JPS62216796A - Manufacture of supporter for planograph plate - Google Patents
Manufacture of supporter for planograph plateInfo
- Publication number
- JPS62216796A JPS62216796A JP6109986A JP6109986A JPS62216796A JP S62216796 A JPS62216796 A JP S62216796A JP 6109986 A JP6109986 A JP 6109986A JP 6109986 A JP6109986 A JP 6109986A JP S62216796 A JPS62216796 A JP S62216796A
- Authority
- JP
- Japan
- Prior art keywords
- acid
- aqueous solution
- treatment
- plate
- aluminum substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 30
- 150000003839 salts Chemical class 0.000 claims abstract description 23
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 21
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 19
- 239000007864 aqueous solution Substances 0.000 claims abstract description 15
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims abstract description 6
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052788 barium Inorganic materials 0.000 claims abstract description 6
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052791 calcium Inorganic materials 0.000 claims abstract description 6
- 239000011575 calcium Substances 0.000 claims abstract description 6
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 6
- 239000011777 magnesium Substances 0.000 claims abstract description 6
- 150000007522 mineralic acids Chemical class 0.000 claims abstract description 6
- 150000007524 organic acids Chemical class 0.000 claims abstract description 5
- 229910052712 strontium Inorganic materials 0.000 claims abstract description 5
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 claims abstract description 5
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 4
- 239000011572 manganese Substances 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 21
- 239000011347 resin Substances 0.000 abstract description 13
- 229920005989 resin Polymers 0.000 abstract description 13
- 230000003647 oxidation Effects 0.000 abstract description 7
- 238000007254 oxidation reaction Methods 0.000 abstract description 7
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 150000002739 metals Chemical class 0.000 abstract description 3
- 150000001875 compounds Chemical class 0.000 abstract 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- -1 aluminum ions Chemical class 0.000 description 8
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 6
- 239000000243 solution Substances 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 238000002048 anodisation reaction Methods 0.000 description 4
- 238000007743 anodising Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000003792 electrolyte Substances 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 238000005238 degreasing Methods 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 235000015165 citric acid Nutrition 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 239000008151 electrolyte solution Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229920001477 hydrophilic polymer Polymers 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- NROKBHXJSPEDAR-UHFFFAOYSA-M potassium fluoride Chemical compound [F-].[K+] NROKBHXJSPEDAR-UHFFFAOYSA-M 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- QBYIENPQHBMVBV-HFEGYEGKSA-N (2R)-2-hydroxy-2-phenylacetic acid Chemical compound O[C@@H](C(O)=O)c1ccccc1.O[C@@H](C(O)=O)c1ccccc1 QBYIENPQHBMVBV-HFEGYEGKSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- WTQZSMDDRMKJRI-UHFFFAOYSA-N 4-diazoniophenolate Chemical compound [O-]C1=CC=C([N+]#N)C=C1 WTQZSMDDRMKJRI-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- OYHQOLUKZRVURQ-HZJYTTRNSA-N Linoleic acid Chemical compound CCCCC\C=C/C\C=C/CCCCCCCC(O)=O OYHQOLUKZRVURQ-HZJYTTRNSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- IWYDHOAUDWTVEP-UHFFFAOYSA-N R-2-phenyl-2-hydroxyacetic acid Natural products OC(=O)C(O)C1=CC=CC=C1 IWYDHOAUDWTVEP-UHFFFAOYSA-N 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- ZZAGLMPBQOKGGT-UHFFFAOYSA-N [4-[4-(4-prop-2-enoyloxybutoxy)benzoyl]oxyphenyl] 4-(4-prop-2-enoyloxybutoxy)benzoate Chemical group C1=CC(OCCCCOC(=O)C=C)=CC=C1C(=O)OC(C=C1)=CC=C1OC(=O)C1=CC=C(OCCCCOC(=O)C=C)C=C1 ZZAGLMPBQOKGGT-UHFFFAOYSA-N 0.000 description 1
- CAKJEGSGMRHDLS-UHFFFAOYSA-N [K].[Cr].[Cr] Chemical compound [K].[Cr].[Cr] CAKJEGSGMRHDLS-UHFFFAOYSA-N 0.000 description 1
- DPXJVFZANSGRMM-UHFFFAOYSA-N acetic acid;2,3,4,5,6-pentahydroxyhexanal;sodium Chemical compound [Na].CC(O)=O.OCC(O)C(O)C(O)C(O)C=O DPXJVFZANSGRMM-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052910 alkali metal silicate Inorganic materials 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 239000010407 anodic oxide Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- IVRMZWNICZWHMI-UHFFFAOYSA-N azide group Chemical group [N-]=[N+]=[N-] IVRMZWNICZWHMI-UHFFFAOYSA-N 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 1
- 229940092714 benzenesulfonic acid Drugs 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N cinnamic acid group Chemical group C(C=CC1=CC=CC=C1)(=O)O WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 239000000174 gluconic acid Substances 0.000 description 1
- 235000012208 gluconic acid Nutrition 0.000 description 1
- 229910000042 hydrogen bromide Inorganic materials 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 229910000043 hydrogen iodide Inorganic materials 0.000 description 1
- 230000005660 hydrophilic surface Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- OYHQOLUKZRVURQ-IXWMQOLASA-N linoleic acid Natural products CCCCC\C=C/C\C=C\CCCCCCCC(O)=O OYHQOLUKZRVURQ-IXWMQOLASA-N 0.000 description 1
- 235000020778 linoleic acid Nutrition 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 229960002510 mandelic acid Drugs 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 239000005365 phosphate glass Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 239000011698 potassium fluoride Substances 0.000 description 1
- 235000003270 potassium fluoride Nutrition 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000019812 sodium carboxymethyl cellulose Nutrition 0.000 description 1
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 229940032330 sulfuric acid Drugs 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N3/00—Preparing for use and conserving printing surfaces
- B41N3/03—Chemical or electrical pretreatment
- B41N3/034—Chemical or electrical pretreatment characterised by the electrochemical treatment of the aluminum support, e.g. anodisation, electro-graining; Sealing of the anodised layer; Treatment of the anodic layer with inorganic compounds; Colouring of the anodic layer
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は平版印刷版用支持体の製造方法に関するもので
あシ、特に感光性樹脂組成物に対する接着性の改善され
た支持体の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for producing a support for lithographic printing plates, and in particular a method for producing a support with improved adhesion to photosensitive resin compositions. It is related to.
(従来の技術〕
現在、平版印刷版用の支持体は、耐刷性の向上や保水性
の向上等を目的として、陽極酸化処理を施すのが一般的
である。(Prior Art) Currently, supports for lithographic printing plates are generally subjected to anodizing treatment for the purpose of improving printing durability and water retention.
陽極酸化処理は、アルミニウム基板を陽極とし、電解液
を介して直流、交流又は交直重畳等によシ通電すること
によシ行なわれる。その際の電解液としては、硫酸又は
、リン酸の使用が一般的である。これらのうち、硫酸陽
極酸化処理は、低電圧処理が可能で、耐摩耗性に侵れる
酸化皮膜が得られることから、工業的な陽極酸化法とし
て最も一般的で、ジアゾ糸ネガ型PS版、キノンジアジ
ド系ポジ型28版等の支持体の製造に広く使用されてい
る。しかしながら、この硫酸陽極欧化処理は、多くの高
分子感光性樹脂に対して接着性が悪いという大きな欠点
があシ、高耐φ11力の印刷版は得られていなかった。The anodic oxidation treatment is carried out by using an aluminum substrate as an anode and energizing the aluminum substrate through an electrolytic solution by direct current, alternating current, AC/DC superposition, or the like. As the electrolyte in this case, sulfuric acid or phosphoric acid is generally used. Among these, sulfuric acid anodizing is the most common industrial anodizing method because it allows low-voltage treatment and produces an oxide film that is wear-resistant. It is widely used in the production of supports such as quinone diazide positive type 28 plates. However, this sulfuric acid anodic treatment has the major drawback of poor adhesion to many polymeric photosensitive resins, and a printing plate with high resistance to φ11 force has not been obtained.
一方、リン酸陽極は化処理の酸化皮膜は、高分子感光性
樹脂に対して良好な接着性を有するが、リン酸陽極戚化
処理はリン酸の電導度が低いために極めて高い電圧が必
要であること、リン酸が比較的高価であること、処理時
に蓄積されるアルミニウムイオンの影響を受は易く電解
液の性状管理が難かしいこと等の点で、処理のコストが
高く、工業的には不利な方法である。On the other hand, the oxidized film of the phosphoric acid anode has good adhesion to the polymer photosensitive resin, but the oxidized film of the phosphoric acid anode requires extremely high voltage due to the low conductivity of phosphoric acid. The process is expensive, phosphoric acid is relatively expensive, and it is difficult to control the properties of the electrolyte because it is easily affected by aluminum ions that accumulate during the process. is a disadvantageous method.
本発明が解決しようとする問題点は、砂目立て処理の後
に硫酸陽極欧化処理した印刷版用アルミニウム基板の感
光性樹脂に対する接着性全改善することにある。The problem to be solved by the present invention is to completely improve the adhesion to a photosensitive resin of an aluminum substrate for a printing plate which has been subjected to a sulfuric acid anodization treatment after a graining treatment.
本発明は、上記問題点を解決するだめの手段としてアル
ミニウム基板を、
(at 砂目立て処理し、
(bl 硫酸陽極酸化処理し、
(c) カルシウム、バリウム、マグネシウム、スト
ロンチウム及びマンガンよシなる群から選ばれる1洩以
上の金属と有機酸又は無機ばとの塩を宮む水溶液(以下
、金属塩水溶液という。)で処理することを特徴とする
平版印刷版用支持体の製造方法を提供する。As a means to solve the above-mentioned problems, the present invention provides that an aluminum substrate is subjected to (at) graining treatment, (bl) sulfuric acid anodization treatment, and (c) calcium, barium, magnesium, strontium, and manganese. Provided is a method for producing a support for a lithographic printing plate, characterized in that it is treated with an aqueous solution containing a salt of one or more selected metals and an organic acid or an inorganic acid (hereinafter referred to as metal salt aqueous solution).
本発明で使用される金属塩とは、有機酸又は無機酸のカ
ルシウム、バリウム、マグネシウム、ストロンチウム又
ハマンガン塩であり、有機叡としては、例えば、ギ酸、
酢酸、プロピオン酸、酪眩、ラウリン酸、バルミチン酸
、ステアリ/V等の脂肪族モノカルボン酸類;オレイン
酸、リノール酸等の不飽和脂肪族モノカルボンは類;ク
エン酸、コハク酸、アジピン酸、マレイン酸の如き脂肪
族ジカルボン戚a;乳戚、グルコン酸、リンゴ酸、酒石
酸、クエン酸の如きオキシカルボン酸類:安息壱咳、マ
ンデル寂、サリチル取、フタル醒等の芳香族カルボン酸
類が挙げられ、無機酸としては、硫酸;硝酸;堪化水素
酸、臭化水素は、ヨウ化水素V等のハロゲン化水索酸類
;塩累酸、ヨウ素ば、臭素酸等のハロゲン陳累叡類が挙
けられる。これらのうち、カルシウム又は、バリウムの
有機酸塩が好ましく、中でも脂肪族モノカルボンr!R
塩が特に好ましい。本発明においてこれらの如き金属塩
は、二種以上を併用してもさしつかえない。The metal salt used in the present invention is a calcium, barium, magnesium, strontium or hamanganate salt of an organic or inorganic acid, and examples of the organic salt include formic acid,
Aliphatic monocarboxylic acids such as acetic acid, propionic acid, butyric acid, lauric acid, valmitic acid, and stearic acid; unsaturated aliphatic monocarboxylic acids such as oleic acid and linoleic acid; citric acid, succinic acid, adipic acid, Aliphatic dicarboxylic acids such as maleic acid; oxycarboxylic acids such as lactic acid, gluconic acid, malic acid, tartaric acid, and citric acid; aromatic carboxylic acids such as sulfuric acid, mandelic acid, salicylic acid, and phthalic acid. Inorganic acids include sulfuric acid; nitric acid; hydrochloric acid, hydrogen bromide, halogenated acids such as hydrogen iodide; I get kicked. Among these, organic acid salts of calcium or barium are preferred, and among them, aliphatic monocarboxylic acid salts are preferred! R
Salts are particularly preferred. In the present invention, two or more of these metal salts may be used in combination.
本発明に用いられる金属塩水溶液中の前記の如き金属塩
の濃度は、o、oi〜20重量%が好ましく、01〜1
01(量%がさらに好ましい。The concentration of the metal salt as described above in the aqueous metal salt solution used in the present invention is preferably o, oi to 20% by weight, and 0.1 to 1.
01 (amount % is more preferable.
本発明における金属塩水溶液による処理方法(以下、金
属塩処理という。)としては、例えば、従来公知の種々
の方法で砂目立て処理し、硫酸陽極酸化処理したアルミ
ニウム基板を金属塩水溶液中に浸漬する方法が挙げられ
、その際の浸漬浴の温度は40〜120℃が好適であシ
、浸漬時間は5秒〜10分が好適である。The treatment method using a metal salt aqueous solution (hereinafter referred to as metal salt treatment) in the present invention includes, for example, immersing an aluminum substrate that has been grained by various conventionally known methods and subjected to sulfuric acid anodization treatment in a metal salt aqueous solution. The temperature of the immersion bath at that time is preferably 40 to 120°C, and the immersion time is preferably 5 seconds to 10 minutes.
本発明に使用されるアルミニウム基板としては、従来公
知の平版印刷版用アルミニウム基板はいずれも使用でき
、例えば、純アルミニウム板や、アルミニウムを主成分
とし少葉の異原子(ケイ素、マンガン、鉄、鋼、マグネ
シウム、クロム、亜鉛、ニッケル、チタン等)′t−含
むアルミニウム合金板等が挙げられる。As the aluminum substrate used in the present invention, any conventionally known aluminum substrate for lithographic printing plates can be used. Examples include aluminum alloy plates containing aluminum (steel, magnesium, chromium, zinc, nickel, titanium, etc.).
アルミニウム板の表面は、油脂、サビ、ゴミなどにょシ
汚染されているため、必要に応じて、溶剤脱脂、アルカ
リ脱脂等の脱脂処理を施した後、砂目立て処理を行なう
。Since the surface of the aluminum plate is contaminated with oil, rust, dust, etc., it is subjected to degreasing treatment such as solvent degreasing or alkaline degreasing, as necessary, and then graining treatment.
本発明で行なわれる砂目立て処理は、一般に、従来公知
の平版印刷版用基板の砂目立て方法のいずれによシ行っ
てもさしつかえなく、例えば、ボール研尾法、ブラシ研
摩法、プラスト研摩法、パフ研摩法、液体ホーニング法
等の機械的粗面化法;環数、硝酸、又は、これらの混合
物等よプなる寛解浴中に浸漬させ粗面化する電気化学的
粗面化法が挙げられる。In general, the graining treatment carried out in the present invention may be performed by any of the conventionally known graining methods for lithographic printing plate substrates, such as ball polishing method, brush polishing method, plastic polishing method, Mechanical surface roughening methods such as puff polishing and liquid honing methods; electrochemical surface roughening methods that roughen the surface by immersing it in a softening bath such as ring number, nitric acid, or a mixture thereof. .
さらに、この砂目立て処理の後、必要に応じて従来公知
の方法に従って、水酸化ナトリウム、水酸化カリウム、
第3リン酸す) IJウムの如きアルカリの水溶液でエ
ツチング処理(その後、デスマット処理を行なう。)を
施してもさしつかえない。このエツチング処理は、必ら
ずしも行なわなければならないものではないが、非画像
部の親水性をよシ高めたい場合には、この処理を行なう
のが、有利である。Furthermore, after this graining treatment, sodium hydroxide, potassium hydroxide,
Etching treatment (followed by desmutting treatment) with an aqueous alkali solution such as IJum (tertiary phosphoric acid) may also be performed. Although this etching process is not necessarily performed, it is advantageous to perform this process when it is desired to improve the hydrophilicity of the non-image area.
さらに引き続いてこのアルミニウム基板に硫酸陽極酸化
処理を施す。4JfL敵陽極酸化処理方法としては、従
来公知の方法によシ行なうことができ、例えば、アルミ
ニウム基板を陽極とし、炭素、鉛叫を陰極として、硫は
電解液中で、電〆e’r流すことによシ、アルミニウム
基板表面に陽極酸化被Mを形成させることができる。そ
の際、硫酸電解液中にハ、クロム酸、蓚酸、スルファミ
ンヒ、ベンゼンスルホン酸、リン酸等を少量含んでいて
もさしつかえない。陽極酸化処理条件は、電解質濃度1
〜80重量%、液温5〜70℃、電流密度[L5〜5D
A/dm” 、電圧1〜100■、電解時間30秒〜3
0分の範囲が好ましく、陽極酸化皮膜の重量としては、
01〜10 fI/m”の範囲が好lしい。Furthermore, this aluminum substrate is subsequently subjected to sulfuric acid anodic oxidation treatment. 4JfL anodic oxidation treatment can be carried out by a conventionally known method. For example, an aluminum substrate is used as an anode, carbon or lead is used as a cathode, and sulfur is placed in an electrolytic solution, and an electric current is passed through it. In particular, it is possible to form an anodized layer M on the surface of the aluminum substrate. In this case, the sulfuric acid electrolyte may contain a small amount of chromic acid, oxalic acid, sulfamic acid, benzenesulfonic acid, phosphoric acid, etc. The anodizing treatment conditions are an electrolyte concentration of 1
~80% by weight, liquid temperature 5~70°C, current density [L5~5D
A/dm", voltage 1~100■, electrolysis time 30 seconds~3
A range of 0 minutes is preferable, and the weight of the anodic oxide film is as follows:
A range of 01 to 10 fI/m'' is preferred.
このようにして、得られたアルミニウム基板に引き続い
て前記の如き金属塩処理を施すことによシ本発明の目的
は達成される。The object of the present invention is achieved by subsequently subjecting the obtained aluminum substrate to the metal salt treatment as described above.
本発明による金属塩処理を行なった支持体は、表面が良
好な親水性を示し、かつ、感光性樹脂組成物との接着性
が高く、このまま平版印−j1版用支持体として使用で
きるが、つかえない。The support treated with metal salt according to the present invention has a good hydrophilic surface and high adhesion to the photosensitive resin composition, and can be used as it is as a support for lithographic printing-J1 plate. can not use.
適当な親水化処理剤としては、従来公知のものを使用す
ることができ、例えば、珪はソーダの如きアルカリ金属
珪叡塩;弗化ジルコニウム正カリウム;リン酸ガラス:
重クロム散カリウム;ゼラチン、ポリビニルピロリドン
、ポリアクリル酸ナトリウム、カルボキシメチルセルロ
ースのナトリウム塩、ポリアクリルアミド、ポリビニル
アルコール、ポリビニルベンゼンスルホンばナトリウム
等の親水性高分子などが挙げられる。As a suitable hydrophilic treatment agent, conventionally known ones can be used, for example, silicon is an alkali metal silicate such as soda; zirconium positive potassium fluoride; phosphate glass:
Potassium dichromium powder: hydrophilic polymers such as gelatin, polyvinylpyrrolidone, sodium polyacrylate, sodium salt of carboxymethyl cellulose, polyacrylamide, polyvinyl alcohol, and sodium polyvinylbenzenesulfonate.
前記親水化処理剤は、一般に水溶液として、室温又は1
00℃以下の温度で処理される。親水化処理剤水浴液の
濃度としては、cL001〜20重量%、また処理時間
としては、5秒〜10分が好ましい。その後、水洗、乾
燥して、平版印刷版用基板が得られる。The hydrophilic treatment agent is generally prepared as an aqueous solution at room temperature or at 1
Processed at temperatures below 00°C. The concentration of the hydrophilic treatment agent water bath solution is preferably cL001 to 20% by weight, and the treatment time is preferably 5 seconds to 10 minutes. Thereafter, the substrate is washed with water and dried to obtain a lithographic printing plate substrate.
また、親水化処理剤が親水性高分子の場合には、前記親
水化処理法とは別に、処理後、水洗することなく、下塗
υ層とすることも可能である。この場合、塗布量は、5
〜150m9/m!が好ましい。Furthermore, when the hydrophilic treatment agent is a hydrophilic polymer, it is also possible to form an undercoat υ layer without washing with water after the treatment, apart from the above-mentioned hydrophilic treatment method. In this case, the coating amount is 5
~150m9/m! is preferred.
このようにして製造された平版印刷版用支持体は、従来
の硫酸陽極酸化処理した支持体において、接着性の悪か
った光架橋型の高分子感光性樹脂、例えば、ケイ皮酸残
基を高分子構造中に有する感光性樹’Jr1(%開昭5
0−6404号、特開昭52−86488号等に記載の
感光性樹脂)、フェニン/ジアクリル酸残基を高分子構
造中に有する感光性樹脂(特開昭52−112681号
、特開昭58−185198号、特開昭60−1385
42号、特開昭60−165646号、特開昭60−1
91244号等に記載の感光性樹脂)等の芳香核に隣接
した感光性不飽和二重結合を有するg光性樹脂;感光性
アジド基を高分子構造中に有する感光性樹脂(特公昭5
8−52210号、特公昭44−31837、特公昭4
3−21067等に記載の感光性樹脂)等に対しても浚
れた接着性を有するものである。The support for a lithographic printing plate produced in this way is a photo-crosslinkable polymeric photosensitive resin that has poor adhesion in conventional supports treated with sulfuric acid anodization, such as cinnamic acid residues. Photosensitive tree 'Jr1 (% Kaisho 5
0-6404, JP-A-52-86488, etc.), photosensitive resins having phenine/diacrylic acid residues in the polymer structure (JP-A-52-112681, JP-A-58-1988) No.-185198, JP-A-60-1385
No. 42, JP-A-60-165646, JP-A-60-1
91244, etc.); photosensitive resins having a photosensitive unsaturated double bond adjacent to an aromatic nucleus; photosensitive resins having a photosensitive azide group in the polymer structure;
No. 8-52210, Special Publication No. 44-31837, Special Publication No. 4
It also has excellent adhesion to photosensitive resins such as those described in No. 3-21067.
本発明の支持体上に設けられる感光層に使用される感光
性樹脂としては、従来公知の平版目ル11版の感光層に
用いられる感光性樹脂はいずれも用いることができる。As the photosensitive resin used in the photosensitive layer provided on the support of the present invention, any photosensitive resin used in the photosensitive layer of the conventionally known lithographic printing plate 11 can be used.
以下、本発明を実施例によシ、具体的に説明するが、本
発明はその要旨を越えないかぎシ、以下の実施例に限定
されるものではない。EXAMPLES The present invention will be specifically explained below using Examples, but the present invention is not limited to the following Examples without exceeding the gist thereof.
(124龍厚、JIS 1050のアルミニウム板を
、表面粗さく中心平均粗さ)05μmになるまで研摩砂
とナイロンブラシで砂目立て処理した。引き続いて、1
0%水酸化ナトリウム水溶液中、40℃、20秒間エツ
チング処理し、水洗して、30%硝酸水溶液中に30秒
間浸漬してデスマット処理し、水洗した。(An aluminum plate with a thickness of 124 mm and JIS 1050 was grained with abrasive sand and a nylon brush until the surface roughness and center average roughness) reached 05 μm. Subsequently, 1
It was etched in a 0% aqueous sodium hydroxide solution at 40°C for 20 seconds, washed with water, desmutted by immersing it in a 30% nitric acid aqueous solution for 30 seconds, and washed with water.
次いで、20%硫酸水溶液中で、6.0℃、電流密度2
λ/drn”で直流を用いて陽極ポ化処理を行ない、は
化皮膜重量五l/−の陽極酸化皮膜を得た。引き続いて
水洗した。Next, in a 20% aqueous sulfuric acid solution at 6.0°C and a current density of 2
Anodic oxidation treatment was carried out using direct current at λ/drn'' to obtain an anodic oxidation film with a film weight of 5 l/-.Subsequently, it was washed with water.
このようにして砂目立て処理し、陽極酸化処理したアル
ミニウム基板に金属塩処理を施こす。金属塩処理方法は
、第1表に記載した金鳥塩水溶液中にアルミニウム基板
を第3表に記載の条件で浸漬することによシ行った。引
き続いて水洗し、乾燥を行い、平版印刷版用支持体を作
成した。The aluminum substrate thus grained and anodized is then subjected to metal salt treatment. The metal salt treatment method was carried out by immersing the aluminum substrate in the Kincho salt aqueous solution listed in Table 1 under the conditions listed in Table 3. Subsequently, it was washed with water and dried to prepare a support for a lithographic printing plate.
実施例6〜11に関しては、この支持体にさらに、第6
表に記載した条件で親水化処理を行い、水洗し、乾燥し
、使用した。For Examples 6 to 11, this support was further provided with a sixth
It was subjected to hydrophilic treatment under the conditions listed in the table, washed with water, dried, and used.
前記〔1〕で作成した支持体上に、下記第1表に記載し
た組成割合で調整した感光性樹脂組成物のうちの一種類
(第3表に記載)をホワ2−で塗布し、これを乾燥して
、膜厚t2μmの感光層を有する感光性平版印刷版を得
た。On the support prepared in [1] above, one of the photosensitive resin compositions (listed in Table 3) adjusted in the composition ratio listed in Table 1 below was coated with a foam 2-. was dried to obtain a photosensitive lithographic printing plate having a photosensitive layer with a film thickness of t2 μm.
〔3〕 平版印−11版用支持体の感光層との接着性及
び親水性の評価
前記〔2〕で作成した感光性平版印刷版にテストパター
ンのネガフィルムを密着させ、これから11rL離れた
位置に設けた出力1にWのメタルハライドランプ(岩崎
電気■社展「アイドルフィン1000J)t−用いて、
各々の感光性樹脂組成物の最適露光時間(第3表記載)
で露光を行ない、画像形成させ、引き続いて、下記第2
表の現像液の中から感光性樹脂に合わせて、現像液を選
択しく第3表記載)、これを用いて現像して、印刷版を
製作した。この工うにして製作された印刷版fc4色平
版印刷機に取シ付け、平版印す11用標準インキを用い
て寮際の平版印111Jと同様の条件下で印刷を行い、
10万枚目]i11した時点で接着性及び親水性の評価
を行った。接着性は、版とび等が発生せずに原画に忠実
な印刷物が得られるか否かをもって評価し、親水性は、
印刷物に地汚れがなく鮮明な画像が得られるか否かをも
って評価した。[3] Evaluation of adhesion and hydrophilicity of the support for planographic printing plate 11 with the photosensitive layer A negative film of the test pattern was brought into close contact with the photosensitive planographic printing plate prepared in [2] above, and a position 11 rL away from the photosensitive planographic printing plate was placed. Using a W metal halide lamp (Idol Fin 1000J at Iwasaki Electric Company Exhibition) for output 1 installed in
Optimal exposure time for each photosensitive resin composition (listed in Table 3)
Exposure is performed to form an image, and then the following second step is performed.
A developer was selected according to the photosensitive resin from among the developer solutions shown in Table 3) and developed using this developer to produce a printing plate. The printing plate produced in this way was installed in an FC four-color lithographic printing machine, and printed using standard ink for lithographic printing 11 under the same conditions as the lithographic printing 111J near the dormitory.
100,000th sheet] At the time of i11, adhesiveness and hydrophilicity were evaluated. Adhesion is evaluated by whether a print faithful to the original image can be obtained without plate skipping, etc., and hydrophilicity is evaluated by:
Evaluation was made based on whether or not a clear image without background stains could be obtained on the printed matter.
第 2 表
*1) 「ペレックス NBLJ ・・・花王アトラス
■社製のtert−ブチルナフタレンスルホンばナト
リウム系アニオン型界面活性剤。Table 2 *1) Perex NBLJ: Sodium tert-butylnaphthalene sulfone anionic surfactant manufactured by Kao Atlas ■.
*2) 「ニラコールNP−100j・・畑光ケミカル
ズ(株社製ノニオン型界面活性剤。*2) "Niracol NP-100j...Nonionic surfactant manufactured by Hatamitsu Chemicals (Co., Ltd.).
尚、比較のために、以下の比較例を行った。For comparison, the following comparative example was conducted.
比較例1・・・金属塩処理を行わない以外は実施例1と
同様にして感光性平版印刷版を作成し、製版し、印刷版
の評価を行った。Comparative Example 1: A photosensitive lithographic printing plate was prepared and plate-made in the same manner as in Example 1 except that the metal salt treatment was not performed, and the printing plate was evaluated.
比較例2・・・金属塩処理のかわシに、熱水中に浸漬す
る以外は、実施例1と同様にして感光性平版印刷版を作
成し、製版し、印1版の評価を行った。Comparative Example 2: A photosensitive lithographic printing plate was prepared in the same manner as in Example 1 except that it was immersed in hot water on a metal salt-treated plate, plate-made, and the first plate was evaluated. .
比較例3・・・金属塩処理を行わない以外は、実施例6
と同様にして感光性平版印刷版を作成し、製版し、印刷
版の評価を行った。Comparative Example 3...Example 6 except that metal salt treatment was not performed
A photosensitive lithographic printing plate was prepared and plate-made in the same manner as above, and the printing plate was evaluated.
以上の各側の内容および結果を第6表にまとめて記載し
た。The contents and results of each side above are summarized in Table 6.
本発明の支持体の製造方法は、カルシウム、バリウム、
マグネシウム、ストロンチウム及びマンガンよシなる群
から選ばれる1種以上の金属と有機酸又は無機酸との塩
を含む水溶液でアルミニウム基板を処理することによシ
、感光層と支持体との接着性を改良する方法であシ、従
来、接着タイプの平版印刷版においても、低コストでロ
ングランタイプの平版印刷版を提供することを可能にし
た。The method for producing the support of the present invention includes calcium, barium,
By treating the aluminum substrate with an aqueous solution containing a salt of one or more metals selected from the group consisting of magnesium, strontium, and manganese and an organic or inorganic acid, the adhesion between the photosensitive layer and the support can be improved. This method of improvement has made it possible to provide a long-run type lithographic printing plate at a low cost even in the conventional adhesive type lithographic printing plate.
代理人 弁理士 高 橋 勝 利
手続補正書(自発)
昭和62年2り/2−日
特許庁長官 黒 1) 明 誰 殿■、事件の表
示
昭和61年特許願第61099号
2、発明の名称
平版印刷版用支持体の製造方法
3、補正をする者
事件との関係 特許出願人
〒174 東京都板橋区坂下三丁目35番58号(2
88)犬日本インキ化学工業株式会社代表者 川 村
茂 邦
4、代理人
〒103 東京都中央区日本橋三丁目7番20号大日
本インキ化学工業株式会社内
電話 東京(03)272−4511 (大代表)(8
876)弁理士 高 橋 勝 利5、補正の対象
6、補正の内容
(1) 明、74fl書第9頁第12行目における「
ポリビニルベンゼンスルホン酸ナトリウム等」を
「ポリビニルベンゼンスルホン酸ナトリウム。Agent Patent attorney Katsutoshi Takahashi Procedural amendment (spontaneous) February 2, 1988 Director General of the Patent Office Kuro 1) Mr. Akira, Indication of the case 1986 Patent Application No. 61099 2, Title of the invention Manufacturing method for lithographic printing plate support 3, relationship with the case of the person making the amendment Patent applicant: 3-35-58 Sakashita, Itabashi-ku, Tokyo 174 (2)
88) Inu Nippon Ink Chemical Industry Co., Ltd. Representative Kawamura
Kuni Shigeru 4, Agent: Dainippon Ink & Chemicals Co., Ltd., 3-7-20 Nihonbashi, Chuo-ku, Tokyo 103 Phone number: Tokyo (03) 272-4511 (main representative) (8
876) Patent Attorney Katsutoshi Takahashi 5, Subject of amendment 6, Contents of amendment (1) Akira, 74fl, page 9, line 12, “
Sodium polyvinylbenzenesulfonate, etc."
ポリアクリル酸、ポリビニルホスホン酸等」に補正する
。Corrected to "polyacrylic acid, polyvinylphosphonic acid, etc."
以上that's all
Claims (1)
チウム及びマンガンよりなる群から選ばれる1種以上の
金属と有機酸又は無機酸との塩を含む水溶液で処理する
ことを特徴とする平版印刷版用支持体の製造方法。 2、(c)水溶液が40〜120℃の熱水溶液である特
許請求の範囲第1項記載の方法。 3、(c)水溶液に含まれる塩の濃度が0.01〜20
重量%である特許請求の範囲第1項又は第2項記載の方
法。[Claims] 1. An aluminum substrate (a) grained, (b) sulfuric acid anodized, (c) one or more members selected from the group consisting of calcium, barium, magnesium, strontium, and manganese. 1. A method for producing a lithographic printing plate support, which comprises treating with an aqueous solution containing a salt of a metal and an organic or inorganic acid. 2. The method according to claim 1, wherein the aqueous solution (c) is a hot aqueous solution at a temperature of 40 to 120°C. 3. (c) The concentration of salt contained in the aqueous solution is 0.01 to 20
3. The method according to claim 1 or 2, wherein the amount is % by weight.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61061099A JPH0790669B2 (en) | 1986-03-19 | 1986-03-19 | Method for producing support for lithographic printing plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61061099A JPH0790669B2 (en) | 1986-03-19 | 1986-03-19 | Method for producing support for lithographic printing plate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62216796A true JPS62216796A (en) | 1987-09-24 |
JPH0790669B2 JPH0790669B2 (en) | 1995-10-04 |
Family
ID=13161298
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61061099A Expired - Lifetime JPH0790669B2 (en) | 1986-03-19 | 1986-03-19 | Method for producing support for lithographic printing plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0790669B2 (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5621126A (en) * | 1979-07-27 | 1981-02-27 | Fuji Photo Film Co Ltd | Photosensitive lithographic plate |
JPS5764597A (en) * | 1980-10-09 | 1982-04-19 | Toyo Kohan Co Ltd | Manufacture of metal sheet for plate material |
JPS5959897A (en) * | 1982-09-01 | 1984-04-05 | ヘキスト・アクチエンゲゼルシヤフト | Production of sheet, foil or strip-shaped material and supp-ort for offset printing plate |
JPS61182988A (en) * | 1985-02-08 | 1986-08-15 | ヘキスト・アクチエンゲゼルシヤフト | Base material for offset printing plate and manufacture thereof |
JPS6219494A (en) * | 1985-07-18 | 1987-01-28 | Fuji Photo Film Co Ltd | Base material for lithographic printing |
-
1986
- 1986-03-19 JP JP61061099A patent/JPH0790669B2/en not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5621126A (en) * | 1979-07-27 | 1981-02-27 | Fuji Photo Film Co Ltd | Photosensitive lithographic plate |
JPS5764597A (en) * | 1980-10-09 | 1982-04-19 | Toyo Kohan Co Ltd | Manufacture of metal sheet for plate material |
JPS5959897A (en) * | 1982-09-01 | 1984-04-05 | ヘキスト・アクチエンゲゼルシヤフト | Production of sheet, foil or strip-shaped material and supp-ort for offset printing plate |
JPS61182988A (en) * | 1985-02-08 | 1986-08-15 | ヘキスト・アクチエンゲゼルシヤフト | Base material for offset printing plate and manufacture thereof |
JPS6219494A (en) * | 1985-07-18 | 1987-01-28 | Fuji Photo Film Co Ltd | Base material for lithographic printing |
Also Published As
Publication number | Publication date |
---|---|
JPH0790669B2 (en) | 1995-10-04 |
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