JPS62216245A - Detector for directivity of wafer - Google Patents

Abstract

PURPOSE:To form the titled detector in simple constitution without using an image sensor, and to reduce maintenance and inspection works by providing a means shifting a wafer, a contact finger and a means measuring the movement of the contact finger. CONSTITUTION:A directional-property detector is installed to a positioning device 6 positioning a semiconductor wafer 5, and a pair of clamping arms (moving means) 10, 10 are arranged to the lower section of a frame 9 so as to hold the semiconductor wafer 5. Downward projected contact fingers 20 are positioned at positions slightly forward of fixed rollers 14 and fastened in the lower end sections of arms 16, and constituted of small-gage wires made of steel. A flat section 5a is brought into contact with the contact fingers 20, 20 by transporting the semiconductor wafer 5 to the fixed roller 14, 14 side, and the arms 16, 16 are turned in the direction of the arrow B together with the contact fingers 20, 20. A measuring means measuring the movement of the contact fingers 20, 20 is provided. Accordingly, the directional-property detector can be shaped in a simple constitution, cost thereof is reduced, and maintenance and inspection work can be lightened.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a detection device for detecting the orientation of a semiconductor wafer having a flat portion (so-called orientation flat) formed on a part of its side surface.

[Prior Art] Generally, a circular semiconductor wafer has a flat portion formed in accordance with its crystal orientation. When such a semiconductor wafer is supplied to a peripheral grinding device using a copying method to perform peripheral grinding or chamfering, the accuracy of the directionality of the flat part of the semiconductor wafer is extremely important as it determines the acceptability of the product after peripheral grinding. This is an important condition. Therefore, conventionally, when supplying a semiconductor wafer to a peripheral grinding device, the semiconductor wafer is centered and the flat part is positioned in the circumferential direction, and the directionality of the flat part is detected during positioning.
By supplying only semiconductor wafers that have been positioned with a predetermined accuracy, processing defects during peripheral grinding are prevented from occurring.

FIG. 4 is a diagram showing such a wafer directionality detection device as disclosed in Japanese Patent Application Laid-open No. 109242/1983, which was previously filed.

The directionality detection device shown in this figure consists of an arm l that is movable in the horizontal direction, a suction pad 2 that is rotatably supported under the tip of this arm, and a circumference below the suction pad 2. The optical image sensor 3.4 is configured to include two optical image sensors 3.4 spaced apart from each other at an angle of 90° in the direction, and a semiconductor wafer 5 having a flat portion 5a is held between the image sensors 3.4 by a suction pad 2. By holding it above and rotating it once, changes in the number of light-receiving pixels recognized by the image sensor 3.4 are memorized and calculated, thereby making it possible to detect the directionality of the flat portion 5a. ing.

[Problems to be solved by the invention] By the way, the directionality detection device with the above configuration requires an expensive image sensor and a complicated control device that stores and calculates changes in the number of light-receiving pixels, making the device as a whole quite expensive. In addition, there is a problem in that maintenance and inspection work such as cleaning of the light receiving section must be performed frequently in order to keep the image sensor functioning normally.

[Purpose of the Invention] This invention has been made to solve the above problems, and can have a simple configuration without using an image sensor, and therefore can be made at low cost. Another object of the present invention is to provide a wafer orientation detection device that can reduce maintenance and inspection work.

[Means for Solving the Problems] The wafer orientation detection device of the present invention includes a pair of stoppers spaced apart from each other, a moving means for moving the wafer toward the pair of stoppers, and a mechanism between the stopper and the wafer. The tentacle is disposed in the wafer and is movable in the direction of movement of the wafer, and a measuring means for measuring the amount of movement of the tentacle.

Embodiment FIGS. 1 to 3 are diagrams showing an embodiment of the present invention. The wafer orientation detection device shown in these figures is provided in a positioning device 6 for positioning a semiconductor wafer 5, and is placed on the top surface of a feeder 7 and positioned by side clamp rollers 8. The device is configured to be able to correct the directionality of the semiconductor wafer 5 and detect the directionality of the semiconductor arm 5 after the correction.

In FIG. 1, reference numeral 9 is a frame that serves as a skeleton. At the bottom of the frame 9, a pair of clamp arms (moving means) l are vertically spaced apart so as to sandwich the semiconductor wafer 5.
O.10 is oriented in the longitudinal direction in the front-rear direction (arrow A-B in Fig. 1).
direction). These clamp arms 10 are movable toward and away from each other,
It is also configured to be movable in the front and rear directions. Furthermore, clamp rollers 11 are rotatably supported at the distal ends of the clamp arms 10-10, with their end surfaces facing each other. The clamp roller 11 is for gripping the semiconductor wafer 5, and O-rings 12 made of rubber are fixed to the end faces facing each other, so that the clamp roller 11 can grip the semiconductor wafer 5 reliably without damaging it. It has become.

In addition, supports 13 and 13 are provided on the lower surface of the tip of the frame 9.
are arranged on both the left and right sides of the clamp arm IO. A fixed roller (stopper) 14 whose axis is vertically oriented is rotatably supported at the lower ends of these supports 13, 13. The fixed roller 14 positions the semiconductor wafer 5 in the circumferential direction by abutting both ends of the flat portion 5a of the semiconductor wafer 5. Further, in the middle part of the support 13, a proximity distance meter (
Measuring means) 15 are arranged.

Further, on both left and right sides of the tip of the frame 9, arms I6 and 16, whose longitudinal direction is directed in the vertical direction and whose tips are positioned in front of the proximity rangefinder 15, are rotatably supported via bearings 17. has been done. And arm 16
A balance weight 18 is fixed to the upper end of. The balance weight 18 biases the arm 16 in the rotational direction of arrow A. Also, balance weight 1
A screw member 19 whose tip is in contact with the upper surface of the frame 9 is screwed into the rear end of the arm 8, thereby allowing the tip of the arm 16 to be separated from the proximity distance meter 15 by a certain distance. , and its dimensions can be adjusted.

The spaced dimension is always measured by the proximity distance meter 15.

Furthermore, a tentacle 20 projecting downward is fixed to the lower end of the arm 16 so as to be positioned slightly forward of the fixed roller 14. This tentacle 20 is made of a thin steel wire. Based on this configuration, by moving the semiconductor wafer 5 toward the fixed rollers 14, the flat portions 5a come into contact with the tentacles 20, and the arms 1
6 and 16 rotate in the direction of arrow B together with the tentacles 20 and 20.

Next, the wafer directionality detection device configured as described above is used to detect
The procedure for detecting the directionality of the semiconductor wafer 5 will be explained together with the positioning procedure.

First, the clamp arms 10 and 10 are moved back to open the side clamp rollers 8 and 8 of the positioning device 6, and the semiconductor wafer 5, which has been roughly positioned in advance, is placed on the fixed roller 1 with its flat portion 5a. do. Next, the clamp arms 10 are moved forward to grip the semiconductor wafer 5 near the flat portion 5a.

Next, the clamp arm 10-10 is moved backward, and the flat part 5
Pull both sides of a towards the fixed rollers 14. Then, the tentacles 20 come into contact with the flat part 5a and the arm 1
6 and 16 rotate in the direction of arrow B against the urging force of balance weights 18 and 18. Here, if one side of the flat portion 5a does not come into contact with the fixed roller 14 and the orientation of the semiconductor wafer 5 is misaligned, one arm 16 will protrude more forward than the other. This can be recognized from the measurement results of the proximity range finder 15. and,
In such a case, transport to the next process is stopped and an alarm is issued.

In the wafer directionality detection device having the above configuration, the directionality of the semiconductor wafer 5 is detected by measuring the distance to the tip of the arm 16 using the proximity distance meter 15, so the entire device It can be made very compact and inexpensive. Also,
Since the configuration is simple, there are fewer failures and maintenance and inspection work can be reduced. Furthermore, since the tip of the arm 16 is biased forward by the balance weight 18, even a minute displacement of the semiconductor wafer 5 can be handled with a very small force.
In addition, it is possible to reliably track and recognize the displacement amount, and extremely high accuracy and reliability can be obtained. Also,
Since the tentacles 20 are made of thin steel wires, if non-linear shapes such as undulations occur in the flat portion 5a in the previous process, they can be detected.

In addition, in the above embodiment, the tentacle 20 is attached to the rotatable arm 1.
6, but the configuration is not limited to this, and for example, it may be fixed to the tip of a support member provided slidably in the front-rear direction. Regarding the proximity distance meter 15, general-purpose products such as magnetic displacement sensors, capacitance displacement sensors, and optical displacement sensors that are generally commercially available, as well as proximity distance meters 15, are available. A switch, contact type limit switch, etc. may also be used.

[Effects of the Invention] As explained above, in the wafer orientation detection device of the present invention, there is a pair of stoppers spaced apart from each other, a moving means for moving the wafer toward the pair of stoppers, and a movement mechanism between the stopper and the wafer. Since the tentacle is disposed in the wafer and is movable in the direction of movement of the wafer, and a measuring means for measuring the amount of movement of the tentacle,
It is possible to have a simple configuration, and therefore, not only can it be made inexpensive, but also the effect that maintenance and inspection work can be reduced can be obtained.

[Brief explanation of drawings]

1 to 3 are diagrams showing an embodiment of the present invention, in which FIG. 1 is a plan view showing a wafer directionality detection device;
Figure 2 is a view from the ■ direction arrow in Figure 1, and Figure 3 is a view of ■ - in Figure 2.
(2) Linear cross-sectional view FIG. 4 is a plan view showing an example of a conventional directionality detection device. 5... Semiconductor wafer (wafer), 5a...
... Flat part, 10 ... Clamp arm (moving means), 14.
...Fixed roller (stopper), 15...
- Proximity distance meter (measurement means).

Claims (1)

[Claims] A wafer directionality detection device that detects the orientation of a flat portion formed on the circumferential side of a circular wafer, which includes a pair of stoppers spaced apart from each other, and movement that moves the wafer toward the pair of stoppers. A wafer comprising: means; a tentacle disposed between the stopper and the wafer so as to be movable in the direction of movement of the wafer; and a measuring means for measuring the amount of movement of the tentacle. direction detection device.