JPS62223678A - Test head cooling mechanism - Google Patents
Test head cooling mechanismInfo
- Publication number
- JPS62223678A JPS62223678A JP61068004A JP6800486A JPS62223678A JP S62223678 A JPS62223678 A JP S62223678A JP 61068004 A JP61068004 A JP 61068004A JP 6800486 A JP6800486 A JP 6800486A JP S62223678 A JPS62223678 A JP S62223678A
- Authority
- JP
- Japan
- Prior art keywords
- test head
- cylinder
- dust removal
- holes
- cylindrical body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 45
- 239000000428 dust Substances 0.000 claims abstract description 45
- 239000011491 glass wool Substances 0.000 claims description 2
- 239000004745 nonwoven fabric Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 24
- 208000031361 Hiccup Diseases 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
Landscapes
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、ＩＣテスト装置用テストヘッドの冷却機構
に関する。更に詳細には、本発明は冷却効果および除塵
効果の高いテストヘッド用冷却機構に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cooling mechanism for a test head for an IC test device. More specifically, the present invention relates to a cooling mechanism for a test head that has a high cooling effect and a high dust removal effect.
ＩＣテスト装置のテストヘッド内には多数の回路基板が
実装されており、その搭載部品による発熱量は相当に大
きい。そこで従来は、テストヘッドの内部にファンを設
け、テストヘッドの底面に設けられた開口より外気を吸
い込み、テストヘッド内部を通過させてテストヘッドの
側面から排出させることにより、回路基板を冷却するよ
うにしている。A large number of circuit boards are mounted in the test head of an IC test device, and the amount of heat generated by the mounted components is considerably large. Conventionally, a fan was installed inside the test head to cool the circuit board by sucking outside air through an opening on the bottom of the test head, passing it through the inside of the test head, and then expelling it from the side of the test head. I have to.
第５図は従来の冷却機構の概略的な部分断面図である。 FIG. 5 is a schematic partial sectional view of a conventional cooling mechanism.
第５図に示されるように、従来の冷却機構は冷却外気取
込み用の有孔円筒体１００と該円筒体に隣接して配設さ
れた吸気用ファン１１０とを有する。有孔円筒体１００
は筺体１２０に接合されており、また、吸気用ファン１
１０も取り付は川プレート１１２により筐体に固設され
ている・しかし１テスト対象のＩＣの高集積化に伴０、
テストヘッド内に実装される回路基板の枚数が増加し、
また、その実装密度も高くなってきたため１前記のよう
な従来の冷却構造では十分な冷却効果を達成することが
困難になりつつある。As shown in FIG. 5, the conventional cooling mechanism has a cylindrical body 100 with holes for taking in cooling outside air and an intake fan 110 disposed adjacent to the cylindrical body. Perforated cylindrical body 100
is connected to the housing 120, and the intake fan 1 is connected to the housing 120.
10 is also fixed to the case by a river plate 112. However, as the IC to be tested becomes highly integrated,
The number of circuit boards mounted inside the test head has increased,
In addition, as the packaging density has increased, it has become difficult to achieve a sufficient cooling effect with the conventional cooling structure as described above.
冷却風量を増加させるために大型のファンを配設するこ
とは筐体の容積に限界があるため現実的な解決法とは言
えない。Installing a large fan to increase the amount of cooling air is not a practical solution because the volume of the housing is limited.
更に、塵埃を含んだ外気を冷却用に直接使用すると゛Ｉ
Ｃ検査基板に塵埃が付着し、検査結果を誤らせる原因と
なったり、最悪の場合にはＩＣ回路基板を不良品化させ
てしまうこともある。Furthermore, if outside air containing dust is used directly for cooling,
Dust may adhere to the C-inspection board, causing erroneous test results, or in the worst case, causing the IC circuit board to be defective.
従って、この発明の目的は、筐体の容積およびファンの
サイズを全く変更することなく冷却効果および除塵効果
を高めることのできるテストヘッド用冷却機構を提供す
ることである。Therefore, an object of the present invention is to provide a cooling mechanism for a test head that can enhance the cooling effect and the dust removal effect without changing the volume of the housing or the size of the fan at all.
前記の問題点を解決し、この目的を達成するためのＬ段
として本発明は、ＩＣテスト装置用テストヘッドの冷却
機構において、冷却外気取込み用の有孔円筒体と該円筒
体に隣接して配設された吸気用ファンとを有し、前記イ
ｒ孔円筒体は有孔内筒と有孔外筒との二重構造であり、
前記有孔内筒と有孔外筒との間に除塵部材が介装されて
いることを特徴とするテストヘッド冷却機構を提供する
。To solve the above-mentioned problems and achieve this object, the present invention provides a cooling mechanism for a test head for an IC test device, in which a cylindrical body with a hole for taking in cooling outside air and a cylindrical body adjacent to the cylindrical body are provided. and an intake fan arranged therein, and the cylindrical body has a double structure of a perforated inner cylinder and a perforated outer cylinder,
A test head cooling mechanism is provided, characterized in that a dust removal member is interposed between the perforated inner cylinder and the perforated outer cylinder.
テストヘッド用冷却機構の改良実験を重ねるうちに、本
発明者は従来から使用されてきた有孔円筒体を有孔内筒
と有孔外筒とから構成し、該内筒と該筒との間に除塵部
材を介装すると、冷却風が均一に流れ、除塵効果を向−
ヒさせることができることを発見した。Through repeated experiments to improve the cooling mechanism for test heads, the present inventor constructed a conventionally used perforated cylindrical body with a perforated inner cylinder and a perforated outer cylinder, and discovered that the inner cylinder and the perforated cylinder were If a dust removal member is inserted between the two, the cooling air will flow uniformly and the dust removal effect will be improved.
I discovered that it can cause a hiccup.
特に、有孔内筒の孔の少なくとも一部を有孔外筒の孔の
位置と相対的にずらして配設すると、吹込まれた外気が
均一に拡散されて冷却効果が高められ、しかも、除塵部
材の使用除塵面積が増大し、除塵効果も高められる。In particular, if at least some of the holes in the perforated inner cylinder are shifted relative to the positions of the holes in the perforated outer cylinder, the outside air blown in will be uniformly diffused and the cooling effect will be enhanced. The dust removal area used by the member is increased, and the dust removal effect is also enhanced.
かくして、筐体の容積およびファンのサイズを全く変更
することなく、冷却効果および除塵効果を高めることが
できる。In this way, the cooling effect and dust removal effect can be enhanced without changing the volume of the housing or the size of the fan at all.
以下、この発明の−・実施例について図面を参照して詳
細に説明する。Embodiments of the present invention will be described in detail below with reference to the drawings.
第１図は本発明のテストヘッド冷却機構の概略的部分断
面図、第２図は孔の位置による除塵効果の相違を示す部
分断面図、第３図は本発明の冷却機構を有するテストヘ
ッドを備えたＩＣテスト装置の側面図、第４図はテスト
ヘッドのｎ−ｎ’線に沿った概略断面図である。FIG. 1 is a schematic partial cross-sectional view of the test head cooling mechanism of the present invention, FIG. 2 is a partial cross-sectional view showing the difference in dust removal effect depending on the hole position, and FIG. 3 is a schematic partial cross-sectional view of the test head cooling mechanism of the present invention. FIG. 4 is a side view of the IC test apparatus provided with the test head, and is a schematic sectional view taken along line nn' of the test head.
第１図に示されるように、本発明のテストヘッド冷却機
構は、冷却外気取込み用の有孔円筒体１０と該円筒体に
隣接して配設された吸気用ファン２０とをイ丁する。As shown in FIG. 1, the test head cooling mechanism of the present invention includes a cylindrical body 10 with holes for taking in cooling outside air and an intake fan 20 disposed adjacent to the cylindrical body.
有孔円筒体１０は筺体３０に接合されており、また、吸
気用ファン２０も取り付は用プレート２２により筐体に
固設されている。The perforated cylindrical body 10 is joined to the housing 30, and the intake fan 20 is also fixed to the housing by a mounting plate 22.
有孔円筒体ｌＯは有孔内拘°１２とイイ孔外筒１４とか
ら構成されており、内筒１２と外筒１４との間には除塵
部材１６が介装されている。The perforated cylindrical body 1O is composed of a perforated inner cylinder 12 and a well-perforated outer cylinder 14, and a dust removal member 16 is interposed between the inner cylinder 12 and the outer cylinder 14.
除塵部材１６は例えば、グラスウールまたは不織布のよ
うなフィルタである。The dust removal member 16 is, for example, a filter made of glass wool or nonwoven fabric.
内筒１２に穿設された孔１８ａの一部または全部の位置
は外筒１４に穿設された孔１８ｂの位置と相対的にずら
すことが好ましい。It is preferable that the position of part or all of the hole 18a formed in the inner cylinder 12 be shifted relative to the position of the hole 18b formed in the outer cylinder 14.
第２図（ａ）に示されるように、孔の位置をずらすと、
外気は孔１８ｂから入って、除塵部材１８を斜めに横切
って孔１８ａに達する。これに対して、第２図（ｂ）に
示されるように、孔の位置を一致させると、外気は除塵
部材を真直に横断してしまう。As shown in Fig. 2(a), when the position of the hole is shifted,
Outside air enters through the hole 18b, diagonally crosses the dust removal member 18, and reaches the hole 18a. On the other hand, as shown in FIG. 2(b), if the positions of the holes are matched, the outside air will cross the dust removal member straight.
その結果、第２図（ａ）および（ｂ）に示されるように
、除塵部材１６の使用除塵面積は孔の位置をずらした場
合のほうが、一致させた場合よりも遥に大きい。換言す
れば、孔の位置をずらすと除塵効果が高くなる。また、
除塵部材も有効に利用されたことになる。外気が除塵部
材を斜めに横切ってくる場合、１′〔直に入ってくるの
に比べて、除塵部材内の通過距離が長くなる。従って、
微細な塵埃も捕捉されるＩＩ丁脂性が高（なる。As a result, as shown in FIGS. 2(a) and 2(b), the dust removal area used by the dust removal member 16 is much larger when the positions of the holes are shifted than when they are aligned. In other words, shifting the position of the holes increases the dust removal effect. Also,
This means that the dust removal member was also effectively utilized. When outside air crosses the dust removing member diagonally, the distance through which it passes through the dust removing member becomes longer than when it enters directly. Therefore,
It has a high level of oiliness that captures even minute dust.
第３図に示されるように、ＩＣテスト装置５０は、本体
５２とテストへ・ラド６０から構成されている。本体５
２は、テストへ・ノド６０内の回路用の電源などを収容
しているものであり、レベリングボルト５４によって床
１・、に移動可能に設置される。As shown in FIG. 3, the IC test device 50 is composed of a main body 52 and a test pad 60. As shown in FIG. Main body 5
2 houses a power supply for the circuit inside the test throat 60, and is movably installed on the floor 1 by means of leveling bolts 54.
テストヘッド６０は、支持部５６によって、少な（とも
回動可能に支持されている。ＩＣテスト装置５０をＩＣ
ハンドラと組合わせて使用する場合、テストヘッド６０
は図示のように垂直に回動させられ、テストへラド６０
の上面側に設けられたソケット６２とＩＣハンドラの接
続ビンとが結合される。ＩＣの手選別を行うような場合
、テストヘッド６０は水平位置に倒される。５８ａはテ
ストヘッド６０を直立位置に固定するための口、ツクピ
ンであり、５８ｂはテストヘッド６０を水平位置に固定
するためのロックピンである。The test head 60 is rotatably supported by the support section 56.
When used in combination with a handler, the test head 60
is rotated vertically as shown and the rad 60 to the test
A socket 62 provided on the top side of the IC handler is connected to a connection bin of the IC handler. When manually sorting ICs, the test head 60 is tilted to a horizontal position. Reference numeral 58a is a hole or lock pin for fixing the test head 60 in an upright position, and reference numeral 58b is a lock pin for fixing the test head 60 in a horizontal position.
なお、本体５２とテストヘッド６０との間の信号ケーブ
ルや、冷却構造に直接関係しない前記以外のｒ′！１＜
分は、図中省略されている。Note that r' other than the above is not directly related to the signal cable between the main body 52 and the test head 60 or the cooling structure! 1<
The minutes are omitted in the figure.
次に、第４図を参照して、テストへ・ラド６０の冷却に
関連した構造を説明する。この図は、テストヘッド６０
の ｎ−ｎ’線概略断面図であり、テストヘッド６０の
冷却に直接関連しない部分は省略または簡略化されてい
る。Next, with reference to FIG. 4, a structure related to cooling of the test pad 60 will be described. This figure shows the test head 60
It is a schematic cross-sectional view taken along the line nn' of , in which parts not directly related to cooling the test head 60 are omitted or simplified.
この図に示されているように、テストヘッド６０の内部
には、多数の回路基板６４が放射状に配置６されている
。中央部には、円筒体１０が、テストヘッド６０の上面
に対し垂直に設けられている。As shown in this figure, inside the test head 60, a large number of circuit boards 64 are arranged 6 in a radial manner. At the center, a cylindrical body 10 is provided perpendicularly to the upper surface of the test head 60.
円筒体１０の下端は開口されている。また、円筒体１０
の側面には、冷却用外気を取り込むための多数の孔が形
成されている。従って、外気は、円筒体１０の側面を通
過し、回路基板６４の実装空間へ流れる。円筒体１０の
ド端開［１部には除塵用のフィルタを取り付けることも
できる。The lower end of the cylindrical body 10 is open. In addition, the cylindrical body 10
A large number of holes are formed on the side of the housing to take in outside air for cooling. Therefore, the outside air passes through the side surface of the cylindrical body 10 and flows into the mounting space of the circuit board 64. A dust removal filter can also be attached to one part of the cylindrical body 10 that is open at the end.
円筒体１０の近傍、およびテストヘッド６０の側面板６
６の近傍に、それぞれファン２０が配置されている。ま
た、側面板６６には、第１図に示されるように、願意６
８が設けられている。したかって、円筒体１０に送り込
まれた外気は、ファン２０によって回路基板実装空間を
経由して外向きに送られ、回路基板６４を冷却した後、
願意６８を通じて外部へ排出される。Near the cylindrical body 10 and the side plate 6 of the test head 60
A fan 20 is arranged near each of the fans 6 and 6. Further, as shown in FIG.
8 is provided. Therefore, the outside air sent into the cylindrical body 10 is sent outward via the circuit board mounting space by the fan 20, and after cooling the circuit board 64,
It is discharged to the outside through the wish 68.
［発明の効果］
以Ｉ−の説明から明らかなように、本発明のテストヘッ
ド冷却機構は、冷却外気取込み用の有孔円筒体と該円筒
体に隣接して配設された吸気用ファンとを有し、前記有
孔円筒体は有孔内筒と有孔外筒の二重構造であり、前記
有孔内筒と有孔外筒との間に除塵部材が介装されている
。[Effects of the Invention] As is clear from the explanation in I- below, the test head cooling mechanism of the present invention includes a cylindrical body with holes for taking in cooling outside air, an intake fan disposed adjacent to the cylindrical body, The perforated cylindrical body has a double structure of a perforated inner cylinder and a perforated outer cylinder, and a dust removal member is interposed between the perforated inner cylinder and the perforated outer cylinder.
特に、有孔内筒の孔の少なくとも一部を有孔外筒の孔の
位置とずらして配設すると、外気は除塵部材を斜めに横
切ってテストヘッド内に進入する。In particular, when at least some of the holes in the perforated inner cylinder are arranged to be shifted from the positions of the holes in the perforated outer cylinder, outside air diagonally crosses the dust removal member and enters the test head.
孔の位置を−・致させると、外気は除塵部材を１１直に
横断してしまう。If the position of the hole is adjusted to 11, the outside air will directly cross the dust removal member.
その結果、除塵部材の使用除塵面積は孔の位置をずらし
た場合のほうが、一致させた場合よりもルに大きい。換
言すれば、孔の位置をずらすと除塵効果が高くなる。ま
た、除塵部材も有効に利用されたことになる。外気が除
塵部材を斜めに横切ってくる場合、１゛〔直に入ってく
るのに比べて、除塵部材内の通過距離が長くなる。従っ
て、微細な塵埃も捕捉される可能性が高くなる。As a result, the dust removal area used by the dust removal member is much larger when the positions of the holes are shifted than when they are aligned. In other words, shifting the position of the holes increases the dust removal effect. Moreover, the dust removal member was also effectively utilized. When outside air crosses the dust removal member diagonally, the distance through which it passes through the dust removal member becomes longer than when it enters directly. Therefore, there is a high possibility that fine dust particles will also be captured.
有孔内筒の孔の少なくとも一部を有孔外筒の孔の位置と
ずらして配設すると、吹込まれた外気が均一に拡散され
て冷却効果が高められ、しかも、除塵部材の使用除塵面
積が増大し、除塵効果も高められる。By arranging at least a portion of the holes in the perforated inner cylinder to be offset from the positions of the holes in the perforated outer cylinder, the blown outside air is uniformly diffused and the cooling effect is enhanced. is increased, and the dust removal effect is also enhanced.
かくして、筐体の容積およびファンのサイスヲ全く変更
することなく、冷却効果および除塵効果を高めることが
できる。In this way, the cooling effect and dust removal effect can be enhanced without changing the volume of the housing or the size of the fan at all.
第１図は本発明のテストヘッド冷却機構の概略的部分断
面図、第２図（ａ）および（ｂ）は孔の位置による除塵
効果の相違を示す部分断面図、第３図は本発明の冷却機
構を有するテストヘッドを備えたＩＣテスト装置の側面
図、第４図はテストヘッドのｎ−ｎ’線に沿った概略断
面図、第５図は従来のテストヘッド冷却機構の概略的部
分断面図である。
１０・・・有孔円筒体 １２・・・有孔内筒 １４・・
・有孔外筒 １６・・・除塵部材 １８ａおよび１８ｂ
・・・孔 ２０・・・−ファン ３０・・・筺体 ４０
・・・吸気孔５０・・・ＩＣテスト装置 ５２・・・本
体 ５４・・・レベリングボルト ５６・・・支持部
５８ａおよび５８ｂ・・・ロックピン ８０・・・テス
トヘッド ６２・・・ソケット ６４・・・ＩＣＪＡ板
８６・・・側面板 ６８・・・願意FIG. 1 is a schematic partial sectional view of the test head cooling mechanism of the present invention, FIGS. 2(a) and (b) are partial sectional views showing the difference in dust removal effect depending on the hole position, and FIG. 3 is a partial sectional view of the test head cooling mechanism of the present invention. A side view of an IC test device equipped with a test head having a cooling mechanism, FIG. 4 is a schematic cross-sectional view of the test head taken along line nn', and FIG. 5 is a schematic partial cross-section of a conventional test head cooling mechanism. It is a diagram. 10... Cylindrical body with holes 12... Inner cylinder with holes 14...
- Perforated outer cylinder 16...dust removal member 18a and 18b
...hole 20...-fan 30...housing 40
...Intake hole 50...IC test device 52...Main body 54...Leveling bolt 56...Support part
58a and 58b... Lock pin 80... Test head 62... Socket 64... ICJA plate 86... Side plate 68... Request
Claims (3)
て、冷却外気取込み用の有孔円筒体と該円筒体に隣接し
て配設された吸気用ファンとを有し、前記有孔円筒体は
有孔内筒と有孔外筒との二重構造であり、前記有孔内筒
と有孔外筒との間に除塵部材が介装されていることを特
徴とするテストヘッド冷却機構。(1) A cooling mechanism for a test head for an IC test device, which has a cylindrical body with holes for taking in cooling outside air and an intake fan disposed adjacent to the cylindrical body, and the cylindrical body with holes has a cylindrical body with holes. A test head cooling mechanism characterized in that it has a double structure of an inner tube with holes and an outer tube with holes, and a dust removal member is interposed between the inner tube with holes and the outer tube with holes.
置と相対的にずれている特許請求の範囲第１項に記載の
テストヘッド冷却機構。(2) The test head cooling mechanism according to claim 1, wherein the position of the hole in the perforated inner cylinder is relatively shifted from the position of the hole in the perforated outer cylinder.
ルタである特許請求の範囲第１項または第２項に記載の
テストヘッド冷却機構。(3) The test head cooling mechanism according to claim 1 or 2, wherein the dust removal member is a filter made of glass wool or nonwoven fabric.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61068004A JPS62223678A (en) | 1986-03-26 | 1986-03-26 | Test head cooling mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61068004A JPS62223678A (en) | 1986-03-26 | 1986-03-26 | Test head cooling mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62223678A true JPS62223678A (en) | 1987-10-01 |
Family
ID=13361289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61068004A Pending JPS62223678A (en) | 1986-03-26 | 1986-03-26 | Test head cooling mechanism |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62223678A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103048609A (en) * | 2012-12-19 | 2013-04-17 | 昆山迈致治具科技有限公司 | PCB (Printed Circuit Board) test jig with air blowing function |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5311959B2 (en) * | 1973-07-12 | 1978-04-25 | ||
| JPS605405B2 (en) * | 1977-12-19 | 1985-02-12 | 豊田工機株式会社 | Jig for supporting thin-walled hollow cylindrical workpieces |
-
1986
- 1986-03-26 JP JP61068004A patent/JPS62223678A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5311959B2 (en) * | 1973-07-12 | 1978-04-25 | ||
| JPS605405B2 (en) * | 1977-12-19 | 1985-02-12 | 豊田工機株式会社 | Jig for supporting thin-walled hollow cylindrical workpieces |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103048609A (en) * | 2012-12-19 | 2013-04-17 | 昆山迈致治具科技有限公司 | PCB (Printed Circuit Board) test jig with air blowing function |
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