JPS6223520B2 - - Google Patents
Info
- Publication number
- JPS6223520B2 JPS6223520B2 JP53063413A JP6341378A JPS6223520B2 JP S6223520 B2 JPS6223520 B2 JP S6223520B2 JP 53063413 A JP53063413 A JP 53063413A JP 6341378 A JP6341378 A JP 6341378A JP S6223520 B2 JPS6223520 B2 JP S6223520B2
- Authority
- JP
- Japan
- Prior art keywords
- matching layer
- filler
- acoustic impedance
- ultrasonic probe
- mixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 16
- 239000000945 filler Substances 0.000 claims description 15
- 239000000523 sample Substances 0.000 claims description 13
- 239000000843 powder Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 229920001187 thermosetting polymer Polymers 0.000 claims description 7
- 229910044991 metal oxide Inorganic materials 0.000 claims description 6
- 150000004706 metal oxides Chemical class 0.000 claims description 6
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 claims description 5
- 229910001930 tungsten oxide Inorganic materials 0.000 claims description 5
- 238000004062 sedimentation Methods 0.000 claims description 3
- 230000002265 prevention Effects 0.000 claims 1
- 238000002604 ultrasonography Methods 0.000 description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000008119 colloidal silica Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/02—Mechanical acoustic impedances; Impedance matching, e.g. by horns; Acoustic resonators
Description
【発明の詳細な説明】
本発明は音響インピーダンスを整合するための
音響整合層をもつた超音波探触子の改良に関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in an ultrasound probe having an acoustic matching layer for matching acoustic impedance.
超音波は種々な分野で広く利用されている。超
音波を発振したり受振したりする超音波探触子と
超音波の被放射体との間における超音波の送受を
効率よく行うためには両者の音響インピーダンス
を整合（マツチング）する必要がある。このため
一般に超音波探触子には音響整合層が設けられて
いる。 Ultrasound is widely used in various fields. In order to efficiently transmit and receive ultrasonic waves between an ultrasonic probe that emits and receives ultrasonic waves and an object to which ultrasonic waves are radiated, it is necessary to match the acoustic impedance of both. . For this reason, ultrasound probes are generally provided with an acoustic matching layer.
一般に使用されている超音波探触子を、診断用
の電子走査形超音波探触子を一例として説明す
る。第１図および第２図において、振動子１の対
向面に電極２，３を設けて構成した複数個の振動
素子４，……がゴムなどからなる超音波吸収体５
上に相互に離間して接着されていて、電極２側に
は音響整合層６が設けられている。そして各電極
２，……３，……はそれぞれパルス発振装置（図
示しない）に接続されていて、この超音波探触子
を例えば人体に当て各振動素子４毎に走査するよ
うにパルス状の超音波の発振、受振を順次行な
い、それらの反射波から人体内部の状態を探知す
る。上記の音響整合層６（以下整合層と称す）は
振動素子４と人体との音響インピーダンスを整合
するためのものである。一般に整合層６は、種々
の構成のものがあるが、ガラス板やプラスチツク
シートなどを貼り合わせて形成した多種構造のも
のや、熱硬化性樹脂に充填材としてタングステン
粉末を混合した材料を振動素子１上に塗布硬化し
て構成されたものなどがある。音響インピーダン
スは音速と密度との積で表わされるが、熱硬化性
樹脂にタングステン粉末を混合した材料は、タン
グステンの密度が大きいため、大きい音響インピ
ーダンスが得られ、また混合比を変えることによ
り広範囲に所望の音響インピーダンスを得ること
ができる。このため充填材としてタングステン粉
末を混合した整合層は広く利用されているが、タ
ングステン自体が導電体であるため、これを混合
したエポキシ樹脂も導電性を有するのである。従
つて第１図、第２図に示したような構成の超音波
装置は振動素子４のアース側電極２，……上にの
み整合層６が設けられている場合は問題はない
が、各振動素子４……間の溝７とか電極２，３間
に付着した場合は短絡してしまい、実用に供し得
ないことになる。このような導電性の材料で整合
層６を形成する場合は上述の短絡を防止するため
上記の短絡を起す部分を絶縁性の材料で予め処理
しなければならず、整合層形成のため余計な絶縁
工程を必要とする不都合があつた。また樹脂と充
填材との比重の差が大きいため加工中とかく充填
材が沈澱するため所望の均一な整合層が得られな
いという不都合もあつた。 A commonly used ultrasound probe will be described using an electronic scanning ultrasound probe for diagnosis as an example. In FIGS. 1 and 2, a plurality of vibrating elements 4, each having electrodes 2, 3 provided on opposing surfaces of a vibrator 1, are an ultrasonic absorber 5 made of rubber or the like.
An acoustic matching layer 6 is provided on the electrode 2 side. Each of the electrodes 2,...3,... is connected to a pulse oscillator (not shown), and the ultrasonic probe is applied to a human body, for example, and pulsed pulses are generated so as to scan each vibrating element 4. Ultrasonic waves are sequentially emitted and received, and the internal state of the human body is detected from the reflected waves. The above acoustic matching layer 6 (hereinafter referred to as matching layer) is for matching the acoustic impedance between the vibration element 4 and the human body. In general, the matching layer 6 has various configurations, including those formed by laminating glass plates, plastic sheets, etc., and those made of a material made of a thermosetting resin mixed with tungsten powder as a filler. There are some that are constructed by coating and curing on top of No. 1. Acoustic impedance is expressed as the product of sound velocity and density, but materials made by mixing tungsten powder with thermosetting resin have a high tungsten density, so a large acoustic impedance can be obtained, and it can be applied over a wide range by changing the mixing ratio. A desired acoustic impedance can be obtained. For this reason, matching layers mixed with tungsten powder as a filler are widely used, but since tungsten itself is a conductor, the epoxy resin mixed with it also has conductivity. Therefore, in the ultrasonic device having the configuration shown in FIGS. 1 and 2, there is no problem if the matching layer 6 is provided only on the ground side electrode 2, . . . of the vibrating element 4, but each If it adheres to the groove 7 between the vibrating elements 4 or between the electrodes 2 and 3, it will cause a short circuit and cannot be put to practical use. When forming the matching layer 6 with such a conductive material, in order to prevent the above-mentioned short circuit, the part that causes the above-mentioned short circuit must be treated with an insulating material in advance, and unnecessary material is required to form the matching layer. This had the disadvantage of requiring an insulation process. Furthermore, since there is a large difference in specific gravity between the resin and the filler, the filler precipitates during processing, making it impossible to obtain a desired uniform matching layer.
本発明は、上述の不都合を除去するためになさ
れたもので、熱硬化性樹脂に充填材として非導電
性の金属酸化物を混合した材料で整合層を形成す
ることにより、不所望の短絡を防止した超音波探
触子である。 The present invention was made to eliminate the above-mentioned disadvantages, and by forming a matching layer of a material made of a thermosetting resin mixed with a non-conductive metal oxide as a filler, undesired short circuits can be prevented. This is an ultrasonic probe that has been prevented.
以下本発明の詳細を図示の実施例により説明す
る。なお本実施例は第１図、第２図に示した診断
用の超音波探触子と同様な構成をしており、整合
層の材料のみ異なるので整合層の材料についての
み記載する。第３図は本実施例に使用した材料に
関するもので、第３級アミンで硬化するエポキシ
樹脂に充填材として酸化タングステン粉末を種々
な割合で混合した場合の音響インピーダンスを示
すもので、横軸に充填材混合量を重量パーセント
（Wt％）でとり、縦軸に音響インピーダンスをと
つてある。なお充填材の沈澱を防止するため適量
のコロイダルシリカ粉末が混合されている。この
他の金属酸化物を充填材として用いた場合も重量
％で示すとほぼ同様な曲線で示される結果が得ら
れる。酸化タングステンの場合は９×106Kg／m2
secまでの音響インピーダンスが容易に得られ
る。一般に振動素子の音響インピーダンスを
ZQ、被放射媒体の音響インピーダンスをZF、厚
さをλ／４（λは波長）に形成した整合層６の音
響インピーダンスをZIとするZQ＝（ZI）2／（ZF）
の関係を満足するように整合層６の音響インピー
ダンスZIを設定すれば、最も送受効率がよい。い
ま振動素子４にPZT圧電振動やPbTiO3系圧電振
動子を用いた場合は、ZQは30×106Kg／m2sec〜
40×106Kg／m2secの範囲であり、被放射体が生体
や水中である場合はZF＝1.5×106Kg／m2sec
（水）とみなせるので、ZQ＝40×106Kg／m2secと
するとZI≒7.75×106Kg／m2secとなる。従つて酸
化タングステン粉末を約80Wt％混合した材料を
振動素子４上に塗布硬化させ、厚さλ／４に整合
層６を形成する。 The details of the present invention will be explained below with reference to illustrated embodiments. This embodiment has the same configuration as the diagnostic ultrasound probe shown in FIGS. 1 and 2, and only the material of the matching layer is different, so only the material of the matching layer will be described. Figure 3 relates to the materials used in this example, and shows the acoustic impedance when tungsten oxide powder is mixed in various proportions as a filler into an epoxy resin cured with tertiary amine. The amount of filler mixed is expressed in weight percent (Wt%), and the vertical axis is acoustic impedance. An appropriate amount of colloidal silica powder is mixed in to prevent the filler from settling. When other metal oxides are used as fillers, almost similar results are obtained when expressed in weight percent. For tungsten oxide, 9×10 6 Kg/m 2
Acoustic impedances up to sec can be easily obtained. In general, the acoustic impedance of a vibrating element is
ZQ = (ZI) 2 / (ZF) where ZQ is the acoustic impedance of the radiated medium and ZF is the acoustic impedance of the matching layer 6 formed with a thickness of λ/4 (λ is the wavelength).
If the acoustic impedance ZI of the matching layer 6 is set so as to satisfy the relationship, the transmission and reception efficiency is the best. If a PZT piezoelectric vibrator or a PbTiO 3 piezoelectric vibrator is used as the vibration element 4, ZQ is 30×10 6 Kg/m 2 sec~
The range is 40×10 6 Kg/m 2 sec, and if the radiated object is a living body or underwater, ZF=1.5×10 6 Kg/m 2 sec
(water), so if ZQ=40×10 6 Kg/m 2 sec, then ZI≒7.75×10 6 Kg/m 2 sec. Therefore, a material containing approximately 80 Wt% of tungsten oxide powder is applied onto the vibrating element 4 and hardened to form a matching layer 6 having a thickness of λ/4.
なお、本実施例においては、熱硬化性樹脂とし
てエポキシ樹脂を使用したがポリエステルその他
熱硬化性樹脂ならばよく、充填材も酸化金属なら
ばよい。また沈降防止にコロイダルシリカ粉末を
用いたがセライト粉末やカオリン粉末などを用い
ても同様な効果が得られる。 In this embodiment, an epoxy resin was used as the thermosetting resin, but any other thermosetting resin such as polyester may be used, and the filler may also be a metal oxide. Furthermore, although colloidal silica powder was used to prevent sedimentation, similar effects can be obtained by using celite powder, kaolin powder, or the like.
以上詳述したように、本発明の超音波装置は、
熱硬化性樹脂に充填材として非導電性の金属酸化
物粉末を混合した材料で整合層を形成したので、
整合層の材料は非導電性のため電極間に材料が介
在しても短絡することがなく、絶縁処理を予め施
す必要がないので、生産性、経済性および信頼性
などを向上させる効果を奏するものである。なお
本実施例のように沈降防止材を混入したものは重
量の大きい充填材の沈降が防止されるので特性の
均一な整合層を得ることができる。 As detailed above, the ultrasonic device of the present invention includes:
The matching layer was formed using a material consisting of thermosetting resin mixed with non-conductive metal oxide powder as a filler.
Since the material of the matching layer is non-conductive, there will be no short circuit even if there is material between the electrodes, and there is no need to perform insulation treatment in advance, which has the effect of improving productivity, economy, and reliability. It is something. It should be noted that when an antisedimentation material is mixed as in this embodiment, sedimentation of the heavy filler is prevented, so that a matching layer with uniform characteristics can be obtained.
第１図は従来の超音波探触子および本発明の一
実施例の概略の構成を示す正面図、第２図は同じ
く側面図、第３図はエポキシ樹脂に充填材として
酸化タングステン粉末を使用した場合の充填量と
音響インピーダンスとの関係を示す線図である。
４…振動素子、６…音響整合層。
Fig. 1 is a front view showing the general configuration of a conventional ultrasonic probe and an embodiment of the present invention, Fig. 2 is a side view of the same, and Fig. 3 is an epoxy resin using tungsten oxide powder as a filler. It is a diagram which shows the relationship between the filling amount and acoustic impedance in the case of. 4... Vibration element, 6... Acoustic matching layer.
Claims (1)
子において、上記音響整合層は熱硬化性樹脂に充
填材として金属酸化物の粉末を混合した材料で形
成されていることを特徴とする超音波探触子。 ２ 特許請求の範囲第１項に記載の材料の金属酸
化物は酸化タングステンであることを特徴とする
超音波探触子。 ３ 特許請求の範囲第１項または第２項のいずれ
かに記載の材料は充填材の沈降防止材が混合され
ていることを特徴とする超音波探触子。[Claims] 1. In an ultrasonic probe having an acoustic matching layer on a vibrating element, the acoustic matching layer is formed of a material made of a thermosetting resin mixed with metal oxide powder as a filler. An ultrasonic probe characterized by: 2. An ultrasonic probe characterized in that the metal oxide of the material according to claim 1 is tungsten oxide. 3. An ultrasonic probe characterized in that the material according to claim 1 or 2 is mixed with a sedimentation prevention material as a filler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6341378A JPS54155028A (en) | 1978-05-29 | 1978-05-29 | Ultrasonic probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6341378A JPS54155028A (en) | 1978-05-29 | 1978-05-29 | Ultrasonic probe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54155028A JPS54155028A (en) | 1979-12-06 |
| JPS6223520B2 true JPS6223520B2 (en) | 1987-05-23 |
Family
ID=13228570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6341378A Granted JPS54155028A (en) | 1978-05-29 | 1978-05-29 | Ultrasonic probe |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54155028A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4348904A (en) * | 1980-08-08 | 1982-09-14 | North American Philips Corporation | Acoustic impedance matching device |
| JPS6031397A (en) * | 1983-07-30 | 1985-02-18 | Terumo Corp | Ultrasonic wave probe |
| JPS60194700A (en) * | 1984-03-16 | 1985-10-03 | Toshiba Corp | Ultrasonic probe |
| JPS62133899A (en) * | 1985-12-06 | 1987-06-17 | Tokyo Keiki Co Ltd | Ultrasonic sensor |
-
1978
- 1978-05-29 JP JP6341378A patent/JPS54155028A/en active Granted
Non-Patent Citations (2)
| Title |
|---|
| DYEFYEKMOSKOPTSYA=1973 * |
| MECHANICAL DAMPER FOR ULTRASONIC PROBES * |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS54155028A (en) | 1979-12-06 |
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