JPS62222082A - Composition of chemical copper plating solution for titanium material - Google Patents
Composition of chemical copper plating solution for titanium materialInfo
- Publication number
- JPS62222082A JPS62222082A JP6515586A JP6515586A JPS62222082A JP S62222082 A JPS62222082 A JP S62222082A JP 6515586 A JP6515586 A JP 6515586A JP 6515586 A JP6515586 A JP 6515586A JP S62222082 A JPS62222082 A JP S62222082A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- plating
- plating solution
- titanium material
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 44
- 239000010949 copper Substances 0.000 title claims abstract description 27
- 239000000463 material Substances 0.000 title claims abstract description 25
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 19
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 title claims description 19
- 239000010936 titanium Substances 0.000 title claims description 19
- 229910052719 titanium Inorganic materials 0.000 title claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 17
- 239000000126 substance Substances 0.000 title description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims abstract description 12
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims abstract description 8
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910017604 nitric acid Inorganic materials 0.000 claims abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 5
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 12
- 229910001431 copper ion Inorganic materials 0.000 claims description 12
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 abstract description 2
- 229940116318 copper carbonate Drugs 0.000 abstract description 2
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 abstract description 2
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 abstract description 2
- HFDWIMBEIXDNQS-UHFFFAOYSA-L copper;diformate Chemical compound [Cu+2].[O-]C=O.[O-]C=O HFDWIMBEIXDNQS-UHFFFAOYSA-L 0.000 abstract description 2
- 230000033116 oxidation-reduction process Effects 0.000 abstract description 2
- 150000002500 ions Chemical class 0.000 abstract 5
- 238000000034 method Methods 0.000 description 6
- 238000006073 displacement reaction Methods 0.000 description 5
- 238000007772 electroless plating Methods 0.000 description 3
- -1 Copper halides Chemical class 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- LCKIEQZJEYYRIY-UHFFFAOYSA-N Titanium ion Chemical compound [Ti+4] LCKIEQZJEYYRIY-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 1
- PTVDYARBVCBHSL-UHFFFAOYSA-N copper;hydrate Chemical compound O.[Cu] PTVDYARBVCBHSL-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分ツ？］
この発明は、チタン材に銅メッキを施すためのメッキ液
組成物に係り、特には、１段階でチタン材に化学銅メッ
キを施すためのメッキ液組成物に関する。[Detailed description of the invention] [Industrial applications?] ] The present invention relates to a plating solution composition for applying copper plating to a titanium material, and particularly to a plating solution composition for applying chemical copper plating to a titanium material in one step.
［従来の技術］
チタン材に銅メッキを施すための方法として、無電解メ
ッキ等が知られているが、無電解メッキによっては純粋
な銅メッキ被膜を得ることが困難である。また、無電解
メッキでは、メッキ前処理工程が煩雑である。[Prior Art] Electroless plating and the like are known as methods for applying copper plating to titanium materials, but it is difficult to obtain a pure copper plating film using electroless plating. Further, in electroless plating, the plating pretreatment process is complicated.
ところで、被メッキ材成分がメッキ浴中に溶は込んで、
メッキ浴中のメッキ成分と置換して被メッキ材に所定の
メッキ被膜を形成する方法は、いわゆる置換メッキ法と
して知られている。この置換メッキ法は、メッキ前処理
工程が不要であり、しかも純粋なメッキ被膜を形成する
ことができる。By the way, the components of the material to be plated melt into the plating bath,
A method of forming a predetermined plating film on a material to be plated by replacing plating components in a plating bath is known as a so-called displacement plating method. This displacement plating method does not require a plating pretreatment step and can form a pure plating film.
［発明が解決しようとする問題点］
しかしながら、チタン材に対して銅メッキするに当り、
置換メッキ法を用いた例は従来知られていない。[Problems to be solved by the invention] However, when copper plating titanium material,
There are no known examples using displacement plating.
したがって、この発明の目的は、置換メッキ法の原理に
基づいたチタン材に対する化学銅メッキ液組成物を提供
することにある。Therefore, an object of the present invention is to provide a chemical copper plating solution composition for titanium materials based on the principle of displacement plating.
この発明のメッキ液組成物はチタン材に対して１段階で
銅メッキを施すためのものである。The plating solution composition of the present invention is for performing copper plating on a titanium material in one step.
この発明においては、チタン材を銅イオンを含むメッキ
液に浸漬して酸化還元電位の差異によりチタン材表面の
チタンを溶解し、その際銅イオンをチタン材表面に金属
銅として還元析出させる。In this invention, a titanium material is immersed in a plating solution containing copper ions to dissolve titanium on the surface of the titanium material due to the difference in oxidation-reduction potential, and at this time, copper ions are reduced and precipitated on the surface of the titanium material as metallic copper.
この発明のメッキ液組成物は、１５ないし２５重屋％の
銅イオンを提供するに充分な量の銅イオン源、硝酸３０
ないし５０重量％、フッ醜ｌＯ〜１５重量％、酢酸Ｏな
いし４重量％および水残部よりなる。The plating solution composition of the present invention includes a copper ion source in an amount sufficient to provide 15 to 25% copper ions, a nitric acid 30%
It consists of 50 to 50% by weight, 10 to 15% by weight of fluorine, 4 to 4% by weight of acetic acid, and the balance of water.
この発明の銅イオン源は、銅イオンを１５〜２５重量％
の割合でメッキ液組成物中に提供するものであり、金属
銅、−酸化銅、硝酸銅、炭酸銅、ギ酸銅などを用いるこ
とができる。ハロゲン化銅および酢酸銅は、銅イオンと
錯体を形成して銅イオンを安定化させる傾向にあるため
用いない方がよい。The copper ion source of this invention contains 15 to 25% by weight of copper ions.
Metallic copper, copper oxide, copper nitrate, copper carbonate, copper formate, etc. can be used. Copper halides and copper acetate tend to form complexes with copper ions and stabilize them, so it is better not to use them.
硝酸は、３０ないし５０重量％の割合で配合される。硝
酸は、銅イオン源の溶解剤として作用するとともに、メ
ッキ過程でメッキ液中に生成した３価のチタンを酸化さ
せるために必要なものである。３価のチタンイオンは、
メッキ液中において２価の銅イオンおよび水と反応して
メッキ液中に銅を析出させるため、硝酸によってこれを
溶解する。Nitric acid is blended in a proportion of 30 to 50% by weight. Nitric acid acts as a dissolving agent for the copper ion source and is necessary for oxidizing trivalent titanium generated in the plating solution during the plating process. Trivalent titanium ion is
In order to react with divalent copper ions and water in the plating solution and deposit copper in the plating solution, this is dissolved with nitric acid.
フッ酸は、１０−１５重量％の割合で配合される。フッ
酸は銅イオン源の溶解助剤として作用する。Hydrofluoric acid is blended in a proportion of 10-15% by weight. Hydrofluoric acid acts as a solubilizing agent for the copper ion source.
この発１町のメッキ液組成物の残分は水である。The remainder of this plating solution composition is water.
なお、酢酸を４重量％まで配合すると、メッキ液の寿命
が延長する。ただし、その量が４電歇％を越えるとメッ
キ速度が低下するので、４重量％までとする。Note that when acetic acid is added up to 4% by weight, the life of the plating solution is extended. However, if the amount exceeds 4% by weight, the plating speed will decrease, so the amount should be up to 4% by weight.
この発明のメッキ液組成物を用いてチタン材にメッキを
施すには、室温ないし７０℃に保持したこの発明のメッ
キ液ｉｉ１成物中にチタン材を１ないし２０分間浸漬す
る。この条件の下で、銅被膜は、１ｇｍ７分ないし５ｇ
ｒｎ／分の速度でチタン材上に形成される。To plate a titanium material using the plating solution composition of the present invention, the titanium material is immersed for 1 to 20 minutes in the plating solution ii1 composition of the present invention maintained at room temperature to 70°C. Under these conditions, the copper coating should be between 1gm7 and 5g
Formed on titanium material at a rate of rn/min.
Ｃ実施例］
以下の表１に示す組成のメッキ液を調製し、表２に示す
条件でチタン材に銅メッキを施した。得られた銅メッキ
被膜の厚さを表２に併記する。Example C] A plating solution having a composition shown in Table 1 below was prepared, and a titanium material was plated with copper under the conditions shown in Table 2. The thickness of the obtained copper plating film is also listed in Table 2.
表 １
１ １５ ３０ １５ 残部２ ２
０ ４５ １４ 残部３ ２５ ５０ ｔ
ｏ ・１
表 ２
［発明の効果］
以上述べたように、この発明のメッキ液組成物によれば
、置換メッキにより１段階で、短時間にチタン材に対し
て銅メッキを施すことができる。Table 1 1 15 30 15 Remainder 2 2
0 45 14 remaining 3 25 50 t
o・1 Table 2 [Effects of the Invention] As described above, according to the plating solution composition of the present invention, copper plating can be applied to a titanium material in a short time in one step by displacement plating.
Claims (1)
液組成物であって、１５ないし２５重量％の銅イオンを
提供するに充分な量の銅イオン源、硝酸３０ないし５０
重量％、フッ酸１０〜１５重量％、酢酸０ないし４重量
％および水残部よりなることを特徴とするチタン材の銅
メッキ液組成物。A plating solution composition for performing copper plating on titanium material in one step, the composition comprising a copper ion source in an amount sufficient to provide 15 to 25% by weight of copper ions, and 30 to 50% nitric acid.
1. A copper plating solution composition for titanium material, comprising: 10 to 15% by weight of hydrofluoric acid, 0 to 4% by weight of acetic acid, and the balance of water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6515586A JPS62222082A (en) | 1986-03-24 | 1986-03-24 | Composition of chemical copper plating solution for titanium material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6515586A JPS62222082A (en) | 1986-03-24 | 1986-03-24 | Composition of chemical copper plating solution for titanium material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62222082A true JPS62222082A (en) | 1987-09-30 |
Family
ID=13278705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6515586A Pending JPS62222082A (en) | 1986-03-24 | 1986-03-24 | Composition of chemical copper plating solution for titanium material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62222082A (en) |
-
1986
- 1986-03-24 JP JP6515586A patent/JPS62222082A/en active Pending
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