JPS62217700A - Electronic circuit device - Google Patents
Electronic circuit deviceInfo
- Publication number
- JPS62217700A JPS62217700A JP5940886A JP5940886A JPS62217700A JP S62217700 A JPS62217700 A JP S62217700A JP 5940886 A JP5940886 A JP 5940886A JP 5940886 A JP5940886 A JP 5940886A JP S62217700 A JPS62217700 A JP S62217700A
- Authority
- JP
- Japan
- Prior art keywords
- electronic
- electronic circuit
- circuit device
- resin material
- conductive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 229910000679 solder Inorganic materials 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 229920006380 polyphenylene oxide Polymers 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は、電子部品相互を導電性樹脂材料で接続・保持
させてなる電子回路装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to an electronic circuit device in which electronic components are connected and held together using a conductive resin material.
（従来の技術）
近年、電子機器の回路部分には、プリント回路基板に電
子部品を実装した電子回路装置が多用されている。 そ
れは、例えば第６図のブロック図に示すような工程を経
て製造されている。 すなわち、まず、紙やガラスクロ
ス等の基材にフェノール系やエポキシ系の樹脂ワニスを
含浸乾燥させて半硬化状態のプリプレグとし、このプリ
プレグの複数枚と銅箔とを重ね合わせ、加熱加圧一体化
して銅張積層板をつくる。 次いでこの銅張積層板をエ
ツチング法により、その銅箔面に所定の回路パターンを
形成して回路基板とする。 さらにこの回路基板に電子
部品挿入用の穴をあけ、この穴に電子部品のリードを挿
入し、電子部品の裏面側からリードを回路に半田で固定
して従来の電子回路装置がつくられている。(Prior Art) In recent years, electronic circuit devices in which electronic components are mounted on printed circuit boards have been frequently used in the circuit portions of electronic devices. It is manufactured through the steps shown in the block diagram of FIG. 6, for example. That is, first, a base material such as paper or glass cloth is impregnated with phenolic or epoxy resin varnish and dried to form a semi-cured prepreg, and multiple sheets of this prepreg and copper foil are stacked together and heated and pressed together. to produce copper-clad laminates. Next, a predetermined circuit pattern is formed on the copper foil surface of this copper-clad laminate by an etching method to form a circuit board. A conventional electronic circuit device is then created by drilling holes in this circuit board for inserting electronic components, inserting electronic component leads into these holes, and fixing the leads to the circuit from the back of the electronic component with solder. .
（発明が解決しようとする問題点）
しかしながら、このようなプリント回路基板に実装した
従来の電子回路装置は、上記のように電子部品の固定を
半田で行っているために、構成材料としてのプリント回
路基板に半田浴の温度に耐えるだけの耐熱特性が要求さ
れるという問題がある。 すなわち、電子回路装置の実
際の使用温度は常温付近であって、特に耐熱性が要求さ
れないにもかかわらず、製造工程上半田浴に浸漬される
ため、その温度に耐えるだけの耐熱特性が要求される。(Problem to be Solved by the Invention) However, in conventional electronic circuit devices mounted on such printed circuit boards, electronic components are fixed with solder as described above, so printed circuit boards as constituent materials are not used. There is a problem in that the circuit board is required to have heat resistance characteristics sufficient to withstand the temperature of the solder bath. In other words, although the actual operating temperature of electronic circuit devices is around room temperature and no particular heat resistance is required, they are immersed in a solder bath during the manufacturing process, so they are required to have heat resistance characteristics that can withstand that temperature. Ru.
そのために基板材料として高価な熱硬化性樹脂を用い
る必要があったのであり、これが電子回路装置のコスト
上昇の原因となるという問題があった。Therefore, it was necessary to use an expensive thermosetting resin as the substrate material, which caused the problem of increasing the cost of the electronic circuit device.
（発明の目的）
本発明は、このような従来電子回路装置の問題点に対処
してなされたもので、使用材料に半田浴の高温に耐え得
る耐熱特性が要求されることがなく、工程的にも半田浴
に浸漬することなく容易に製造することができ、コスト
上昇を抑制することができる電子回路装置を提供するこ
とを目的としている。(Purpose of the Invention) The present invention has been made to address the problems of conventional electronic circuit devices, and it does not require the materials used to have heat resistance properties that can withstand the high temperatures of the solder bath. Another object of the present invention is to provide an electronic circuit device that can be easily manufactured without being immersed in a solder bath, and can suppress cost increases.
［発明の構成］
（問題点を解決するための手段）
本発明者は、コスト上昇を防ぐため、半田浴浸漬による
加熱を回避し、熱硬化性樹脂のプリント基板を使用しな
い方法に着目して鋭意検討を重ねた結果、熱可塑性など
のＳ電性樹脂材料の成形によって電子回路を形成すれば
、１回の成形でその電子回路の形成と同時に電子部品相
互の保持も行うことができ、工程的にもコスト上昇を防
止できることを見いだし、本発明を完成するに至ったも
のである。 即ち、本発明は、リード端子を有する電子
部品を複数個配置し、これらの電子部品の各リード端子
間を電気的に接続する回路部と各電子部品本体を相互に
保持するブリッジ部とを、導電性樹脂材料で成形してな
ることを特徴とする電子回路装置である。[Structure of the Invention] (Means for Solving the Problems) In order to prevent cost increases, the present inventor has focused on a method that avoids heating by immersion in a solder bath and does not use a thermosetting resin printed circuit board. As a result of extensive research, we found that if an electronic circuit is formed by molding an S-conductive resin material such as thermoplastic, it is possible to form the electronic circuit and hold the electronic components together in a single molding process. The present invention was completed based on the discovery that cost increases can also be prevented. That is, in the present invention, a plurality of electronic components having lead terminals are arranged, and a circuit section that electrically connects the respective lead terminals of these electronic components and a bridge section that mutually holds each electronic component body are provided. This is an electronic circuit device characterized by being molded from a conductive resin material.
（作用）
本発明の電子回路装置は、熱可塑性などの導電性樹脂材
料を用いて複数の電子部品を一体に成形するため、従来
のように電子部品挿入用の孔を開けたりリードを挿入し
たりする繁雑な工程の必要がなく、また電子部品を固定
するために半田浴に浸漬し固定する熱的に苛酷な工程の
必要がない。(Function) The electronic circuit device of the present invention integrally molds a plurality of electronic components using a conductive resin material such as thermoplastic. There is no need for a complicated process to fix the electronic parts, and there is no need for a thermally harsh process to fix the electronic parts by dipping them in a solder bath.
また導電性樹脂材料には安価な熱可塑性樹脂も用いられ
るためコスト上昇を防止できる。Moreover, since an inexpensive thermoplastic resin is also used as the conductive resin material, an increase in cost can be prevented.
（実施例） 以下、本発明の実施例を図面を参照しながら説明する。(Example) Embodiments of the present invention will be described below with reference to the drawings.
第１図及び第２図は、本発明の電子回路装置の一実施例
を示す断面図及び底面図である。1 and 2 are a sectional view and a bottom view showing an embodiment of an electronic circuit device of the present invention.
垣１図及び第２図において、リード端子１ａを有する抵
抗、コンデンサ、トランジスタ、ＩＣ等の電子部品１は
、所定の位置に数個配置され、導電性樹脂材料２の成形
により回路部へが電子部品を電気的に接続しており、か
つブリッジ部Ｂが本体相互を保持している。 ここで使
用する導電性樹脂材料としては、ポリスチレン、ＡＢＳ
１ポリプロピレン、ポリフェニレンオキサイド、変性ポ
リフェニレンオキサイド等の熱可塑性樹脂などに銅、鉄
、ステンレス等の導電性粉末あるいは導電性１ｍ紺を配
合したものを使用する。In Figures 1 and 2, several electronic components 1, such as resistors, capacitors, transistors, and ICs, having lead terminals 1a are placed at predetermined positions, and electronic components are connected to the circuit section by molding a conductive resin material 2. The components are electrically connected, and the bridge portion B holds the main bodies together. The conductive resin materials used here include polystyrene, ABS
1. A thermoplastic resin such as polypropylene, polyphenylene oxide, modified polyphenylene oxide, etc. mixed with conductive powder of copper, iron, stainless steel, or conductive 1m navy blue is used.
この電子回路装置は、例えば第３図に示すような金型を
用いて、次のようにして製造することができる。 第３
図の金型は、可動側取付板３に取り付けられた可動側型
４と、固定側取付板５にスペーサ６を介して取り付けら
れた固定側型７と、射出成形機ノズルに接続可能なスプ
ルーブツシュ８と、樹脂通路９とからなる通常の射出成
形用金型である。 可動側型４の内面には、電子部品１
を保持可能な電子部品嵌合凹部１０が設けられており、
他方固定側型７の内面には、導電性樹脂材料によって成
形される回路部Ａ及び電子部品１の本体相互を連結する
ブリッジ部Ｂに対応する形状のキャビティ１１が形成さ
れている。This electronic circuit device can be manufactured in the following manner using, for example, a mold as shown in FIG. Third
The mold shown in the figure consists of a movable mold 4 attached to a movable mounting plate 3, a fixed mold 7 attached to a fixed mounting plate 5 via a spacer 6, and a sprue that can be connected to an injection molding machine nozzle. This is a normal injection mold consisting of a bush 8 and a resin passage 9. On the inner surface of the movable side mold 4, electronic components 1 are placed.
An electronic component fitting recess 10 capable of holding an electronic component is provided,
On the other hand, a cavity 11 is formed on the inner surface of the fixed mold 7 and has a shape corresponding to a bridge part B that connects the circuit part A molded from a conductive resin material and the main body of the electronic component 1 to each other.
こうして、まず可動側型の第４図上面図及び第５置所面
図（第４図のＩ−Ｉ矢視）に示すように、所定の電子部
品１を可動側型４の電子部品嵌合凹部１０に、リード端
子１ａが上面より露出するようにして装着する。 つい
で図示を省略した射出成形機のノズルを第３図のスプル
ーブツシュ８に接続し、射出成形機により加熱溶融され
た導電性樹脂材料２をキャビティ１１内に充填して冷却
固化させた後、金型を開放して成形した電子回路装置を
取り出すことができる。 このような電子回路装置では
、その製造工程で受ける温度が半田浴温度に比較して低
いため、電子回路装置の構成材料の選択等にあたって耐
熱性をさほど考慮する必要がなく経済的に有利である。In this way, first, as shown in the top view of the movable mold 4 in FIG. The lead terminal 1a is attached to the recess 10 so as to be exposed from the upper surface. Next, the nozzle of an injection molding machine (not shown) is connected to the sprue bush 8 of FIG. 3, and the conductive resin material 2 heated and melted by the injection molding machine is filled into the cavity 11 and cooled and solidified. The mold can be opened and the molded electronic circuit device can be taken out. Since the temperature that such electronic circuit devices undergo during the manufacturing process is lower than the solder bath temperature, there is no need to take heat resistance into consideration when selecting constituent materials of electronic circuit devices, which is economically advantageous. .
次に本発明を具体的にした例について記載する。Next, a concrete example of the present invention will be described.
第３図に示した金型の可動側型内面に回路形成に必要な
抵抗、コンデンサ、コイル、トランジスタ、［Ｃ、コネ
クタ等の各種電子部品４０個を装着した後、金型を閉じ
変性ポリフェニレンオキサイド系導電性樹脂材料ＥＣ−
３１４０＜東芝ケミカル社製、商品名）を用いて射出成
形し、電子回路装置を製造した。 この電子回路装置は
、自己保持性を有し、かつ所期の機能を発揮した。After installing 40 various electronic components such as resistors, capacitors, coils, transistors, connectors, etc. necessary for circuit formation on the inner surface of the movable side of the mold shown in Figure 3, the mold is closed and modified polyphenylene oxide is used. Conductive resin material EC-
3140 (manufactured by Toshiba Chemical Co., Ltd., trade name) to manufacture an electronic circuit device. This electronic circuit device had self-retention properties and exhibited the expected function.
上記の実施例では回路部Ａ及びブリッジ部Ｂを１３ ’
Ｒ性樹脂材料のみで形成した例について説明したが、必
要に応じて金属線その他の部材をこの部分に埋入させて
、導電性及び機械的強度を向上させることも可能である
。In the above embodiment, the circuit section A and the bridge section B are 13'
Although an example has been described in which it is formed only of R resin material, it is also possible to embed metal wires or other members in this portion as necessary to improve conductivity and mechanical strength.
［発明の効果］
以上説明したように本発明の電子回路装置によれば、導
電性樹脂材料で回路部を成形して電気的に接続したこと
によって、電子回路装置の構成材料に従来装置における
ように半田浴浸漬に耐える耐熱特性が要求されることは
なくなり、また１回の成形によって同時に電子部品本体
相互の固定もできるため、経済性も極めて高いものであ
る。[Effects of the Invention] As explained above, according to the electronic circuit device of the present invention, the circuit portion is molded with a conductive resin material and electrically connected, so that the constituent materials of the electronic circuit device can be used as in conventional devices. It is no longer required to have heat resistance properties that can withstand immersion in a solder bath, and electronic component bodies can be fixed to each other at the same time by one molding process, making it extremely economical.
第１図は本発明の電子回路装置の一実施例を示す断面図
（第２図Ｘ−Ｘ矢視）、第２図は第１図装置の底面図、
第３図乃至第５図は本発明実施例の製造方法を説明する
図、第６図は従来の電子回路装置の製造工程を示すブロ
ック工程図である。
１・・・電子部品、 １ａ・・・リード端子、 ２・・
・導電性樹脂材料、 Ａ・・・回路部、 Ｂ・・・ブリ
ッジ部。
特許出願人 東芝ケミカル株式会社
第１＠
第２尺
第３図
第４図
第５図FIG. 1 is a cross-sectional view showing an embodiment of the electronic circuit device of the present invention (as viewed from the arrow X-X in FIG. 2), FIG. 2 is a bottom view of the device shown in FIG. 1,
3 to 5 are diagrams for explaining the manufacturing method of the embodiment of the present invention, and FIG. 6 is a block process diagram showing the manufacturing process of a conventional electronic circuit device. 1...Electronic component, 1a...Lead terminal, 2...
- Conductive resin material, A...Circuit part, B...Bridge part. Patent applicant: Toshiba Chemical Corporation No. 1 @ 2nd scale Figure 3 Figure 4 Figure 5
Claims (1)
らの電子部品の各リード端子間を電気的に接続する回路
部と各電子部品本体を相互に保持するブリッジ部とを、
導電性樹脂材料で成形してなることを特徴とする電子回
路装置。1. A plurality of electronic components having lead terminals are arranged, and a circuit section that electrically connects the lead terminals of these electronic components and a bridge section that mutually holds each electronic component body,
An electronic circuit device characterized by being molded from a conductive resin material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61059408A JPH07120862B2 (en) | 1986-03-19 | 1986-03-19 | Electronic circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61059408A JPH07120862B2 (en) | 1986-03-19 | 1986-03-19 | Electronic circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62217700A true JPS62217700A (en) | 1987-09-25 |
| JPH07120862B2 JPH07120862B2 (en) | 1995-12-20 |
Family
ID=13112422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61059408A Expired - Lifetime JPH07120862B2 (en) | 1986-03-19 | 1986-03-19 | Electronic circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07120862B2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5856449A (en) * | 1981-09-30 | 1983-04-04 | Nec Corp | Semiconductor device |
| JPS5856398A (en) * | 1981-09-29 | 1983-04-04 | ティーディーケイ株式会社 | Method of producing electronic circuit part |
-
1986
- 1986-03-19 JP JP61059408A patent/JPH07120862B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5856398A (en) * | 1981-09-29 | 1983-04-04 | ティーディーケイ株式会社 | Method of producing electronic circuit part |
| JPS5856449A (en) * | 1981-09-30 | 1983-04-04 | Nec Corp | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07120862B2 (en) | 1995-12-20 |
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