JPS6222534B2 - - Google Patents
Info
- Publication number
- JPS6222534B2 JPS6222534B2 JP19825081A JP19825081A JPS6222534B2 JP S6222534 B2 JPS6222534 B2 JP S6222534B2 JP 19825081 A JP19825081 A JP 19825081A JP 19825081 A JP19825081 A JP 19825081A JP S6222534 B2 JPS6222534 B2 JP S6222534B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- lead frame
- tank
- roller
- rotational movement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19825081A JPS5896759A (ja) | 1981-12-04 | 1981-12-04 | 半導体装置用リ−ドフレ−ムのメツキ処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19825081A JPS5896759A (ja) | 1981-12-04 | 1981-12-04 | 半導体装置用リ−ドフレ−ムのメツキ処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5896759A JPS5896759A (ja) | 1983-06-08 |
| JPS6222534B2 true JPS6222534B2 (enrdf_load_stackoverflow) | 1987-05-19 |
Family
ID=16387997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19825081A Granted JPS5896759A (ja) | 1981-12-04 | 1981-12-04 | 半導体装置用リ−ドフレ−ムのメツキ処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5896759A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000160388A (ja) * | 1998-11-27 | 2000-06-13 | Nec Yamaguchi Ltd | リ−ドフレ−ム処理装置 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62108563A (ja) * | 1985-11-06 | 1987-05-19 | Mitsubishi Electric Corp | めつき処理装置 |
| US20090031621A1 (en) * | 2005-08-05 | 2009-02-05 | Yugenkaisha Japan Tsusyo | All-Weather Farming House |
-
1981
- 1981-12-04 JP JP19825081A patent/JPS5896759A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000160388A (ja) * | 1998-11-27 | 2000-06-13 | Nec Yamaguchi Ltd | リ−ドフレ−ム処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5896759A (ja) | 1983-06-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4776939A (en) | Device for the electroplating treatment of plate-shaped objects | |
| US10119198B2 (en) | Method of cleaning substrate holder | |
| SE8205713L (sv) | Forfarande och anordning for elektropletering | |
| CN103290460A (zh) | 与阳极夹一起使用的导电带以及阳极夹 | |
| GB1478110A (en) | Electroplating apparatus | |
| US7767065B2 (en) | Device and method for electrolytically treating an at least superficially electrically conducting work piece | |
| JP2749453B2 (ja) | プリント基板を処理するための装置 | |
| US4508611A (en) | Apparatus for electroplating and chemically treating the contact elements of encapsulated electronic components and like devices | |
| CA2124082A1 (en) | Device for the Electrolytic Coating of Small Parts | |
| JPS6222534B2 (enrdf_load_stackoverflow) | ||
| US4272351A (en) | Apparatus for electrolytic etching | |
| JP2773102B2 (ja) | めっき用回転バレル装置とその使用方法 | |
| CN212077188U (zh) | 一种电镀挂具旋转设备 | |
| US4994163A (en) | Rotatable wastewater metal-reclaimation device | |
| JPH0111729Y2 (enrdf_load_stackoverflow) | ||
| JPS58125857A (ja) | リ−ドフレ−ムのめつき処理装置 | |
| US3276986A (en) | Electrolytic apparatus for treatment of the tips of glass beaded leads | |
| JPH0224396B2 (enrdf_load_stackoverflow) | ||
| JP3178164B2 (ja) | 電解めっき装置 | |
| JP3068456B2 (ja) | めっき装置 | |
| GB1411393A (en) | Apparatus for use in the electrolytic treatment of a niobium surface | |
| JPH06338486A (ja) | ウェット処理装置 | |
| JPH07292498A (ja) | 自動めっき装置 | |
| JPS6046399A (ja) | 電解表面処理方法とその装置 | |
| JPH0518916B2 (enrdf_load_stackoverflow) |