JPS622255U - - Google Patents

Info

Publication number
JPS622255U
JPS622255U JP1985094061U JP9406185U JPS622255U JP S622255 U JPS622255 U JP S622255U JP 1985094061 U JP1985094061 U JP 1985094061U JP 9406185 U JP9406185 U JP 9406185U JP S622255 U JPS622255 U JP S622255U
Authority
JP
Japan
Prior art keywords
semiconductor device
heat sink
circuit board
printed circuit
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985094061U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985094061U priority Critical patent/JPS622255U/ja
Publication of JPS622255U publication Critical patent/JPS622255U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】
第1図はこの考案による半導体素子取付装置の
分解状態の斜面図、第2図は同他の実施例による
分解状態の斜面図、第3図は取付状態の斜面図、
第4図は従来の半導体素子取付装置を示す斜面図
、第5図、第6図は同第2、第3の従来例を示す
斜面図である。 10……半導体素子、11……フランジ、12
……端子、20……PC基板、21……挿入片、
21a……係合窓孔、30……ヒートシンク、3
1……取付孔、31a……挿入部、32……係合
突起、33……ビス孔。

Claims (1)

    【実用新案登録請求の範囲】
  1. ヒートシンクに固定された半導体素子をプリン
    ト配線基板に装備した半導体素子取付装置におい
    て、ヒートシンクに穿けられた取付孔と、この取
    付孔に位置決め係合できる係合部をもつプリント
    基板とを備え、半導体素子の端子とヒートシンク
    との間隔を保持できるように構成したことを特徴
    とする半導体素子取付装置。
JP1985094061U 1985-06-20 1985-06-20 Pending JPS622255U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985094061U JPS622255U (ja) 1985-06-20 1985-06-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985094061U JPS622255U (ja) 1985-06-20 1985-06-20

Publications (1)

Publication Number Publication Date
JPS622255U true JPS622255U (ja) 1987-01-08

Family

ID=30652286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985094061U Pending JPS622255U (ja) 1985-06-20 1985-06-20

Country Status (1)

Country Link
JP (1) JPS622255U (ja)

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