mixing the above-described modified polypropylene, a crosslinking aid, an organic peroxide, and, if necessary, unmodified polypropylene, other polymeric substances other than polypropylene, fillers, and other additives. Mixing is carried out using a tumbler blender, a V-type blender, a Henschel mixer, a ribbon mixer, or the like. In some cases, the mixture may be melt-kneaded using a screw extruder, mixing roll, Banbury mixer, etc. at a temperature higher than the melting point of the modified polypropylene and lower than the 1-minute half-life temperature of the organic peroxide.
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ããããšãã§ããã In the present invention, in order to laminate the modified polypropylene composition and metal with good adhesion, it is important to press the composition at a temperature that is higher than the melting point of the modified polypropylene and lower than the 1-minute half-life temperature of the organic peroxide.
Next, in the present invention, in order to impart high temperature heat resistance to the pressed laminate, it is extremely important to heat it to a temperature equal to or higher than the one-minute half-life temperature of the organic peroxide.
The heating time varies depending on the decomposition temperature of the organic peroxide, but generally 10 seconds to 30 minutes is appropriate. Heating can be performed by once cooling the laminate to room temperature and then reheating it, or by heating the laminate successively after thermocompression bonding of the laminate.
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ããšãå¯èœã§ããã In addition, the present invention involves forming the modified polypropylene composition in advance into a sheet shape at a temperature lower than the one-minute half-life temperature of the organic peroxide, and then heating it all at once at a temperature higher than the one-minute half-life temperature of the metal and organic peroxide. It is also possible to press it.
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ã³ã¢ã«ãããŠã ã奜ãŸãã䜿çšãããã There are no particular restrictions on the metals used for lamination; iron, aluminum, chromium, nickel, gold,
Examples include silver, copper, magnesium, zinc, tin, lead, steel, stainless steel, galvanized iron, and tinplate, with iron and aluminum being preferably used.
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ã«å©çšããããšãã§ããã The polypropylene/metal laminate obtained in the above manner has strong adhesive strength between the two, excellent high-temperature heat resistance, and has both the excellent characteristics of polypropylene and the excellent characteristics of metal. It also has excellent new features that other manufacturers do not have, making it suitable for automobile materials, industrial materials,
It can be effectively used as building materials, beverage cans, packaging materials for various foods, etc.
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æã¯ãããã«éå®ããããã®ã§ã¯ãªãã Examples of the laminate of the present invention are shown below, but the present invention is not limited thereto.
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ããã In Examples, the adhesive strength and high temperature heat resistance of the obtained laminates were measured by the following methods.
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ãè¡ãªã€ãã Adhesive strength is measured between two 2cm wide metal sheets.
It is expressed as T-peel strength of a three-layer laminate with a layer of modified polypropylene composition 0.1 mm thick. The measurement is
The test was carried out at 23°C and 50% RH at a tensile speed of 20 mm/min.
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ãã The measurement of high temperature heat resistance was carried out between two metal sheets facing each other so that the overlap length was 2 cm.
A three-layer laminate with a modified polypropylene composition layer of 0.1 mm thickness was placed in an oven at 200°C, one metal sheet was suspended by a wire, and after 10 minutes, a load of 200 g was applied to the lower metal sheet, and both metal sheets were suspended. It is expressed as the time until the sheet separates. The thickness of the metal sheets is 0.2 mm for the iron sheet and 0.1 mm for the aluminum sheet, and these are sufficiently degreased.
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žãã°ã©ããå«æããŠãããExample 1 MFI=0.6 g/10 min, 100 parts by weight of propylene-ethylene random copolymer with ethylene content of 2.0% by weight, 2 parts by weight of maleic anhydride, 2,5-dimethyl-2,5-di(t-butyl) (peroxy)-hexane 0.12 parts by weight, butylated hydroxytoluene 0.1
Part by weight and 0.1 part by weight of calcium stearate were mixed in a Henschel mixer for 5 minutes, and L/D = 24.
Melt-kneading pelletization was performed at 220° C. using a 40 mmÏ extruder, and then heat treatment was performed at 145° C. for 4 hours using a constant temperature dryer to obtain modified polypropylene. This modified polypropylene contained 0.5% by weight of maleic anhydride grafted therein.
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ã«ãã165âã§åã0.1mmã®ã·ãŒãã補èããã 15 parts by weight of this modified polypropylene, MFI=4.0
g/10 min, unmodified propylene-ethylene random copolymer with ethylene content of 3.0% by weight (melting point 140
°C) 85 parts by weight, divinylbenzene 10 parts by weight, dicumyl peroxide (1 minute half-life temperature 179 °C) 2.0
Part by weight, 0.1 part by weight of butylated hydroxytoluene, and 0.1 part by weight of calcium stearate were mixed in a Henschel mixer for 5 minutes, and a sheet with a thickness of 0.1 mm was formed at 165°C using an extruder equipped with a T-die.
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éã«ã¯ãã¿ã170âã®æž©åºŠ10KgïŒcm2ã®å§åã§ïŒå
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7.5KgïŒïŒcmãé«æž©èç±æ§ã¯ïŒæé以äžã§ãã€
ãã This sheet was sandwiched between 2 cm wide aluminum sheets and pressed together at a temperature of 170° C. and a pressure of 10 kg/cm 2 for 5 minutes, and then heated at 220° C. for 5 minutes. The adhesive strength of the laminate thus obtained is
7.5Kg/2cm, high temperature heat resistance was over 1 hour.
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ã¬ãŒã¯ç¶ã«ãªãã·ãŒããåŸãããªãã€ããComparative Example 1 The same procedure as in Example 1 was conducted except that benzoyl peroxide (1 minute half-life temperature: 130° C.) was used instead of dicumyl peroxide. When extruding a sheet, the extrudate became flaky and no sheet could be obtained.
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ã¯ãã¬ãŒã¯ç¶ã«ãªããã·ãŒããåŸãããªãã€ããComparative Example 2 The same procedure as in Example 1 was carried out except that the sheet extrusion temperature was changed to 220°C. The extrudate became flaky and no sheet was obtained.
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ããComparative Example 3 The same procedure as in Example 1 was conducted except that modified polypropylene was not added and 100 parts by weight of unmodified propylene-ethylene random copolymer was used. The adhesive strength of the obtained laminate was 0.
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é«æž©èç±æ§ã¯50ç§ã§ãã€ããComparative Example 4 The same procedure as in Example 1 was carried out except that dicumyl peroxide was not added. The adhesive strength of the obtained laminate was 0.5Kg/2cm.
High temperature heat resistance was 50 seconds.
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匷床ã¯1.8KgïŒïŒcmãé«æž©èç±æ§ã¯90ç§ã§ãã€
ããComparative Example 5 The same procedure as in Example 1 was carried out except that divinylbenzene and dicumyl peroxide were not added. The resulting laminate had an adhesive strength of 1.8 kg/2 cm and a high temperature resistance of 90 seconds.
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å®æœäŸïŒã«ãããŠåŸãå€æ§ããªãããã¬ã³15é
ééšãMFIïŒ1.5ïœïŒ10åããšãã¬ã³å«é2.7éé
ïŒ
ã®æªå€æ§ãããã¬ã³ãšãã¬ã³ãããã¯å
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ïŒèç¹160âïŒ85éééšãå¹³åç²ååŸ1.2ÎŒã®çé
ž
ã«ã«ã·ãŠã 40éééšãæ°å¹³åååé1000ã®æ¶²ç¶
ïŒïŒïŒâããªãã¿ãžãšã³20éééšãïŒïŒïŒâãžã¡
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ãã·ã³âïŒïŒïŒåéåæžæž©åºŠ193âïŒïŒéééšã
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žã«ã«ã·ãŠã 0.1éééšããã³ã·ãšã«ãããµ
ãŒã§ïŒåéæ··åããCCMæŒåºæ©ã«ãã170âã§æº¶
èæ··ç·Žãã¬ã¿ã€ãºãè¡ãªã€ããåŸãããå€æ§ããª
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ã§175âã§åã0.1mmã®ã·ãŒãã補èãããExample 2 15 parts by weight of modified polypropylene obtained in Example 1, MFI = 1.5 g/10 min, 85 parts by weight of unmodified propylene ethylene block copolymer with ethylene content of 2.7% by weight (melting point 160°C), average particle size 1.2 40 parts by weight of calcium carbonate of ÎŒ, 20 parts by weight of liquid 1,2-polybutadiene with a number average molecular weight of 1000, 2,5-dimethyl-2,5-di-(t-butylperoxy)-hexyne-3 (halved in 1 minute) temperature 193â) 3 parts by weight,
0.1 part by weight of butylated hydroxytoluene and 0.1 part by weight of calcium stearate were mixed for 5 minutes using a Henschel mixer, and then melt-kneaded and pelletized using a CCM extruder at 170°C. A sheet having a thickness of 0.1 mm was formed from the obtained modified polypropylene composition pellets at 175 DEG C. using an extruder equipped with a T-die.
ãã®ã·ãŒããïŒcmå¹
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220âã®æž©åºŠã10KgïŒcm2ã®å§åã§10åéå§çã
ãããã®ããã«ããŠåŸãããç©å±€ç©ã®æ¥ç匷床ã¯
13.5KgïŒïŒcmãé«æž©èç±æ§ã¯ïŒæé以äžã§ãã€
ãã Sandwich this sheet between 2cm wide iron sheets,
Pressure bonding was carried out at a temperature of 220°C and a pressure of 10 kg/cm 2 for 10 minutes. The adhesive strength of the laminate thus obtained is
13.5Kg/2cm, high temperature heat resistance was over 1 hour.
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奜ãªãã¬ãããåŸãããªãã€ããComparative Example 6 In Example 2, 2,5-dimethyl-2,5
The procedure of Example 2 was repeated except that benzoyl peroxide was used instead of -di-(t-butylperoxy)-hexyne-3. During pelletization using a CCM extruder, the extrudate became flaky and good pellets could not be obtained.
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å®æœäŸïŒã«ãããŠãã·ãŒãæŒåºæž©åºŠã220âã«
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ã¯ãã¬ãŒã¯ç¶ã«ãªããã·ãŒããåŸãããªãã€ããComparative Example 7 The same procedure as in Example 2 was carried out except that the sheet extrusion temperature was changed to 220°C. The extrudate became flaky and no sheet was obtained.
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ã€ããComparative Example 8 The same procedure as in Example 2 was carried out except that the modified polypropylene was not added and 100 parts by weight of the unmodified propylene-ethylene block copolymer was used. The adhesive strength of the obtained laminate was 0.
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é«æž©èç±æ§ã¯30ç§ã§ãã€ããComparative Example 9 In Example 2, 2,5-dimethyl-2,5
The same procedure as in Example 2 was carried out except that -di-(t-butylperoxy)-hexyne-3 was not added. The adhesive strength of the obtained laminate was 0.3Kg/2cm.
High temperature heat resistance was 30 seconds.
æ¯èŒäŸ 10
å®æœäŸïŒã«ãããŠã液ç¶ïŒïŒïŒâããªãã¿ãžãš
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ãã以å€ã¯å®æœäŸïŒãšåæ§ã«è¡ãªã€ããåŸããã
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120ç§ã§ãã€ããComparative Example 10 In Example 2, liquid 1,2-polybutadiene and 2,5-dimethyl-2,5-di-(t-
butylperoxy)-hexyne-3 is not added,
Other than that, the same procedure as in Example 2 was carried out. The adhesive strength of the obtained laminate was 9.7Kg/2cm, and the high temperature resistance was
It was hot in 120 seconds.
Claims (1)
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ãã10â以äžé«ãææ©éé žåç©ãšãããªãããªã
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ã³ã®èç¹ä»¥äžã§è©²ææ©éé žåç©ã®ïŒåéåæžæž©åºŠ
ããäœã枩床ã§å§çããåŸã該ææ©éé žåç©ã®ïŒ
åéåæžæž©åºŠä»¥äžã®æž©åºŠã«å ç±ããããšãç¹åŸŽãš
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ç©å±€ç©ã®è£œé æ¹æ³ã ïŒ ç©å±€ç©ãéå±å±€ïŒããªãããã¬ã³æš¹è系局ïŒ
éå±å±€ã§ããç¹èš±è«æ±ã®ç¯å²ç¬¬ïŒé èšèŒã®è£œé æ¹
æ³ã ïŒ äžé£œåã«ã«ãã³é žé¡ãç¡æ°Žãã¬ã€ã³é žã§ãã
ç¹èš±è«æ±ã®ç¯å²ç¬¬ïŒé èšèŒã®è£œé æ¹æ³ã ïŒ æ¶æ©å©å€ã液ç¶ïŒïŒïŒâããªãã¿ãžãšã³ãŸã
ã¯ãžããã«ãã³ãŒã³ã§ããç¹èš±è«æ±ã®ç¯å²ç¬¬ïŒé
èšèŒã®è£œé æ¹æ³ã ïŒ éå±ãéãŸãã¯ã¢ã«ãããŠã ã§ããç¹èš±è«æ±
ã®ç¯å²ç¬¬ïŒé èšèŒã®è£œé æ¹æ³ã ïŒ ããªãããã¬ã³çµæç©ããææ©éé žåç©ã®ïŒ
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ãšããŠçšããç¹èš±è«æ±ã®ç¯å²ç¬¬ïŒé èšèŒã®è£œé æ¹
æ³ã[Claims] 1 Consists of a modified polypropylene partially or wholly grafted with unsaturated carboxylic acids, a crosslinking aid, and an organic peroxide whose 1-minute half-life temperature is 10°C or more higher than the melting point of the modified polypropylene. After pressing the polypropylene composition and the metal at a temperature higher than the melting point of the modified polypropylene and lower than the 1-minute half-life temperature of the organic peroxide, 1 of the organic peroxide is
A method for producing a laminate comprising a polypropylene resin layer and a metal layer, the method comprising heating to a temperature equal to or higher than the half-life temperature for minutes. 2 The laminate is a metal layer/polypropylene resin layer/
The manufacturing method according to claim 1, which is a metal layer. 3. The manufacturing method according to claim 1, wherein the unsaturated carboxylic acid is maleic anhydride. 4. The manufacturing method according to claim 1, wherein the crosslinking aid is liquid 1,2-polybutadiene or divinylbenzene. 5. The manufacturing method according to claim 1, wherein the metal is iron or aluminum. 6 The polypropylene composition was treated with organic peroxide.
The manufacturing method according to claim 1, which is used as a sheet-like product formed at a temperature lower than the half-life temperature in minutes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56165680A JPS5867445A (en) | 1981-10-19 | 1981-10-19 | Manufacture of laminate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56165680A JPS5867445A (en) | 1981-10-19 | 1981-10-19 | Manufacture of laminate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5867445A JPS5867445A (en) | 1983-04-22 |
JPS6223656B2 true JPS6223656B2 (en) | 1987-05-25 |
Family
ID=15816992
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56165680A Granted JPS5867445A (en) | 1981-10-19 | 1981-10-19 | Manufacture of laminate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5867445A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002326311A (en) * | 2000-03-30 | 2002-11-12 | Atofina | Structure comprising binder layer non-delaminable with respect to metallized substrate and peelable with respect to polypropylene substrate |
-
1981
- 1981-10-19 JP JP56165680A patent/JPS5867445A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002326311A (en) * | 2000-03-30 | 2002-11-12 | Atofina | Structure comprising binder layer non-delaminable with respect to metallized substrate and peelable with respect to polypropylene substrate |
JP4620278B2 (en) * | 2000-03-30 | 2011-01-26 | ã¢ã«ã±ã ãã©ã³ã¹ | A structure containing a binder layer that cannot be peeled off from a metallized substrate and can be peeled off from a polypropylene substrate |
Also Published As
Publication number | Publication date |
---|---|
JPS5867445A (en) | 1983-04-22 |
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