JPS62214520A - Grinding device for disk substrate - Google Patents

Abstract

PURPOSE:To disperse an abrasive powder to the whole surface of an abrasive tape, by constituting the titled device so that a grinding liquid which is dripped from a grinding liquid supply nozzle can be dispersed in a state that it has contained the abrasive power, by an atomized air supply device. CONSTITUTION:A disk substrate 10 is installed to a chuck member 11, and by a pressure head 16 in a pressure member 17, an abrasive tape 13 is pressed against the surface of the disk substrate 10. Also, from a grinding liquid supply nozzle 18, a grinding liquid is dripped down to the abrasive tape 13, and also, an atomized air is jetted to the dripped grinding liquid from an air supply pipe 19a of an atomized air supply device 19. In this state, the disk substrate 10 is driven to rotate by a motor 12, the pressure member 17 is brought to a reciprocating motion, the abrasive tape 13 is brought to a reciprocating motion in the radial direction of the disk substrate 10, the abrasive tape 13 is fed out, and fed to a winding reel from a reel 14. In this way, an abrasive powder is distributed to the whole surface of the abrasive tape 13, therefore, the grinding accuracy of the disk substrate is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field 1] The present invention relates to a disk substrate polishing apparatus for smoothing the surface of a disk substrate such as a magnetic disk or an optical disk by lapping.

[Prior art 1] As a disk substrate, for example, a magnetic disk is manufactured by forming a magnetic coating on the surface of a disk substrate made of aluminum or the like by means of vapor deposition or the like, but it is difficult to uniformly form the magnetic coating. Therefore, before forming this film, the surface of the disk substrate is polished to be extremely smooth by lapping. In order to polish such a disk substrate, a disk substrate polishing apparatus as shown in FIG. 5 has conventionally been used.

In the figure, reference numeral 1 indicates a disk substrate, and the inner peripheral edge of the disk substrate l is supported by a chuck member 2, and the chuck member 2 is provided with a driving means 3 such as a motor.
The disk substrate 1 can be rotated by rotationally driving the chuck member 2 by the driving means 3. And disk board 1
An abrasive tape 4 is used to polish the surface of the disk substrate 1. The abrasive tape 4 is pressed against the surface of the disk substrate 1 by a pressure head 5, and the abrasive tape 4 is pressed against the surface of the disk substrate 1 by a reciprocating member 6. It is configured to be supported so as to be able to reciprocate in the radial direction. moreover,
Reference numeral 7 denotes a polishing liquid supply nozzle for supplying polishing liquid toward the polishing tape 4, and a polishing liquid made by mixing polishing oil with polishing powder is dropped toward the polishing tape 4 through the polishing liquid supply nozzle 7. It is structured in a way that allows you to do a lot of things.

A conventional disk substrate polishing device has such a configuration, in which the disk substrate 1 is rotated by the driving member 3, and the polishing tape 4 is reciprocated in the radial direction of the disk substrate 1 by the reciprocating member 5. Furthermore, during this time, the surface of the disk substrate 1 can be lapped by dropping and supplying the polishing liquid from the polishing liquid supply nozzle 7 toward the polishing tape 4.

[Problem to be Solved by the Invention 1] By the way, in the prior art disk substrate polishing apparatus described above, the polishing liquid is only dripped from the supply nozzle, and the polishing liquid is not dripped onto the polishing tape. Only the abrasive oil permeates into the surrounding area from the dripping part of the abrasive liquid, and the abrasive powder cannot be uniformly dispersed over the entire surface of the abrasive tape. It contains a large amount of abrasive powder, and the content of abrasive powder decreases toward both sides. When the surface of a disk substrate is polished using an abrasive tape in which the content of abrasive powder differs in one width direction as described above, there is a drawback that the polishing finish of the surface of the disk substrate is uneven.

The present invention has been made in view of the above-mentioned points, and its purpose is to uniformly impregnate the entire abrasive tape with abrasive powder when supplying abrasive liquid to the abrasive tape. It is an object of the present invention to provide a polishing device for a disk substrate, which enables accurate polishing and finishing.

[Means for Solving the Problems] In order to achieve the above-mentioned object, the disk substrate polishing apparatus according to the present invention presses an abrasive tape against the surface of the disk substrate, and while rotating the disk substrate, While the abrasive tape is reciprocated in the radial direction of the disk substrate, the surface of the disk substrate is polished by supplying a polishing liquid made by mixing abrasive oil and abrasive powder to the abrasive tape through a polishing liquid supply nozzle. The present invention is characterized in that an atomizing air supply device for dispersing polishing liquid in the form of mist is installed facing the polishing liquid supply nozzle.

[Operation] The present invention is constructed as described above, and in order to polish a disk substrate using this polishing device, the disk substrate is placed in a state where it is supported by an appropriate rotational drive means, and An abrasive tape is supplied to one or both surfaces of the disk substrate, and the abrasive tape is pressed against the surface of the disk substrate using a member such as a pressure head installed so as to be reciprocally movable. Then, the polishing liquid is dripped onto the polishing tape through the polishing liquid supply nozzle, and pressurized air from the atomizing air supply device is sprayed toward the dropped polishing liquid. Disperse the abrasive powder in the form of a mist to evenly distribute the abrasive powder over the entire surface of the abrasive tape. By polishing the surface of the disk substrate in this state, the entire disk substrate can be polished evenly, and the precision of the polishing finish is significantly improved.

[Embodiment 1] Hereinafter, embodiments of the present invention will be described in detail based on the drawings.

First, in FIGS. 1 and 2, C1 and 0 indicate a disk substrate, and the disk substrate 10 is formed of a member such as aluminum in an annular shape, and each of its front and back surfaces is coated with a magnetic material. is formed on the surface of the disk substrate 10, and before a magnetic film is formed on the surface of the disk substrate 10, the disk substrate 10 is polished by a polishing device.

This polishing device has a chuck member 11 that supports the inner peripheral edge of a disk substrate 10, and the chuck member 11 is attached to an output shaft 12a of a motor 12 serving as a rotational drive means to rotationally drive the motor 12. This makes it possible to rotate the disk substrate 10.

Next, reference numeral 13 indicates an abrasive tape made of wrapping tape, and the abrasive tape 13 runs from a delivery reel 14 to a take-up reel 15. A pressure member 17 equipped with a pressure head IE is attached.

The pressure head 16 brings the abrasive tape 10 into contact with the surface of the disk substrate IO.

Further, reference numeral 18 denotes a polishing liquid supply nozzle, which is capable of dropping and supplying a polishing liquid made by dispersing abrasive powder in polishing oil toward the polishing tape 13. The polishing fluid supplied from the polishing fluid supply nozzle I8 is a pressurized polishing fluid that is ejected from the air supply pipe 19a of the atomizing air supply device 19 disposed toward the nozzle opening of the polishing fluid supply nozzle 18. The structure is such that it can be dispersed into a mist by spraying atomizing air.

This embodiment is constructed as described above, and in order to polish the disk substrate 10 using this polishing device, first the disk substrate 10 is mounted on the chuck member 11, and then the pressure applied by the pressure member 17 is applied. Abrasive tape 13 by head 16
is pressed against the surface of the disk substrate 10. Further, the polishing liquid is dripped from the polishing liquid supply nozzle 18 toward the polishing tape 13, and atomizing air is directed from the air supply pipe 19a of the atomizing air supply device 19 toward the polishing liquid dropped in this way. Make it squirt. In this state, the motor 12 rotates the disk substrate 10, and the pressure member 17 is reciprocated to reciprocate the abrasive tape 13 in the radial direction of the disk substrate 10, and the abrasive tape 13 is sent out to the wheel 1.
4 toward the take-up reel 15, the surface of the disk substrate 10 is polished.

Here, the polishing liquid dripped toward the polishing tape 13 from the polishing liquid supply nozzle 18 comes into contact with the pressurized air jetted from the air supply pipe 19a in the atomizing air supply device 19, and thereby contains polishing powder. The abrasive powder is dispersed in the form of a mist while remaining in the abrasive state, and as a result, the abrasive powder is distributed over the entire surface of the abrasive tape 13. As a result, the polishing powder is almost uniformly dispersed over the entire surface of the polishing tape 13, so that the entire surface of the disk substrate 10 can be polished extremely accurately, improving the polishing accuracy.

If the abrasive liquid is atomized by blowing pressurized air, will the abrasive liquid dissipate into the surroundings and cause waste of the abrasive liquid? This can be done by adjusting the pressure of the pressurized air supplied from the atomizing air supply pipe 19a and adjusting the angle of the atomizing air supply pipe 19a with respect to the polishing liquid supply nozzle 18. In this case, usually the polishing liquid supply nozzle 18
is installed at a small angle with respect to the abrasive tape 13, and in this state, the atomizing air supply pipe 19a is at an angle approximately halfway between the angle between the abrasive liquid supply nozzle 18 and the abrasive tape 13. It is preferable to install it as follows.

In addition, in the above-mentioned embodiment, an apparatus configured as a device for polishing only one side of the disk substrate IO was shown, but instead of this, it may be configured so that both sides of the disk substrate IO can be polished. You can also do it.

[Effect of the Invention J As detailed above, the disk substrate polishing device according to the present invention uses an atomizing air supply device to disperse the polishing liquid dripping from the polishing liquid supply nozzle while containing polishing powder. With this structure, the abrasive powder can be distributed over the entire surface of the abrasive tape, and the entire surface of the disk substrate can be polished uniformly, and uneven polishing can be prevented. It becomes possible to polish the disk substrate with high precision.

[Brief explanation of drawings]

1 to 4 show a first embodiment of the present invention.
The figure is an overall configuration diagram of the polishing device, Figure 2 is a plan view of Figure 1,
FIG. 3 is an enlarged perspective view of a main part, FIG. 4 is a front view of FIG. 3, and FIG. 5 is an explanatory diagram of the configuration of a conventional polishing apparatus. 10: disk substrate, 13: polishing tape, 16: pressure head, 18: polishing liquid supply nozzle, 19: atomizing air supply device, 19a: air supply pipe.

Claims (1)

[Claims] The abrasive tape is pressed against the surface of the disk substrate, and while the disk substrate is rotated, the abrasive tape is reciprocated in the radial direction of the disk substrate, and a polishing liquid made by mixing abrasive powder with abrasive oil is supplied as a polishing liquid. The surface of the disk substrate is polished by supplying the polishing liquid to the polishing tape through a nozzle, wherein an atomizing air supply device for dispersing the polishing liquid in a mist is installed facing the polishing liquid supply nozzle. A disc substrate polishing device characterized by: