JPS62235735A - Organic film coating device - Google Patents

Abstract

PURPOSE:To upgrade the bonding property of an organic film to a semiconductor substrate by a method wherein a coating device is provided with a heating function and cooling function while an organic agent is dripped down so that the spin-coating of the drips and the heattreatment of the coated organic film may he performed in the same device. CONSTITUTION:A semiconductor substrate 103 mounted on a disc 101 is suction- held by vacuum 102 not to be let off by the turning of disc 101. The disc 101 heated by a heater 105 and a reflecting mirror 107 can be cooled down as soon as the semiconductor substrate 103 heated before and sfter it is coated with an organic film is coated with an organic film or removed after being processed by a cooling system supplying cooling water from pipes 109 to be drained from a drain pipe 110. Furthermore, a turning axle 111 integrated with the disc 101 directly connected to a motor is insertion-coupled with a coupling part 112 sealed with grease etc. so that the disc 101 may be turned without fail by driving the motor.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to semiconductor manufacturing equipment, and particularly to an organic film spin coating equipment.

[Conventional technology]

Conventionally, this type of apparatus has merely had the function of spin-coating an organic film, and a separate apparatus has been used for heat treatment required before and after applying the organic film. For example, a heat treatment furnace is used, or a semiconductor substrate is transported by a belt, and heat treatment is performed using infrared rays or the like while the semiconductor substrate is being transported.

[Problem that the invention seeks to solve]

Generally, when applying an organic film onto a semiconductor substrate, it is necessary to remove moisture from the surface of the semiconductor substrate in order to improve the adhesion between the semiconductor substrate and the organic film.

Therefore, the substrate is heated to about 208° C. before the organic agent is dropped onto the substrate and spin-coated. Furthermore, after spin-coating the organic film, in order to remove the solvent contained in the organic agent, it is necessary to heat the semiconductor substrate to evaporate the solvent.

If the above-mentioned function was to simply spin-coat an organic film, a heating device would be required in addition to the spin-coating device to carry out the above-mentioned heating process. Therefore, the semiconductor substrate must be moved from the heating device to the spin coating device, and during the movement, there is a high probability that dust will adhere to the semiconductor substrate, which becomes a cause of a decrease in yield. Further, since the heating device is used for water evaporation or solvent evaporation, it takes about 10 to 30 minutes, and therefore, if a heating belt is used, it requires a length of about 2 m. This requires more floor space to maintain cleanliness, which is disadvantageous in terms of maintenance costs and efficient use of the floor. Furthermore, since the adhesion between the organic film and the substrate deteriorates over time after heat treatment before spin coating, it is necessary to quickly spin coat after heat treatment. Therefore, transferring the coating to a separate spin coating device after heating will degrade the adhesion.

[Means for solving problems]

The spin coating device of the present invention is equipped with a heating function and a cooling function in the coating device so that the organic agent is dropped and the spin coating and heat treatment of the applied organic film are performed in the same device.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a drawing of one embodiment of the present invention. First, disk 10
A semiconductor substrate is placed on 1, and a vacuum 10 is applied to hold it.
2 from the center, and then make an opening 1 on the surface of the disk 101.
Pass it to 04. As a result, the semiconductor substrate placed on the disk 101 is held by the vacuum and does not come off due to the rotation of the disk 101. Next, the infrared heater 105 is connected to the disk 1.
01 is connected to an electrode 106. Furthermore, the reflector 1 is heated so that the semiconductor substrate on the disk 101 is heated uniformly.
07 is placed on top of the heater 105.

Note that a plurality of heating heaters 105 may be used to raise the temperature to about 200°C. In this example, four tubes were prepared, and the pre-coating heating was 200° C., so four of them were energized, and the post-coating heating was 120° C., and two were energized.

Due to its specific heat, the disk 101 heated by the heating heater 105 requires a cooling function in order to be instantly cooled. Therefore, the three-layer pipe 10 made in the same circular shape
Cooling water can flow through the two outside of the 8. That is, cooling water is supplied from the cooling water supply pipe 109 and discharged from the discharge pipe 110. With this cooling device, a semiconductor substrate heated before and after coating can be quickly cooled down when applying an organic film or when removing the substrate after processing.

Note that the rotating shaft 111 directly connected to the motor is a disc 10.
With this structure, in which the connecting portion 112 is connected by fitting into the shaft 108 that is integrated with the disk 108 and is sealed with grease or the like, the disk 101 can be rotated without any problem when the motor rotates.

〔Effect of the invention〕

As explained above, since the present invention integrates a spin coating device and a heating device, first, after heating, spin coating can be performed immediately, and the adhesion between the semiconductor substrate and the organic film can be significantly improved. I can do it.

Also, as mentioned above, since the heating device is integrated,
Unlike conventional heating devices, this does not require a heating device and saves floor area with high cleanliness. Furthermore, unlike the conventional method, when a semiconductor substrate is transferred from a heating device to a spin coating device, or from a spin coating device to a heating device, the probability of dust being generated or attached can be reduced, and an improvement in yield can be expected.

In this embodiment, an infrared heater is used for heating, but other heating methods such as microwaves can also be used to obtain similar effects.

[Brief explanation of drawings]

FIG. 1 is a sectional view for explaining the present invention in detail. 101-... Disc, 102, 103-... Vacuum piping, 105... Infrared heater, 107.
...Reflector, 109.110...Cooling water piping. easy f flash

Claims (2)

[Claims] (1) An organic film coating apparatus for spin-coating an organic film onto a semiconductor substrate, which indirectly heats a rotating disc that holds the substrate. (2) The organic film coating apparatus according to claim (1), wherein the rotating disk can be cooled.