JPS6222217A - Thin film magnetic head - Google Patents

Abstract

PURPOSE:To prevent deviation of mask or pattern and peeling of a lower magnetic film at cut-off by forming the lower magnetic film to a part of a base so as to proceed the stage while preventing warp of the base. CONSTITUTION:In preventing the lower magnetic film from being formed over the entire region of the base 2 of a thin film magnetic head, distortion of the film 1 is relaxed to prevent the warp of the base 2. That is, the lower magnetic film 1 is formed only a prescribed region at each thin film magnetic head chip on the base 2 and no lower magnetic film 1 is formed on the other part of the base 2, then generation of deflection during the manufacture stage is prevented and the fine processing is attained by using the photo lithography technology while keeping the major plane of the base 2 as a flat plate form. Thus, adverse effect such as deviation of a mask or the like is prevented effectively and the yield is improved. Further, the thin film magnetic head is split to each chip at each C-C' line.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thin film magnetic head, and more particularly to a thin film magnetic head of a type in which a magnetic film having a high saturation magnetic flux density is formed on a substrate.

[Summary of the invention]

This invention includes a lower magnetic film on a substrate, a multilayer coil conductor,
In a thin film magnetic head made up of an upper magnetic film, an insulating film, etc., the lower magnetic film formed on a substrate is partially formed to improve the manufacturing yield.

[Conventional technology]

Generally, a thin film magnetic head is known as a device for recording information on a magnetic recording medium such as a magnetic tape or a magnetic disk.

This thin film magnetic head is mainly manufactured using a thin film forming technique such as a sputtering method or a microfabrication technique such as a photolithography technique. In the manufacturing process of a thin film magnetic head, for example, a substrate 22 made of N1-Zn ferrite or Mn-Zn ferrite as shown in FIG. 4 is used, and the entire surface of the substrate 22 is coated with Fe- A lower magnetic film 21 such as an Al-3i film is deposited by sputtering or the like. After the lower magnetic film is deposited, a plurality of layers of coil conductors, an upper magnetic film, an insulating film, etc. are formed in a predetermined pattern using FoI-IJ lithography technology.

Thin film magnetic heads are manufactured using the above-mentioned thin film forming techniques and photolithography techniques, and in the normal manufacturing process, a plurality of thin film magnetic heads are formed on the same substrate.

That is, in the manufacturing process of thin-film magnetic heads, a photomask with patterns that will become thin-film magnetic heads arranged vertically and horizontally is used, and film formation and etching are performed on the same substrate at the same time, thereby manufacturing multiple thin-film magnetic heads at the same time. is formed. Then, cutting is performed for each thin film magnetic head chip formed in the final process.

[Problem that the invention seeks to solve]

As described above, in the manufacturing process of the thin film magnetic head, as shown in FIG.
1 is formed. Therefore, during the manufacturing process, the substrate 2
2 and the lower magnetic film 21, internal stress generated during film formation, etc., a phenomenon in which the substrate 22 warps occurs, resulting in problems such as mask misalignment and pattern misalignment. There is.

Furthermore, in the manufacturing process of such a thin film magnetic head, each thin film magnetic head is cut into pieces in the final step. For this reason, when cutting into individual Rad chips, there are negative effects such as cracking or part of the lower magnetic film peeling off, especially when using a highly brittle material such as Fe-A#-3i film. This is noticeable.

SUMMARY OF THE INVENTION In view of the above-mentioned problems, it is an object of the present invention to provide a thin film magnetic head that solves problems such as pattern displacement, cracking, and part of the lower magnetic film peeling off, and improves yield.

[Means for solving problems]

The present invention provides a thin film magnetic head in which a lower magnetic film, a plurality of coil conductors, and an upper magnetic film are laminated on a substrate with an insulating layer interposed therebetween, wherein the lower magnetic film is formed on a part of the substrate. The above-mentioned problems are solved by a thin film magnetic head characterized by the following. The lower magnetic film to be formed on the substrate can be formed on a part of the substrate from the beginning by, for example, a mask sputtering method, or, for example, after the lower magnetic film is deposited on the entire surface, the lower magnetic film can be Part of the film may be removed.

The region where the lower magnetic film is formed may be formed in a band shape along the line to be cut in consideration of convenience when cutting each chip.

[Effect]

In the thin film magnetic head of the present invention, a lower magnetic film is partially formed on a substrate. Therefore, the strain on the substrate on which the lower magnetic film is formed can be alleviated, and each thin film can be cut into magnetic Rad chips at the portion where the lower magnetic film is not present.

〔Example〕

Preferred embodiments of the present invention will be described with reference to the drawings.

The thin film magnetic head according to the embodiment of the present invention has a Ni-
A ferrite substrate such as Zn ferrite or Mn-Zn ferrite is used, and a Fe-A6-3i film (
Sendust film) is formed.

As shown in FIG. 1, the thin film magnetic head of this embodiment has an N
A Fe-Al-3i film, which is a material having high saturation magnetic flux density characteristics, is partially formed as a lower magnetic film 1 on a ferrite substrate 2 made of i-Zn ferrite, Mn-Zn ferrite, or the like. The region UM in which the lower magnetic film 1 is formed extends from the lower part of the front gap of the thin film magnetic head to the part where the wiring layer 12, which is the lead-out portion of the coil conductor, is formed, and in the final process, each thin film magnetic head chip is The lower magnetic film 1 is not formed along the cutting lines (indicated by line A-A' and line B-B' in the figure). The method of depositing and forming the lower magnetic film 1 only on the region UM in this way includes, for example, using a mask sputtering method to form the lower magnetic film 1 only on the region UM, or, for example, depositing the lower magnetic film 1 on the entire surface of the ferrite substrate λ. There is a method in which the lower magnetic film 1 is deposited, a photoresist or the like is applied, selective exposure is performed, and after the photoresist is removed, the lower magnetic film is patterned by etching. A first insulating layer 3 made of a material such as silicon oxide is deposited on the lower magnetic film 1, and a metal film made of a material such as Cu is further deposited by sputtering or the like. A first conductor layer 4 that becomes a wound coil conductor is formed by pattern etching. Then, on the first conductor layer 4, a second conductor layer 5, which becomes a coil conductor similarly to the first conductor layer 4, is formed via a second insulating layer 6. An upper magnetic film 11, a fusion protection film 14, etc. are formed with the third insulating layer 7 interposed therebetween. This first conductor layer 4. Second conductor layer5. Upper magnetic film 11
The formation of the contact portions 9 and the like and the formation of the contact portion 9 are performed using photolithography technology, but as will be described later, since the warpage of the ferrite substrate is alleviated, problems such as mask displacement do not occur. The lower magnetic film 1 and the upper magnetic film 11 are connected at a contact portion 9 located approximately at the center of the winding of the coil conductor, which is the back gap portion, while a gap film 10 is provided at the front gas sub portion. It is formed.

Further, the fourteenth body layer 4 and the second conductor layer 5 are used as coil conductors and are connected to the wiring layer 12, respectively, and the wiring layer 12 is provided with a connecting portion 13, respectively.

A thin film magnetic head having such a structure can be cut along cutting lines AA' and B-B' using, for example, a diamond cutter, as shown in FIG. The lower magnetic film 1 is formed in a strip shape taking into account the cutting line, and since the lower magnetic film 1 is not formed at the cutting line as described above, a part of the lower magnetic film 1 peels off. There are no problems such as and,
Particularly when Fe-Al-3i film was used for the lower magnetic film 1, phenomena such as film peeling were noticeable, but Fe-Aj! These problems can be solved by not providing the -3i film.

Further, in the thin film magnetic head having such a structure, since the lower magnetic film 1 is not formed over the entire surface of the substrate, the distortion of the film can be alleviated and warpage of the substrate can be prevented. That is, as shown in FIG. 3, the lower magnetic film 1 is formed only in a predetermined area of each thin film magnetic field chip on the substrate Φ, and the lower magnetic film 1 is not formed on the other parts of the substrate Φ. , it is possible to prevent the occurrence of warpage, etc. during the manufacturing process, and microfabrication can be performed using photolithography technology while maintaining the main surface of the substrate in a flat shape. Therefore, it is possible to effectively prevent negative effects such as mask displacement.
Yield can be improved. In addition, c-c' in the figure
The lines indicate cutting lines, and the thin film magnetic head of this embodiment can be separated into chips along each C-C' line.

In the above-described example, the substrate is a ferrite substrate such as Ni-Zn ferrite or Mn-Zn ferrite, but is not limited thereto, and may be a ceramic substrate. Further, although the lower magnetic film is an Fe-Al-3i film, it is not limited thereto, and a material having a high saturation magnetic flux density such as an Fe-Ni film (permalloy film) may be used.

〔Effect of the invention〕

In the thin film magnetic head of the present invention, since the lower magnetic film is formed on a part of the substrate, the process can be carried out while preventing warping of the substrate, and mask displacement and pattern displacement do not occur.

Further, when cutting, it is possible to cut the portion where the lower magnetic film is not formed, so that cracks and part of the lower magnetic film do not peel off. Therefore, the thin film magnetic head of the present invention has an excellent effect in that it is possible to improve the yield.

[Brief explanation of the drawing]

FIG. 1 is a schematic sectional view showing an embodiment of the thin film magnetic head according to the present invention, FIG. 2 is a plan view of the thin film magnetic head, and FIG. 3 is a fabrication of the thin film magnetic head according to the present invention. FIG. 4 is a schematic cross-sectional view showing the state of adhesion of the lower magnetic film during the process, and FIG. 4 is a schematic cross-sectional view showing the state of adhesion of the lower magnetic film in the manufacturing process of a conventional thin-film magnetic head. ■... Lower magnetic film 2... Ferrite substrate A-A', B-B', C-C"... Cutting line UM...
Lower Magnetic Film Formation Area Patent Applicant Sony Corporation Representative Patent Attorney Koike Mima Sakae Tamura “Substrate and Lower Usu Phase” Figure 3, Figure 4

Claims (1)

[Claims] A thin film magnetic head in which a lower magnetic film, a plurality of coil conductors, and an upper magnetic film are laminated on a substrate with an insulating layer interposed therebetween, wherein the lower magnetic film is formed on a part of the substrate. A thin film magnetic head characterized by: