JPS62213295A - Hollow multilayer printed board - Google Patents
Hollow multilayer printed boardInfo
- Publication number
- JPS62213295A JPS62213295A JP5740486A JP5740486A JPS62213295A JP S62213295 A JPS62213295 A JP S62213295A JP 5740486 A JP5740486 A JP 5740486A JP 5740486 A JP5740486 A JP 5740486A JP S62213295 A JPS62213295 A JP S62213295A
- Authority
- JP
- Japan
- Prior art keywords
- multilayer printed
- printed board
- connection land
- hollow multilayer
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 6
- 238000005304 joining Methods 0.000 claims description 2
- 238000007747 plating Methods 0.000 description 17
- 239000000758 substrate Substances 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 229910000679 solder Inorganic materials 0.000 description 13
- 238000002844 melting Methods 0.000 description 11
- 230000008018 melting Effects 0.000 description 11
- 239000010949 copper Substances 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 229910001128 Sn alloy Inorganic materials 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔概 要〕
本発明は通信機器、電子機器装置等に用いられる中空多
層プリント板において、複数枚の基板を半田付けにより
積層するスルーホール部に設けた各接続ランドパターン
の表面側の接合面を、例えば凸形状とし、裏面側の接合
面を凹形状にして各基板の接続ランドパターン同士を嵌
合した形で積層し、半田接合する構成とすることにより
、接合面積が増加し、嵌合接合となることから、接続ラ
ンドパターン同士の半田付は接合時の密着力が高められ
、剥がれ不良が防止されると共に、信頼性を向上したも
のである。[Detailed Description of the Invention] [Summary] The present invention relates to a hollow multilayer printed board used for communication equipment, electronic equipment, etc., in which each connection land pattern is provided in a through-hole portion where a plurality of boards are laminated by soldering. By making the bonding surface on the front side convex, for example, and the bonding surface on the back side concave, stacking the connection land patterns of each board in a fitted manner and performing solder bonding, the bonding area can be reduced. increases, resulting in a fitting connection, which increases the adhesion force during soldering between connecting land patterns, prevents peeling defects, and improves reliability.
本発明は通信機器、電子機器装置等に用いられる中空多
層プリント板に係り、特に中空多層プリント板を構成す
る各基板の積層構造の改良に関するものである。The present invention relates to a hollow multilayer printed board used in communication equipment, electronic equipment, etc., and particularly relates to an improvement in the laminated structure of each substrate constituting the hollow multilayer printed board.
通信機器、電子機器装置に用いられる中空多層プリント
板は、複数枚の基板を、その各基板の接続ランドパター
ン同士を対向させて積層し、半田付は等により一体に構
成していることから、ランドパターン領域以外の領域が
中空となるため、冷却特性が良く、しかも低誘電率で信
号伝送特性が良好な利点を有している。Hollow multilayer printed boards used in communication equipment and electronic equipment are constructed by laminating multiple boards with the connection land patterns of each board facing each other, and soldering them into one piece. Since the area other than the land pattern area is hollow, it has the advantage of good cooling characteristics, low dielectric constant, and good signal transmission characteristics.
一方、このような中空多層プリント板においては、高密
度実装化に伴って基板の積層数が増加する傾向にある。On the other hand, in such hollow multilayer printed boards, the number of laminated boards tends to increase as the density of packaging increases.
このため、各基板を積層した際の接続ランドパターン同
士の半田付は接合時の密着力を向上し得る構造が必要と
される。For this reason, a structure is required that can improve adhesion during soldering between connection land patterns when the respective substrates are stacked.
従来の中空多層プリント板の構造を第７図に示す。図中
、１．２は表面に銅箔等からなる信号線パターン３と、
スルーホール部４に銅箔及び銅メッキ層などからなる接
続ランドパターン５が形成されているガラス繊維とエポ
キシ樹脂、ポリイミド樹脂との複合基材からなる基板で
ある。The structure of a conventional hollow multilayer printed board is shown in FIG. In the figure, 1.2 is a signal line pattern 3 made of copper foil or the like on the surface,
This board is made of a composite base material of glass fiber, epoxy resin, and polyimide resin, and has a connection land pattern 5 made of copper foil, a copper plating layer, etc. formed in the through hole portion 4.
該接続ランドパターン５０表面には電解メッキ法により
鉛−錫合金からなる低融点半田層６が被着されている。A low melting point solder layer 6 made of a lead-tin alloy is deposited on the surface of the connection land pattern 50 by electrolytic plating.
そしてこのような基板１．２を、その各接続ランドパタ
ーン同士が対向するように積層し、加圧した状態で加熱
して、該基板１，２相互を該接続ランドパターン５の低
融点半田層６により接合して一体に構成している。Then, such substrates 1.2 are stacked so that their connection land patterns face each other, and heated under pressure to bond the substrates 1 and 2 together with the low melting point solder layer of the connection land pattern 5. 6 to form an integral structure.
このよう構成の中空多層プリント板は、各基板１．２間
が中空で誘電率が実質的に１となるため信号伝送速度は
従来の２倍以上となる。また、積層後のスルーホールの
穿孔や、スルーホールメッキが不要であるため、かかる
基板を幾層にも積み重ねることが容易である。In the hollow multilayer printed board having such a structure, since the space between each board 1.2 is hollow and the dielectric constant is substantially 1, the signal transmission speed is more than twice that of the conventional board. Further, since there is no need for drilling through holes or plating through holes after lamination, it is easy to stack such substrates in many layers.
ところで上記のような構成の中空多層プリント板におい
ては、各基板１．２相互を該接続ランドパターン５の低
融点半田層６により接合する構造が面接合であるため、
密着力が比較的弱く、基板の取り扱いによっては剥がれ
不良が発生し易いという欠点があった。By the way, in the hollow multilayer printed board having the above structure, since the structure in which the boards 1 and 2 are bonded to each other by the low melting point solder layer 6 of the connection land pattern 5 is surface bonding,
The adhesion force is relatively weak, and peeling defects are likely to occur depending on the handling of the substrate.
本発明はこのような従来の欠点に鑑み、積層する各基板
の相互に対向する接続ランドパターンの形状を変形して
接合面積を増加し、密着力の向上を図った信頼性の良い
新規な中空多層プリント板を提供することを目的とする
ものである。In view of these conventional drawbacks, the present invention has deformed the shape of the connecting land patterns facing each other on each laminated board to increase the bonding area and improve adhesion. The purpose is to provide a multilayer printed board.
本発明は上記目的を達成するため、積層すべき各基板の
スルーホール部に設けた各接続ランドパターンの表面側
接合面を凸形状とし、裏面側の接合面を凹形状とする。In order to achieve the above object, the present invention provides a convex bonding surface on the front side of each connection land pattern provided in the through-hole portion of each substrate to be laminated, and a concave bonding surface on the back side.
このような形状の各接続ランドパターン面に低融点半田
層を設け、かかる構成の各基板をそれぞれ対向する接続
ランドパターンの裏面側の凹形状接合面と表面側の凸形
状接合面同士を嵌合した形で積層して半田接合した構造
とする。A low melting point solder layer is provided on the surface of each connection land pattern having such a shape, and the concave bonding surface on the back side and the convex bonding surface on the front side of the opposing connection land patterns of each board having such a configuration are fitted together. The structure is such that they are stacked and soldered together.
本発明の中空多層プリント板は、各基板が相互に対向す
る接続ランドパターンの凹形状接合面と凸形状接合面同
士が嵌合された形で積層され、半田接合しているため、
接合面積が増加し、かつ嵌合構造と作用しあって密着力
が著しく向上する。In the hollow multilayer printed board of the present invention, each board is laminated with the concave joint surfaces and convex joint surfaces of the mutually opposing connection land patterns fitted together and joined by solder.
The bonding area increases and interacts with the fitting structure to significantly improve adhesion.
その結果、剥がれ不良が防止される。As a result, peeling defects are prevented.
以下図面を用いて本発明の実施例について詳細に説明す
る。Embodiments of the present invention will be described in detail below with reference to the drawings.
第１図は本発明に係る中空多層プリント板の一実施例を
示す要部断面図である。FIG. 1 is a sectional view of essential parts of an embodiment of a hollow multilayer printed board according to the present invention.
図において、１１，１２．１３はそれぞれ表裏面に銅箔
等からなる信号線パターン１４と、各スルーホール部１
５に銅箔及び銅メッキ層などからなる接続ランドパター
ン１６が形成されているガラス繊維とエポキシ樹脂、ポ
リイミド樹脂との複合基材からなる基板である。In the figure, reference numerals 11, 12, and 13 indicate signal line patterns 14 made of copper foil or the like on the front and back surfaces, and through-hole portions 1, respectively.
This board is made of a composite base material of glass fiber, epoxy resin, and polyimide resin, on which a connection land pattern 16 made of copper foil, copper plating layer, etc. is formed on 5.
該接続ランドパターン１６の例えば、表面側接合面１６
ａは凸形状に、また裏面側の接合面１６ｂは凹形状に形
成されており、その各表面には電解メッキ法により鉛−
錫合金からなる低融点半田層１７が被着されている。For example, the front side bonding surface 16 of the connection land pattern 16
a is formed in a convex shape, and the joint surface 16b on the back side is formed in a concave shape, and each surface is plated with lead by electrolytic plating.
A low melting point solder layer 17 made of a tin alloy is deposited.
そしてかかる各基板１１，１２．１３は、それぞれ相互
に対向する接続ランドパターン１６の裏面側の凹形状接
合面１６ｂと表面側の凸形状接合面１６ａ同士が嵌合さ
れた形で積層され、加圧・加熱により半田接合して一体
に構成されている。Each of the substrates 11, 12.13 is laminated with the concave bonding surface 16b on the back side and the convex bonding surface 16a on the front side of the mutually opposing connection land patterns 16 being fitted together, and processed. It is integrally constructed by soldering and joining using pressure and heat.
従って、各基板１１．１２．１３相互を低融点半田層１
７により接合された凹凸接合面１６ａ、 １６ｂ間の密
着力を、その接合面積の増加と嵌合接合構造により高め
ることが可能となる。Therefore, each substrate 11, 12, 13 is connected to each other by a low melting point solder layer 1.
The adhesion between the concavo-convex bonding surfaces 16a and 16b bonded by 7 can be increased by increasing the bonding area and the fitting bonding structure.
尚、このような構造の中空多層プリント板を構成する各
基板を得るには、先ず第２図に示すように表裏面にｗ４
箔２２が被着され、かつスルーホール２３が設けられた
基板２１の表裏面に、例えば溶剤性レジスト膜を塗着し
、バターニングして各スルーホール２３領域に接続ラン
ドパターンを形成するための第２レジスト膜パターン２
４を形成する。In addition, in order to obtain each board constituting the hollow multilayer printed board with such a structure, first, as shown in FIG.
For example, a solvent-based resist film is applied to the front and back surfaces of the substrate 21 on which the foil 22 is adhered and the through holes 23 are provided, and patterned to form a connection land pattern in each through hole 23 area. Second resist film pattern 2
form 4.
次に第３図に示すように該第ルジスト膜パターン２４を
マスクとするマスクメッキ法によりスルーホール２３内
とその接続ランド形成領域に無電解銅メッキと電解銅メ
ッキによる第１ｗ４メツキ層２５を形成する。Next, as shown in FIG. 3, a first W4 plating layer 25 is formed by electroless copper plating and electrolytic copper plating in the through hole 23 and its connection land forming area by a mask plating method using the first Lujist film pattern 24 as a mask. do.
次に第４図に示すように前記第ルジスト膜パターン２４
及び第１銅メッキ層２５上に、例えば水性レジスト膜を
塗着し、バターニングして図示のような第２レジスト膜
パターン２６を形成した後、該第２レジスト膜パターン
２６をマスクとするマスクメッキ法により電解銅メッキ
による第２銅メッキ層２７を形成する。Next, as shown in FIG.
After applying, for example, an aqueous resist film on the first copper plating layer 25 and patterning it to form a second resist film pattern 26 as shown in the figure, a mask using the second resist film pattern 26 as a mask is formed. A second copper plating layer 27 is formed by electrolytic copper plating using a plating method.
次に第５図に示すように前記第２レジスト膜パターン２
６を選択的に除去し、露出する第１．第２銅メツキ層２
５．２７の表面に第ルジスト繞２４をマスクにして鉛−
錫合金からなる低融点半田メッキ層２８を形成する。Next, as shown in FIG.
6 is selectively removed and exposed. Second copper plating layer 2
5. Apply lead on the surface of 27 using the Lujist shell 24 as a mask.
A low melting point solder plating layer 28 made of a tin alloy is formed.
しかる後、前記第ルジスト膜パターン２４を溶解除去液
により選択的に除去することにより、第６図に示すよう
に各スルーホール２３部にそれぞれ低融点半田メッキ２
８が被覆された、例えば表面側が凸形状で、裏面側が凹
形状の接合面を有する接続ランドパターン２９を備えた
基板を容易に得ることができる。Thereafter, by selectively removing the first lurgist film pattern 24 using a dissolving solution, low melting point solder plating 2 is applied to each of the through holes 23, as shown in FIG.
It is possible to easily obtain a substrate having a connecting land pattern 29 coated with a connecting land pattern 29 having, for example, a bonding surface having a convex shape on the front side and a concave shape on the back side.
以上の説明から明らかなように、本発明に係る中空多層
プリント板によれば、積層する各基板相互を低融点半田
層により接合する接続ランドパターンの接合面を凹、凸
接合面とすることにより、接続ランドパターン自身を大
型化することなく、その接合面積が増加すると共に、嵌
合接合構造となることから、前記口、凸接合面間の密着
力が著しく高められる。As is clear from the above description, according to the hollow multilayer printed board according to the present invention, the bonding surfaces of the connection land patterns for bonding the laminated substrates to each other by a low melting point solder layer are made into concave and convex bonding surfaces. Since the bonding area is increased without increasing the size of the connecting land pattern itself, and the fitting bonding structure is formed, the adhesion between the opening and the convex bonding surface is significantly increased.
従って、積層された基板間での剥がれ不良が解消され、
当該中空多層プリント板の信頼性が向上する等、この種
の中空多層プリント坂の構成に通用して実用上極めて有
利である。Therefore, peeling defects between laminated substrates are eliminated,
The reliability of the hollow multilayer printed board is improved, and it is applicable to the construction of this type of hollow multilayer printed board and is extremely advantageous in practice.
第１図は本発明に係る中空多層プリント坂の一実施例を
示す要部断面図、
第２図乃至第６図は本発明に係る中空多層プリント板を
構成する基板の形成法の一実
施例を工程順に説明するための要部断
面図、
第７図は従来の中空多層プリント板を説明するための要
部断面図である。
第１図乃至第６図において、
１１、１２．１３゜２１は基板、１４は信号線パターン
、１５．２３はスルーホール、１６．２９は接続ランド
パターン、１６ａは凸形状接合面、１６ｂは凹形状接合
面、１７は低融点半田層、２２は銅箔、２４は第ルジス
ト膜パターン、２５は第１銅メッキ層、２６は第２レジ
スト膜パターン、２７は第２１４メツキ層、２８は低融
点半田メッキ層をそれぞれ示す。
簿１芒明の史堵４１１１ ！ １乏桐ｔ）や部ｖ斤面図
第１ 図
＠２ 図
／１２銀八ヤ／Ｗ形八ＩＪ呈閏
オ〈貝らσハ／）！ｆ旺」メツ六ノ旨青シメに’ＩＪＬ
９第６ 閃
凭氷剥を設哨「ろ勢４ル納゛面１［Ｕ
ｆＪＳ７ 閃FIG. 1 is a sectional view of essential parts showing an embodiment of a hollow multilayer printed board according to the present invention, and FIGS. 2 to 6 are an embodiment of a method for forming a substrate constituting a hollow multilayer printed board according to the present invention. FIG. 7 is a cross-sectional view of a main part for explaining a conventional hollow multilayer printed board. 1 to 6, 11, 12.13° 21 is a substrate, 14 is a signal line pattern, 15.23 is a through hole, 16.29 is a connection land pattern, 16a is a convex joint surface, and 16b is a concave Shape bonding surface, 17 is a low melting point solder layer, 22 is a copper foil, 24 is a resist film pattern, 25 is a first copper plating layer, 26 is a second resist film pattern, 27 is a 214th plating layer, 28 is a low melting point Each solder plating layer is shown. Shito 4111 of Book 1 Fuming! 1 Hōgiri t) Ya Part V 斤面图 1 ＠ 2 fig. / 12 Gin Hachiya / W-shaped 8 IJ Presentation O〈Kaira σ Ha/)! 'IJL'
9th No. 6 Flashing ice peeling sentry ``Rosei 4 Lu's surface 1 [U fJS7 Flash
Claims (1)
）を設けた複数枚の基板（１１、１２、１３）を、該各
基板（１１、１２、１３）の接続ランドパターン（１６
）同士を対向させた形で積層し、半田付け接合してなる
多層プリント板の構成において、 上記各基板（１１、１２、１３）のスルーホール（１５
）部に設けた接続ランドパターン（１６）の、一方の接
合面（１６ａ）を凸形状、他方の接合面（１６ｂ）を凹
形状とし、各基板（１１、１２、１３）の接続ランドパ
ターン（１６）同士を嵌合した形に積層してなることを
特徴とする中空多層プリント板。[Claims] A connection land pattern (16) is provided in the through hole (15).
) are provided with connection land patterns (16
) in the structure of a multilayer printed board formed by stacking the boards facing each other and joining them by soldering.
) of the connection land pattern (16), one bonding surface (16a) is convex and the other bonding surface (16b) is concave, and the connection land pattern (16) of each board (11, 12, 13) is 16) A hollow multilayer printed board characterized by being laminated in a shape that fits together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5740486A JPS62213295A (en) | 1986-03-14 | 1986-03-14 | Hollow multilayer printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5740486A JPS62213295A (en) | 1986-03-14 | 1986-03-14 | Hollow multilayer printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62213295A true JPS62213295A (en) | 1987-09-19 |
Family
ID=13054700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5740486A Pending JPS62213295A (en) | 1986-03-14 | 1986-03-14 | Hollow multilayer printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62213295A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021174650A (en) * | 2020-04-23 | 2021-11-01 | Ｎｅｃプラットフォームズ株式会社 | Stacking connector |
-
1986
- 1986-03-14 JP JP5740486A patent/JPS62213295A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021174650A (en) * | 2020-04-23 | 2021-11-01 | Ｎｅｃプラットフォームズ株式会社 | Stacking connector |
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