JPS62211399A - Electrolytic cell for electroplating of alloy - Google Patents
Electrolytic cell for electroplating of alloyInfo
- Publication number
- JPS62211399A JPS62211399A JP5150986A JP5150986A JPS62211399A JP S62211399 A JPS62211399 A JP S62211399A JP 5150986 A JP5150986 A JP 5150986A JP 5150986 A JP5150986 A JP 5150986A JP S62211399 A JPS62211399 A JP S62211399A
- Authority
- JP
- Japan
- Prior art keywords
- strip
- flow
- jet
- alloy
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000956 alloy Substances 0.000 title claims abstract description 23
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 23
- 238000009713 electroplating Methods 0.000 title claims description 16
- 238000007747 plating Methods 0.000 claims abstract description 32
- 238000005507 spraying Methods 0.000 claims 1
- 230000001105 regulatory effect Effects 0.000 abstract 3
- 230000000903 blocking effect Effects 0.000 abstract 1
- 239000000203 mixture Substances 0.000 description 7
- 238000009826 distribution Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 235000009852 Cucurbita pepo Nutrition 0.000 description 2
- 241000219104 Cucurbitaceae Species 0.000 description 2
- 229910001297 Zn alloy Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910007567 Zn-Ni Inorganic materials 0.000 description 1
- 229910007614 Zn—Ni Inorganic materials 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 235000003891 ferrous sulphate Nutrition 0.000 description 1
- 239000011790 ferrous sulphate Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 description 1
- 229910000359 iron(II) sulfate Inorganic materials 0.000 description 1
- LWUVWAREOOAHDW-UHFFFAOYSA-N lead silver Chemical compound [Ag].[Pb] LWUVWAREOOAHDW-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
- 229960001763 zinc sulfate Drugs 0.000 description 1
- 229910000368 zinc sulfate Inorganic materials 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は合金電気鍍金用電解槽に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to an electrolytic cell for alloy electroplating.
近年、製品の多様化・用途拡大に伴い、それに応じて各
種の表面性状を有する鋼板の提供が要請され、鋼板表面
に各種合金層を形成せしめる合金電気鍍金が多用される
ようになった。In recent years, with the diversification and expansion of applications of products, there has been a demand for steel sheets with various surface textures, and alloy electroplating, which forms various alloy layers on the surface of steel sheets, has come into widespread use.
この鍍金方法は電流密度の調整により表面皮膜の合金組
成をコントロールすることができるほか、更に第8図に
示されるようにストリップ(1)と電極(2) (3)
との間に噴流ヘッダ(4) +5)から鍍金浴を噴流せ
しめ、該ストリップ+1)近傍の鍍金浴の流速を適宜調
整することにより、同じく表面皮膜の合金組成のコント
ロールを行なうこともできる。This plating method not only allows controlling the alloy composition of the surface film by adjusting the current density, but also allows the strip (1) and electrode (2) (3) to be separated as shown in Figure 8.
The alloy composition of the surface coating can also be similarly controlled by jetting a plating bath from the jet header (4) +5) between the strips and adjusting the flow rate of the plating bath near the strip +1) as appropriate.
ところが上記のようIcM金浴を噴流せしめてス) I
Jツブ(1)表面皮膜の合金組成のコントロールを行な
った場合、形成された鍍金層の合金組成を調べてみると
、粂金層深さ方向で異なっていることがわかる。これは
ストリップ(1)と1極(21(3)の間に流れる噴流
が、噴流ヘッダ(4)(5)側とその反対側の間では、
第9図に示すような流速分布の不均一が生じているため
である。However, as mentioned above, when the IcM gold bath was jetted,
When the alloy composition of the J-tube (1) surface film is controlled, an examination of the alloy composition of the formed plating layer reveals that it differs in the depth direction of the plating layer. This means that the jet flowing between the strip (1) and one pole (21 (3)) is between the jet header (4) (5) side and the opposite side.
This is because the flow velocity distribution is non-uniform as shown in FIG. 9.
これに対し、Fe−Zn 、 Zn−Ni 、 Zn−
Mn等の合金電気鍍金鋼板の製造においては、電流密間
により鍍金皮膜中の合金組成、皮膜性能等が変化するた
め、電流密度の均一化が必要となる。On the other hand, Fe-Zn, Zn-Ni, Zn-
In the production of steel sheets electroplated with alloys such as Mn, the current density changes the alloy composition, film performance, etc. in the plating film, so it is necessary to make the current density uniform.
本発明は以上のような問題に鑑み創案されたもので、ス
トリップ近傍での鍍金浴噴流の“流速のバラツキを有効
に防止することにより、鍍金層深さ方向での合金組成の
均一化を図ろうとするものである。The present invention was devised in view of the above-mentioned problems, and aims to make the alloy composition uniform in the depth direction of the plating layer by effectively preventing variations in the flow velocity of the plating bath jet near the strip. It is something that we try to do.
まず本発明者等は、ストリップ(1)と電極(2)(3
)との間に噴流ヘッダ(41(5)から鍍金層を噴流せ
しめた場合に、第9図に示すような噴流の流速分布の不
均一が生ずる原因につき検討を重ねた。そして本発明者
等が達した結論は次のようなものであった。即ち、噴流
ヘッダ(4)(5)から出た鍍金層は、ヘッダ(41(
5)ノズル先端の狭い空間から急に広い所へ噴出せしめ
られるため、前記噴流ヘッダ(4) (5)側からその
反対側へ流れる間に、ストリップ(1]及び電極(21
(33間でストリップ−′−!L極間方向に次第に広が
って流れ、その結果、広がった先の方はど噴流の流速が
遅くなるというものである。First, the inventors proposed a strip (1) and an electrode (2) (3).
) The inventors have repeatedly investigated the cause of the non-uniform flow velocity distribution of the jet as shown in FIG. 9 when the plating layer is jetted from the jet header (41(5)). The conclusion reached was as follows: The plating layer coming out of the jet headers (4) and (5) was the same as the header (41 (
5) Since the jet is suddenly made to spread from the narrow space at the tip of the nozzle, the strip (1) and the electrode (21) flow from the jet header (4) (5) to the opposite side.
(Between 33 and 33, the flow gradually spreads in the direction between the strips -'-!L poles, and as a result, the flow velocity of the jet becomes slower at the end where it spreads.
従って前記噴流へラダf41(5)から出た鍍金層の噴
流が、噴流ヘッダ+41 (51側からその反対側へ流
れる間に、前記電極+21(3)とストリップ(1)と
の間で広がらないようにすることができれば、上記問題
を解決することが可能となる。Therefore, the jet of the plating layer coming out from the rudder f41 (5) to the jet does not spread between the electrode +21 (3) and the strip (1) while flowing from the jet header +41 (51 side) to the opposite side. If this can be done, the above problem can be solved.
本発明はこのような基点に立って創案されたものであり
、第1図に示された構成を有する合金電気鍍金用電解槽
からなる。即ち、電極+21(3)とストリップ11)
との間に噴流ヘッダ(4)+5)から鍍金層を噴流せし
めながら合金電気鍍金を行なう合金電気鍍金用電解槽に
おいて、前記電極(2)(3)とストリップ(1)の間
であって該ストリップ+11の流れに対向する方向に各
間隔を開けて複数の整流板(6)を設けたものである。The present invention was devised based on this basic point, and consists of an electrolytic cell for alloy electroplating having the configuration shown in FIG. i.e. electrode +21(3) and strip 11)
In an electrolytic cell for alloy electroplating in which alloy electroplating is performed while jetting a plating layer from a jet header (4) + 5) between the electrodes (2) and (3) and the strip (1), A plurality of rectifying plates (6) are provided at intervals in a direction facing the flow of the strip +11.
この場合、整流板(6)は図面のようにその端部を直接
電極+21 (3)に接するように設置する場合のほか
、′1極(2)(3)との間に間隙を設けて電@ (2
1(3)−ストリップ(1)間に設置しても良い。In this case, the rectifying plate (6) may be installed so that its end is in direct contact with the electrode +21 (3) as shown in the drawing, or it may be installed with a gap between it and the '1 pole (2) (3). Electric @ (2
1 (3) and the strip (1).
このように複数の整流板(6)が設けられたことにより
、噴流ヘッダ(41(5)から出てその反対側へ流れる
鍍金浴噴流は、これらの整流板(6]先端とストリップ
(1)との間を流れることになり、その流れが整流板(
6)先端に阻まれてストリップ−電極間方向に広がるこ
とがな・くなるため、!2図のように該噴流の流速が噴
流ヘッダ+41 +5)側とその反対側の間でほぼ均一
となる。By providing a plurality of rectifier plates (6) in this way, the plating bath jet that comes out of the jet header (41 (5) and flows to the opposite side thereof) flows between the tips of these rectifier plates (6) and the strip (1). The flow will flow between the current plate (
6) This prevents the strip from spreading in the direction between the strip and the electrode because it is blocked by the tip! As shown in Fig. 2, the flow velocity of the jet stream becomes approximately uniform between the jet stream header +41 +5) side and the opposite side.
尚、前記整流板(6)はストリップ(1)の流れに対向
する方向に各間隔を開けて設けられているため、電気鍍
金への影響はほとんどない。Incidentally, since the rectifying plates (6) are provided at intervals in the direction opposite to the flow of the strip (1), there is almost no influence on the electroplating.
〔実施例1〕
本発明者等は、第3図に示すように2セルからなる連続
式両面電気鍍金装置に、長さ1400、 の鉛銀(p
b −Ag ) *ノIEmcIQIjl)3]01)
を夫々設置し、且つ各セルの出画近傍にノズルギャップ
(tl) 3 ymの噴流ヘッダαOelm) tl
eηを設けると共に、硫酸亜鉛(znso、)及び硫酸
第一鉄(FeSO,) を主成分とする鍍金層を満た
し、前記噴流ヘッダ(イ)@η図(9)より鍍金液を噴
流せしめながら、板厚0.7−のストリップαO両面に
Fe−Zn合金電気波会合行なった。[Example 1] The present inventors installed lead-silver (p-silver) with a length of 1400 mm in a continuous double-sided electroplating apparatus consisting of 2 cells as shown in FIG.
b -Ag) *ノIEmcIQIjl)3]01)
and a jet header αOelm) with a nozzle gap (tl) 3 ym near the image output of each cell.
While providing a plating layer containing zinc sulfate (znso, ) and ferrous sulfate (FeSO,) as main components, and jetting the plating solution from the jet header (a) @ η Figure (9), Electric wave convergence of Fe--Zn alloy was carried out on both sides of the strip αO having a thickness of 0.7 mm.
この時、前記電@…(ハ)田6ηのス) IJツブσ0
側表面には、各間隔(L3)140mを開けてストリッ
プ■の流れに対向する方向をこ板厚(t、)3簡の整流
板e4(塩ビ!!りを直接接触せしめておいたが、これ
らの整流板−についてはその長さを変え、ストリップ口
−整渡板川間の距離(L、)を10 +m 、 12.
5 m 、 15 tm 、 17.5■、20燗とし
た場合と、整流板■なしの場合(図中り、が25瓢の場
合)に分けて実験を行なった。At this time, the electric field @...(c) field 6η's) IJ knob σ0
On the side surface, a rectifying plate e4 (PVC!!) with a thickness (t,) of 3 sheets was placed in direct contact with the direction opposite to the flow of the strip (L3) with an interval (L3) of 140 m. The lengths of these rectifying plates were changed, and the distance (L,) between the strip opening and the straightening plate was 10 + m, 12.
Experiments were conducted in two cases: 5 m, 15 tm, 17.5 tm, and 20 gourds, and one without the rectifier plate (in the figure, 25 gourds).
そして鍍金層をGDSにより分析し、その深さ方向にあ
けるFe含有量の分布を調べ、第4図の整流板■−ス)
IJツブ11[1間距離(L、)の変動によるFe含
有量変動幅を示す結果を得た。Then, the plating layer was analyzed by GDS, and the distribution of Fe content in the depth direction was investigated.
Results were obtained showing the range of Fe content variation due to variation in the distance (L,) between IJ knobs 11 [1].
この時の鍍金条件は次の通りである。The plating conditions at this time were as follows.
鍍金条件
使用セル数 2
電 極 長 1400w+X2
平均を流密度 50 A/dm”
ライン速度 15mpm
付 着 −* 15 ?/m”鍍 金
液 Fe50.・7H,0/(FeSO,・7H,0
+ Zn5O,・7H,0) = 0.7pH= 2.
5
ストリップ板厚 0.7m
尚、第4図のF’e含有量の変動幅は例えば第5図に示
すように鍍金層深さ方向におけるFe含有量の最大値a
と最低1ばbとの差を求めたものである。Plating conditions Number of cells used: 2 Electrode length: 1400w+X2 Average current density: 50 A/dm Line speed: 15 mpm Deposition -* 15?/m
Liquid Fe50.・7H,0/(FeSO,・7H,0
+ Zn5O, 7H, 0) = 0.7pH = 2.
5 Strip thickness 0.7 m The fluctuation range of the F'e content in Fig. 4 is, for example, the maximum value a of the Fe content in the depth direction of the plating layer as shown in Fig. 5.
The difference between and at least 1 b is calculated.
その皓果、本発明のように整流板−を電極(7)?υo
Hη−ス) IJツブσO間に設けた場合のほうが、そ
れを設けない従来法の場合に比べ、Fe含有量の変動幅
が小さくなり、特に整流板−−ス) IJツブσO間距
m (Lt)をi u m 。As a result, as in the present invention, the current plate is used as an electrode (7)? υo
When it is provided between the IJ knobs σO, the fluctuation range of the Fe content is smaller than in the conventional method where it is not provided, especially when the current plate is provided between the IJ knobs σO ) to i u m.
12.5+ms及び15mとした場合は、その変動幅が
2%以下となり、従来法による変動幅が10壬程度であ
るのに比べ、極めて顕著な効果を有していることがわか
る。In the case of 12.5+ms and 15 m, the variation range is 2% or less, which is a very significant effect compared to the conventional method, which has a variation range of about 10 mm.
尚、この実験の場合も同じであるが、他の実験において
も鍍金層深さ方向におけるFe含有量変動幅を極めて低
く設定するためには。In addition, in order to set the Fe content variation range in the depth direction of the plating layer to be extremely low in the case of this experiment as well as in other experiments as well.
整流板−一ストリップαO間距a’I(Lt)を噴流ヘ
ッダ■@1)e4(財)のノズルギャップ(t、)の5
倍以下に設定することが好ましい。The distance a'I (Lt) between the current plate and one strip αO is the nozzle gap (t, ) of the jet header ■ @ 1) e4 (goods).
It is preferable to set it to twice or less.
〔実施例2〕
次に本発明者等は、前実施例と同じ鍍金条件のもとで、
第6図に示すように整流板11) −スト97700間
の距離(Lt)を15mとし、該整流板e])を電極(
ホ)(財)GIN(31)から離間せしめて、その間の
距離(L、)を1戴から7−の範囲で1−毎に変えた場
合と、前実施列のように前記整流板6υを電極(イ)a
])田0υに接触させた場合(L、=Oの場合)に分け
、Fe−Zn合金電気鍍金を行なった。[Example 2] Next, the present inventors under the same plating conditions as in the previous example,
As shown in FIG. 6, the distance (Lt) between the current plate 11) and the current plate 97700 is 15 m, and the current plate e]) is connected to the electrode (
e) When the rectifying plate 6υ is separated from GIN (31) and the distance (L, ) between them is changed in steps of 1 in the range of 1 to 7, and as in the previous row, Electrode (a) a
]) Fe--Zn alloy electroplating was carried out separately for the case of contact with the field 0υ (case of L, =O).
そして、それらの鍍金JfjをGDSにより分析し、そ
の深さ方向におけるFe含有量の分布を調べ、第7図に
示す結果を得た。同図のFe含有量変動幅の値について
も、前実施例と同様、鍍金層深さ方向におけるFe含有
量の最大値と最低値との差を求めたものである。Then, those plating Jfj were analyzed by GDS to examine the distribution of Fe content in the depth direction, and the results shown in FIG. 7 were obtained. Similarly to the previous example, the value of the Fe content fluctuation range in the figure is obtained by determining the difference between the maximum value and the minimum value of the Fe content in the depth direction of the plating layer.
その結果、整流板II)を電劉o @1) C3[)
01)表面に接触させた場合のほうがFe含有量の変動
幅が最も小さく、整流板−一電極翰(財)cl[110
])距離(L、)が大きくなるにつれ、上記変動幅は次
第に大きくなり、特に3mを超えた範囲ではその変動幅
の増大は顕著になる。従って本発明では%整流板611
を電極四圓艶0υの表面に直接接触せしめて電気鍍金を
行なうようにすることが最も好ましく、又、整流板OO
と電@圓(ハ)(3[1(31)の間に間隙を設けると
しても、その間の距離(L、)としては、整流板@〃−
ストリップα0間距離(Lt)のτ以下とするのが適当
である。As a result, the rectifier plate II) is changed to the electric current @1) C3[)
01) The fluctuation range of the Fe content is the smallest when it is in contact with the surface, and the current plate-one-electrode cl[110
]) As the distance (L, ) increases, the above fluctuation range gradually increases, and the increase in the fluctuation range becomes particularly noticeable in a range exceeding 3 m. Therefore, in the present invention, the % rectifier plate 611
It is most preferable to perform electroplating by directly contacting the surface of the electrode with a glossy surface of 0υ.
Even if a gap is provided between the current plate @〃-
It is appropriate that the distance between the strips α0 be less than or equal to the distance τ between the strips α0 (Lt).
このような結果は、本発明者等の他の実験においても同
様であった。Similar results were obtained in other experiments conducted by the present inventors.
以上説明したように本発明に係る電解槽ヰこよれば、ス
トリップと電極の間ζこ整流板を設けているため、スト
リップ−電極間の噴流の流れが、整流板先端に阻まれて
ストリップ−電極間方向に広がることがなくなるため、
噴流ヘッダ側とその反対側との間での鍍金層深さ方向で
の合金組成の均一化が図られて皮膜性能の安定化を図る
ことができるという優れた効果を有している。As explained above, according to the electrolytic cell according to the present invention, since the rectifying plate is provided between the strip and the electrode, the flow of jet between the strip and the electrode is blocked by the tip of the rectifying plate, and the flow of the jet between the strip and the electrode is blocked by the tip of the rectifying plate, Since it will not spread in the direction between the electrodes,
This has the excellent effect of making the alloy composition uniform in the depth direction of the plating layer between the jet header side and the opposite side, thereby stabilizing the coating performance.
第1図は本発明に係る合金電気鍍金用電解槽の概略図、
第2図は上記電解槽における噴流ヘッダ側とその反対側
との間の鍍金層噴流の流速分布を示すグラフ図、第3図
は本発明の第1実施例に係る合金電気鍍金用′HL解槽
の蜆略図、#JJ4図は同実施例の結果を示すグラフ図
、第5図は第4図におけるFe含有量変動幅の求め方を
説明するグラフ図、第6図は本発明の第2夾施例に係る
合金電気鍍金用電解槽の概略図、第7図は同実施例の結
果を示すグラフ図、第8図は従来型の電f4慴の構成を
示す説明図、第9図は上記1解(特における噴流ヘッダ
側とその反対側との間の鍍金浴噴流の流速分布を示すグ
ラフ図である。
図中、Hl(IGはストリップ、(21fi elf
(31GCI Hは1鳳、+41 (4(lθ1) +
51閃佑0は噴流ヘッダ、(6)句−は整流板を各示す
。
特許出願人 日本鋼管株式会社
発 明 者 辻 原 利 遠回
阿 南 達 部面
生 天 目 潰回
吉 岡 膿向
坂 本 徳 彦代理人
弁理士 吉 原 省 玉量 同
高 橋 清第 1
図
第2図
(廿責i私ツダイ則)
L2 (愛iえ引文−ストプツア開躇難) [m
mコ第 7 図
Lt (’IJ−’!u?m間距Qり [mml第
8 図
第 9 図
(゛噴i先へ・・ツバ則)FIG. 1 is a schematic diagram of an electrolytic cell for alloy electroplating according to the present invention,
FIG. 2 is a graph showing the flow velocity distribution of the plating layer jet between the jet header side and the opposite side in the electrolytic cell, and FIG. 3 is a HL solution for alloy electroplating according to the first embodiment of the present invention. A schematic diagram of the tank, #JJ4 is a graph showing the results of the same example, FIG. 5 is a graph explaining how to determine the Fe content fluctuation range in FIG. 4, and FIG. A schematic diagram of an electrolytic cell for alloy electroplating according to an example, FIG. 7 is a graph showing the results of the same example, FIG. 8 is an explanatory diagram showing the configuration of a conventional electrolytic F4 machine, and FIG. It is a graph diagram showing the flow velocity distribution of the plating bath jet between the jet header side and the opposite side in the above solution 1 (particularly). In the figure, Hl (IG is a strip, (21 fi elf
(31GCI H is 1, +41 (4(lθ1) +
51Senyu0 indicates a jet header, and (6) indicates a rectifier plate. Patent applicant: Nippon Kokan Co., Ltd. Inventor: Toshi Tsujihara
Anan Tatsumen
Raw heavenly eyes crushing times
Yoshioka Yumuko, Sakamoto Norihiko, Patent Attorney, Yoshihara Sho, Tamayo
Kiyodai Takahashi 1
Figure 2 (Responsibility I Tsudai Rule) L2 (Ai I Ekibun - Stopzha Kaidandan) [m
mco Fig. 7 Lt ('IJ-'!u?m distance Qri [mml Fig. 8 Fig. 9 ('Towards the jet i...Brim rule)
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5150986A JPS62211399A (en) | 1986-03-11 | 1986-03-11 | Electrolytic cell for electroplating of alloy |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5150986A JPS62211399A (en) | 1986-03-11 | 1986-03-11 | Electrolytic cell for electroplating of alloy |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62211399A true JPS62211399A (en) | 1987-09-17 |
Family
ID=12888968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5150986A Pending JPS62211399A (en) | 1986-03-11 | 1986-03-11 | Electrolytic cell for electroplating of alloy |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62211399A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1995032322A1 (en) * | 1994-05-24 | 1995-11-30 | Toyo Kohan Co., Ltd. | Strip treating apparatus |
-
1986
- 1986-03-11 JP JP5150986A patent/JPS62211399A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1995032322A1 (en) * | 1994-05-24 | 1995-11-30 | Toyo Kohan Co., Ltd. | Strip treating apparatus |
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