JPS622252U - - Google Patents

Info

Publication number
JPS622252U
JPS622252U JP9362285U JP9362285U JPS622252U JP S622252 U JPS622252 U JP S622252U JP 9362285 U JP9362285 U JP 9362285U JP 9362285 U JP9362285 U JP 9362285U JP S622252 U JPS622252 U JP S622252U
Authority
JP
Japan
Prior art keywords
integrated circuit
contact
heat sink
contact surface
engage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9362285U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9362285U priority Critical patent/JPS622252U/ja
Publication of JPS622252U publication Critical patent/JPS622252U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例における放熱板の取
り付け過程を示す斜視図、第2図は従来の放熱板
の取付け過程を示す斜視図である。 1……IC放熱板、1a……IC接触面、1b
……IC係合部、1c……IC係合部、1d……
脚、1e……脚、2……IC、2a……IC表、
2b……IC裏面、3……プリント板。
FIG. 1 is a perspective view showing the process of attaching a heat sink according to an embodiment of the present invention, and FIG. 2 is a perspective view showing the process of attaching a conventional heat sink. 1...IC heat sink, 1a...IC contact surface, 1b
...IC engaging part, 1c...IC engaging part, 1d...
Leg, 1e... Leg, 2... IC, 2a... IC table,
2b...back side of IC, 3...printed board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 集積回路部品の第1の表面に接する接触面と、
その接触面の両端部に設けられ、先端部に前記集
積回路の前記第1の表面に対向する裏面の第2の
表面に係合する係合部を有する脚部とを有する金
属板よりなる集積回路部品の放熱板。
a contact surface in contact with the first surface of the integrated circuit component;
An integrated circuit made of a metal plate having legs provided at both ends of the contact surface and having engaging portions at the tip portions that engage with a second surface of the back surface opposite to the first surface of the integrated circuit. Heat sink for circuit components.
JP9362285U 1985-06-20 1985-06-20 Pending JPS622252U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9362285U JPS622252U (en) 1985-06-20 1985-06-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9362285U JPS622252U (en) 1985-06-20 1985-06-20

Publications (1)

Publication Number Publication Date
JPS622252U true JPS622252U (en) 1987-01-08

Family

ID=30651466

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9362285U Pending JPS622252U (en) 1985-06-20 1985-06-20

Country Status (1)

Country Link
JP (1) JPS622252U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0774292A (en) * 1993-09-02 1995-03-17 Fuji Elelctrochem Co Ltd Heat sink for module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0774292A (en) * 1993-09-02 1995-03-17 Fuji Elelctrochem Co Ltd Heat sink for module

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