JPS62213956A - Polishing device for disc base board - Google Patents

Abstract

PURPOSE:To wind up a polishing tape after its work smoothly and surely by coupling the drive shaft of a takeup motor with the takeup shaft of a takeup reel through a friction transmitting means with possibility of slippage. CONSTITUTION:A takeup reel 18 is rotated by a takeup motor 15 through a belt 24 set over a rotary hub 23 of said takeup reel 18 and a rotary hub 22 of a drive shaft 15a. Therefore, increase in the load on the takeup reel side generates slippage of the belt 24 wound round a takeup shaft 18b of the takeup reel 18. Consequently the revolving speed of the takeup reel 18 reduces with increasing amount of tape 14 wound up, and this amount of wound-up tape becomes constant, corresponding to the amount of the polishing tape 14 being fed by said takeup motor 15. Accordingly proper and tight winding-up is provided to ensure that the tape 14 does not entangle with other members.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a polishing tool for a disk substrate used for smoothing the surface of a disk substrate such as a magnetic disk or an optical disk.

[Prior art 1] As a disk substrate, for example, a magnetic disk is manufactured by forming a magnetic coating on the surface of a disk substrate made of aluminum or the like by vapor deposition or other means, but it is difficult to uniformly form this magnetic coating. In order to achieve this, the surface of the disk substrate is polished to an extremely smooth surface before the coating is formed. In addition, in order to keep the film thickness of the magnetic film constant even after the magnetic film is formed, polishing is performed, or polishing of the disk substrate is performed before or after the formation of the magnetic film. A polishing mold for disk substrates is used for this purpose.

As a polishing apparatus for this disk substrate, the one shown in FIG. 5 has been conventionally used. In the figure, l indicates a disk substrate, and the inner circumferential edge of the disk substrate 1 is supported by a chuck member 2. The chuck member 2 is connected to a driving means 3 such as a motor, and the disk substrate 1 is supported by a chuck member 2. By rotationally driving the chuck member 2 by the driving means 3, the disk substrate 1 can be rotated. In order to polish the surface of the disk substrate 1, an abrasive tape 4 made of lapping tape or the like is used, and the abrasive tape 4 is wound from a tape feed reel 7 by a take-up roller 6 driven by a take-up motor 5. While feeding the abrasive tape 4 toward the take-up reel 8, the abrasive tape 4 is applied to the pressure head 9.
The abrasive tape 4 and the pressure head 9 that presses it against the disk substrate L are supported by a reciprocating member 10 so as to be able to reciprocate in the radial direction of the disk substrate L. The configuration is such that the

To polish the disk substrate 1 using the polishing device configured as described above, the take-up motor 5 is operated, and the take-up roller 6 moves the polishing tape 4 from the tape feed reel 7 to the take-up reel 8 side. During this time, the disk substrate l is rotated by its drive means 3, and the reciprocating member IO is actuated to reciprocate the abrasive chip buoy together with the pressure head 9 in the radial direction of the disk substrate l. By doing this, the surface of the disk substrate l is polished.

[Problem 1 to be solved by the invention By the way, as mentioned above, the abrasive tape 4 is fed by the take-up roller 6 driven by the take-up motor 5,
When the abrasive tape 4 after polishing the disk substrate 1 is wound up by the take-up reel 8, the take-up reel 8
It is necessary to provide a means for rotationally driving the tape, which not only makes the configuration complicated, but also because the amount of tape to be wound with respect to the rotation angle changes depending on the amount of winding on the take-up reel 8. The drive means for the reel 8 has the drawback that its control is complicated, such as having to change the speed to slow down the rotational speed as the winding progresses.

The present invention has been made in view of the above points, and its purpose is to smoothly and reliably wind polished abrasive tape without providing an independent drive means to the take-up reel. An object of the present invention is to provide a polishing mold δ for a disk substrate that can be polished.

Means for Solving Problem E 1 In order to achieve the above-mentioned object, the disk substrate polishing device according to the present invention is capable of slipping between the drive shaft of the take-up motor and the take-up shaft of the take-up reel. By connecting via a friction transmission means such as This is characterized by a configuration in which the take-up reel is rotated following the drive shaft while slipping by a predetermined amount.

[Operation 1] The present invention is constructed as described above, and in order to polish a disk substrate using this polishing mold, the disk substrate must be supported by an appropriate rotational drive means. .

Then, an abrasive tape is supplied to one or both surfaces of the disk substrate, and the abrasive tape is pressed against the surface of the disk substrate by a pressure head. In this state, the take-up motor is activated and the take-up roller is rotated to feed the abrasive tape from the tape feed reel side to the take-up reel side. During this time, the disk substrate is rotated, and the abrasive tape and The surface of the disk substrate is polished by reciprocating the pressure member in the radial direction of the disk substrate using the reciprocating member.

Since the drive shaft of the take-up motor and the take-up shaft of the take-up reel are connected via the friction transmission means,
The chain take-up reel rotates following the rotation of the drive shaft, thereby winding up the abrasive tape. The amount of abrasive tape fed by the take-up motor is constant, but the amount of tape taken up by the take-up reel varies depending on the amount of tape wound on it. This increases the load on the take-up reel. However, since the take-up shaft of this take-up reel is connected to the drive shaft of the take-up motor through a friction transmission means with zero slip, the chain take-up reel may The friction transmission means wound around the winding shaft causes slippage. As a result, the rotation speed of the chain take-up reel decreases as the tape winding amount increases, and this winding amount becomes a constant amount that matches the abrasive tape feed amount by the winding motor.

For this reason, there is no sag on the take-up reel,
The abrasive tape can be wound in an extremely proper and tightly wound state, and the abrasive tape will not get tangled with other parts, and when the take-up reel is removed, it will come out in the middle, making it difficult to remove. It may be an inconvenience or may not survive.

[Example] Hereinafter, an example of the present invention will be described in detail based on the drawings.

First, in FIGS. 1 and 2, reference numeral 11 indicates a disk substrate, which is formed by forming a plate-like member such as aluminum into an annular shape, and has magnetic material on each of its front and back surfaces. A film is formed.

Then, before or after forming the magnetic coating on the surface of the disk substrate 11, the disk substrate 11 is polished using a polishing device. This polishing device has a chuck member 12 that supports the inner peripheral edge of the disk substrate 11, and the chuck member 12 is attached to an output shaft 13a of a motor 13 as a rotational drive means to rotate the motor 13. By driving
The disk substrate 11 can be rotated.

Next, reference numeral 14 indicates an abrasive tape made of wrapping tape or the like, and the abrasive tape 14 is made to run from a delivery reel 17 toward a take-up reel 18 by a take-up roller 16 that is rotationally driven by a take-up motor 15. The polishing tape 11 is brought into contact with the surface of the disk substrate 11 while the polishing tape 14 is running. And this abrasive tape 11
A pressure member 20 equipped with a pressure head 19 for pressing the abrasive tape 14 onto the disk substrate 11 is attached to the rear contact portion of the disc substrate 11, and the pressure member 2o is attached in the radial direction of the disk substrate 11 It is connected to a reciprocating member 21 that can reciprocate.

As shown in FIGS. 3 and 4, a rotating hub 22 is attached to the drive shaft 15a of the take-up motor 15 and rotates integrally therewith, and a take-up reel 18 is attached to the drive shaft 15a of the take-up motor 15.
has a winding shaft 18b that rotationally drives the winding core 18a and the chain winding core 18a, and a rotating hub 23 that rotates integrally with the chain winding shaft 18b is also attached. And, between these rotating hubs 22 and 23, there is a slippery W! A belt 24 as a friction transmission means is wound around the belt 24,
The drive shaft 15 of the winding motor 15 is controlled by the belt 24.
The rotation of a can be transmitted to the winding shaft 18b.

The diameter of the winding core 18a of the winding reel 18 is approximately the same as the diameter of the winding roller 16, and the diameter of the rotating hub 22 on the drive shaft 22 side is the same as that of the rotating hub 23 on the winding shaft 18b side.
The diameter is the same as or larger than that.

This embodiment is constructed as described above, and in order to polish the disk substrate 11 using this polishing device, the disk substrate 11 is fitted into the chuck member 12, and the inner peripheral edge of the disk substrate 11 is Install it in a supported state. Then, the abrasive tape 14 is fed onto the surface of the disk substrate 11, and the abrasive tape 14 is pressed against the surface of the disk substrate 11 by the pressure head 19 of the pressure member 20, and in this state, the motor 13 is operated. As a result, the disk substrate 11 is rotated, and the pressure member 20 is reciprocated in the radial direction of the disk substrate 11 by operating the reciprocating section 21. Further, the take-up motor 15 is operated to rotate the take-up roller 16 connected to the drive shaft 15a, and the abrasive tape 14 is run from the feed reel 17 side to the take-up reel 18 side, thereby making the disk Polishing is performed on the surface of the substrate 11.

Here, the polishing tape 14 is wound onto the core 18a of the take-up reel 18 after polishing the surface of the disk substrate 11, or the take-up reel 18 is connected to its rotating hub 23 and the rotating hub 22 of the drive shaft 18b. Since the chain take-up reel 18 is rotated by the take-up motor 15 via the belt 24 wound therebetween, the chain take-up reel 18 tends to rotate in synchronization with the drive shaft 15a. Since the diameter of this rotating hub 23 is the same as or smaller than the diameter of the rotating hub 22 on the drive shaft 15a side, even when the abrasive tape 14 is not wound around the winding core 18a, the winding The amount of winding of the abrasive tape 14 by the take-up reel 18 is greater than or at least the same as the amount of feed of the abrasive tape 14 by the take-up roller 16, and the tape winding diameter of the winding core 18a on this take-up reel 18 becomes thicker. The difference will increase depending on the However, since the take-up reel 18 is rotatably driven by the drive shaft 15a, and the power transmission between the brackets is performed by the slipable belt 24, the take-up reel 18 is rotated by the take-up roller 16. Polishing tape 1
If the take-up reel 18 attempts to take up the tape at a speed higher than the feed speed of 4, the chain take-up reel 18 will slip due to the load, and it will no longer be possible to take up the abrasive tape 14 by more than the amount fed by the take-up roller 16. Moreover, during this period, the abrasive tape 14 is stretched with a predetermined tension between the take-up reel 18 and the take-up roller 16, so that the abrasive tape 14 is tightly wound without sagging. If the chain winds up on the take-up reel 18, it may become tangled with other parts, or the chain may wind up on the take-up reel 18.
In addition, when replacing the take-up reel 18, the abrasive tape 14 wound on the take-up reel 18 or its intermediate portion may come off the winding core 18a. There is no inconvenience.

In the above-mentioned embodiments, a magnetic disk was used as the disk substrate for polishing, but it goes without saying that the present invention can also be used for polishing a disk substrate such as an optical disk. Furthermore, if the same polishing device is installed not only on one side of the disk substrate 11 but also on both sides, both sides of the disk substrate 11 can be polished at the same time. Further, the diameter of the take-up roller 16 and the diameter of the winding core 18a of the take-up reel 18 are formed to be approximately the same, and the diameter of the rotating hub 22 is formed to be the same as or larger than the diameter of the rotating hub 23. In other words, even when the abrasive tape 14 is not wound around the core 18a of the take-up reel 18, the chain take-up reel 18
It is sufficient that the amount of winding of the abrasive tape 14 caused by the rotation of the abrasive tape 14 is equal to or larger than the amount fed by the winding roller 16 in the same rotation. Furthermore, the friction transmission means interposed between the drive shaft 15a of the take-up motor 15 and the take-up reel 18 is not limited to the belt 24 described above, but may also be provided by, for example, a slippable friction roller. .

``Effects of the Invention'' As described in detail in Section 2 below, the disk substrate polishing apparatus according to the present invention winds up the polishing tape by rotating the take-up reel with the take-up motor. Since the driving force is transmitted to and from the take-up motor through the slippable friction transmission means, the structure of the drive device for the take-up reel is extremely simple, and the take-up reel allows for tight winding. You will now be able to roll up the abrasive tape.

[Brief explanation of drawings]

FIG. 1 is an overall configuration diagram of a polishing apparatus showing an embodiment of the present invention, FIG. 2 is a plan view of FIG. 1, FIG. 3 is an explanatory diagram of the configuration of an abrasive tape winding mechanism, and FIG. 3 is an explanatory diagram showing the state seen from the direction of the arrow in FIG. 3, and FIG. 5 is an overall configuration diagram of a conventional polishing apparatus. ll: disk board, 15 two-winding motor, 15a:
Drive shaft, 16: Take-up roller, 18: Take-up reel, 1
8a: Winding core, 22, 2: l: Rotating hub, 24: Belt.

Claims (2)

[Claims] (1) While rotating the disk substrate, an abrasive tape is pressed against the surface of the disk substrate by a take-up motor, and the surface is polished while reciprocating the abrasive tape in the radial direction of the disk substrate. The drive shaft of the take-up motor and the take-up shaft of the take-up reel are connected via a slippable friction transmission means, and the tape feed amount relative to the rotation angle of the drive shaft of the take-up motor is controlled by the take-up reel. By making the tape winding amount equal to or smaller than the tape winding amount at the same rotation angle of the winding shaft,
A polishing device for a disk substrate, characterized in that the take-up reel is configured to rotate following the drive shaft while slipping by a predetermined amount. (2) The disk substrate polishing apparatus according to claim (1), wherein the friction transmitting means is constituted by a belt wound around the drive shaft and the winding shaft.