JPS62232138A - Positioning apparatus for integrated circuit - Google Patents

Abstract

PURPOSE:To make it possible to mount an IC at a specified position on a circuit board highly accurately, by providing a means, which detects/measures the fine dispersion in the size of the individual IC, in a positioning apparatus itself. CONSTITUTION:An IC is held in a robot hand H. The IC is moved to a main positioning device L through a path (a). The IC is temporarily placed at a center O1, which is slightly deviated from a nominal cetral position (reference point) 0 of the nominal size of the IC. An air cylinder 8 is released, and a slider 4 is moved in the direction A with a spring 7. The IC is held with specified pressure in a orthogonal recess part 2. At this time, a lever 9 is turned around a supporting point axis together with the slider 4. A rotary encoder 14 is also turned. A position, which corresponds to the difference + or -1/2 with respect to a voltage Vo at the reference point 0 at said point, becomes the actual central point 0+ or - of the IC. The difference from the reference voltage Vo is computed and fed back to the robot R. The error is corrected and controlled, and the IC is held again at the actual center 0+ or -x.

Description

[Detailed Description of the Invention] [Field of Industrial Application] [The present invention relates to an integrated circuit device, particularly a flat-type, square-type large-scale integrated circuit (LSI) (hereinafter simply referred to as IC) disposed on a circuit board. The present invention relates to a positioning device when installing the device.

[Conventional technology]

Conventionally, in the work process of mounting and connecting and fixing this type of IC on a predetermined position on a circuit board, etc., the IC? : Extremely high positional error accuracy (for example, ±0.1-1) is required for positioning, so when these tasks are performed by robots (manipulators, etc.), unique positioning devices are used. .

[Problem that the invention seeks to solve]

However, in all of the conventional positioning devices of this type, the device itself is not equipped with a mechanism for correcting the gripping position by taking into account variations in the external dimensions of individual ICs, and The robot7) adsorbs the virtual center of the nominal dimensions of the IC using vacuum, etc., and transfers and mounts it onto the pattern of the circuit board. Since the required mounting position accuracy cannot be obtained due to the 0.4 crane level 3 etc., a separate television camera is installed and a microcomputer is used to
The reality is that image recognition processing is performed to correct the deviation.

However, the above method actually captures the position (printing misalignment) between the reference hole on the circuit board and the lead pattern on the board in an image, and stores it in the program to correct the misalignment, so it is relatively Correction 3 is not performed for the large variations in IC dimensions between the sides, and there is a problem in that an extremely large cost is required to correct everything including this correction by image processing.

The present invention has been made to address the problems of the conventional examples as described above, and detects the variation in sweetness of individual ICs.
The above objective is attempted to be achieved by providing means for correcting this in the positioning device itself.

[Means for solving the problem] Therefore, in the present invention, the positioning device itself is provided with a means for detecting/measuring minute variations in each of the 10 dimensions and correcting them. , which aims to achieve the above objective.

[For production]

With the above configuration, it is possible to achieve high accuracy by correcting the variations in the dimensions of individual ICs. It can be mounted at a predetermined position on a circuit board.

〔Example〕

The invention will be explained below based on examples.

FIGS. 1 and 2 show a top view and a side view (partially in section) of an embodiment of a positioning device according to the present invention, respectively. Further, FIG. 3 is an overall perspective view showing the work process of mounting an IC on a predetermined position on a circuit board S using a robot holder using the present embodiment.

(Configuration) First, in Figure 3, the IC is mounted on a pallet bag 30.
The individual ICs 8 are stored on the top (@1 station) and are sucked/grasped by the hand (manipulator) H of the robot 1N on a pair of conveyors that move over a pair of parallel rails 31. The circuit board (third station) placed on 32, P is IC? : A printed lead putter in a predetermined position to be mounted. Note that 33 is a stopper, and 34 is a tapered locator pin.

In the positioning device according to the present invention, as shown in FIG. A rectangular opening 5 is bored in the opening. The bottom of groove 3 is
It forms a relief part for the ICIJ bend. The slider 4 is supported on both sides of this opening 50 as receiving surfaces,
Each guide shaft 6 is penetrated/guided by a pair of guide shafts 6 fixed on the base wall surface perpendicular to the side surface and extending in parallel.
The upper portions are always biased with a weak force by compression coil springs 7 in the direction indicated by the arrows that clamp the IC. In addition, each guide bearing of the slider 4 has a hole in the middle part of the slider 4.
A piston rod 8a of an air cylinder 8 (fixed to the base wall) is connected to the piston rod 8a of an air cylinder 8 (fixed to the base wall) for withdrawing the air cylinder 8 in the direction of the beam against each spring 7.

On the other hand, a fulcrum shaft 10 is provided on the base 1, and a lever 9 having a sector gear 12 at its tip is rotatably supported around the fulcrum shaft 10, and is always biased in one direction by a tension coil spring 15. There is.

The lever 9 has an elongated hole 9a formed in the axial direction, into which a lever 11 protruding from the slider 4 is fitted.

A pinion 13 fixed on the rotating shaft of a rotary encoder 14 such as a potentiometer mounted by a bladder 7) 20 (FIG. 2) is meshed with the sector gear 12.

(motion) Next, the operation in the above configuration will be explained.

FIGS. 4(a) and +b1 are explanatory diagrams showing the states of the slider 4 at each moving position, respectively.

In Figures 3 and 4, first, robot R moves to No.1 and No.1.
1, when one IC on the pallet package 30 is gripped by suction, the detection signal is sent to a control circuit (not shown) fj!
:: Then, operate the air cylinder 8 and move the slider 4.
Withdraw in one direction (FIG. 4(a)) against the spring 7,
The IC gripped by the robot node H follows the path a, and the non-positioning device points it slightly (for example, about 1 angle) from the nominal center position (reference point) O of the nominal dimensions of the IC. - Position the dotted line shifted in the A direction and temporarily install it at the center 01 6
゜At this time, the robot [I] is waiting in a slightly elevated position.

Then, the air cylinder 8 is released and the slider 4 is
It is moved in the direction of arrow A by the spring 7 (Fig. 4(b)), I
C is held between the right-angled recess 2 and a predetermined pressure. At this time, the lever 9 as well as the slider 4 rotates around the fulcrum shaft 10 in the direction of arrow A, and the sector gear 12 and pinion 1
3, the rotary encoder 14 rotates, and the difference from the voltage V0 at the reference point O at that position is ±1/
The position corresponding to 2 is the actual center position 0±(
Figure 6). FIG. 5 is an explanatory diagram showing this relationship, and FIG. 6 is an enlarged view of the main part. is the nominal dimension (standard dimension) of the IC, and ±X is the actual standard dimension d of each individual IC.
0. All errors are exaggerated.

Therefore, the difference between the robot R and the reference voltage vo is calculated and fed back to the robot R, and this error is corrected and the robot R is gripped again at the actual center Qfx. After that, the air cylinder 8 is actuated by the grasping completion signal to move the slider 4 in the direction of arrow -A, release the clamping of the IC, and the robot R moves the IC along the path WJ3, cK to the circuit board S. The printed pattern is mounted at two predetermined positions.

(Method for detecting enlargement of variation size) In this case, the lever 9 and the related gears 12.13 enlarge the minute variations (for example, about 0 to ±0, 4+n) of each IC to increase the rotation angle of the rotary encoder 14. This is designed to reduce measurement errors by making the area thicker.
The biasing spring 15 also has the function of reducing measurement errors due to play in the bin and backlash pressure in the gear. In FIG. 5, if R is the distance between the centers of the fulcrum shaft 10 and lever pin 11, and R7 is the pitch radius of the sector gear 12 and pinion 13, then
The expansion ratio of is (It, /It,).

(Effects of the Example As described above, the positioning accuracy on the circuit board S is extremely high because the dimensional errors of individual ICs are corrected and mounted.
・Become something. In addition, the force that holds the target IC is
Since it is configured so that only the pressure of the slider spring 7 is applied,
By setting the appropriate spring pressure, there is no fear of deforming the IC lead terminals.

(Other Embodiments) In the embodiments described above, the voltage of the encoder was changed using the lever ratio and the gear ratio to enlarge the actual dimensional error, but for example, as shown in the principle diagram in FIG. 7, A piezoelectric element E or a strain gauge, etc. is interposed between the slider 4 and the barb 7, and the change in spring pressure due to the error ±X of the standard dimension d of the IC can be directly measured.
The same effect can be obtained even if a method of replacing the voltage with a voltage change is adopted.

〔Effect of the invention〕

As described above based on the embodiments, according to the present invention, the error correction means for detecting the dimensional error of each IC and sending an error correction signal to the manipulator is provided. Even if there are variations in IC dimensions, accurate IC mounting position accuracy can be obtained on the board, and
Positioning accuracy when mounting a flat type square LSI on a circuit board etc. using a robot etc. can be improved by using a simple mechanical configuration without using expensive image recognition means etc.
Since dimensional errors of individual ICs can be corrected, it can contribute to improved accuracy and economical effects.

[Brief explanation of drawings]

1 and 2 are a top view and a side view, respectively, of an embodiment of the positioning device according to the present invention, FIG.
al, (b) is a state explanatory diagram at each position of the slider of this embodiment, Fig. 5 is an explanatory diagram of the error detection principle, Fig. 6 is an enlarged view of the fifth fixed part, and Fig. 7 is an illustration of other It is a principle diagram of an example. l...Base 2...Recess 4...Slider 9...Lever 12/13...Sector gear/pinion 14...Rotary encoder IC...Integrated circuit device R/H...Roponto/ Note (manipulator)
S...Circuit board P...Printed lead pattern (predetermined position) L...
Positioning device X...dimensional error

Claims (2)

[Claims] (1) In a positioning device for gripping an individual integrated circuit device with a manipulator and mounting the integrated circuit device at a predetermined position on a circuit board, the dimensions of the individual integrated circuit device are provided within the positioning device itself. A positioning device for an integrated circuit device, comprising error correction means for detecting an error and sending an error correction signal to the manipulator. (2) The positioning device for an integrated circuit device according to claim 1, wherein the dimensional error detection means is configured by means for enlarging and detecting an actual error dimension.