JPH02141564A - Production of hot dip sn coated wire - Google Patents

Abstract

PURPOSE:To stably produce the hot dip Sn coated wire having excellent surface quality by passing molten Sn to an Sn plating section provided with an angle and running the wire in the direction opposite to this flow, thereby plating the wire. CONSTITUTION:The angle alpha is provided to the Sn plating section in a plating cell 1. This angle alpha is adequately about 5 to 30 deg. with horizontal. The molten Sn 2 is allowed to flow in a hollow groove 6 formed along this Sn plating section to generate the flow thereof. The wire 4 is run in the direction opposite to the flow of this molten Sn and is thereby plated; thereafter, the wire is passed through a die 5 to adjust the plating thickness. Since the generation of the flow of the molten Sn in the same direction as the progressing direction of the wire 4 is obviated in this way, the generation of the fluctuation in the plating thickness in the longitudinal direction is suppressed and the hot dip Sn plate wire having high quality is obtd.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing a hot-dip Sn-plated wire, which provides a high-quality plated wire with little variation in longitudinal plating thickness.

[Conventional technology and its section H] When continuously applying Sn plating to copper wire, etc., the wire drawn by a wire drawing machine is annealed in an energizing annealer or a tunnel furnace annealer, and then transferred to a molten Sn plating tank or a cooling tank. , a winding machine, etc., to produce Sn coated wire. Sn
The wire surface is treated with an annealer before passing through the plating bath.
It is done before or after. Sn coating is generally carried out by the method shown in FIGS. 4 and 5.

That is, as shown in FIG. 1(a), the wire (4) is passed through the molten Sn via the turn roll (3) provided in the molten Sn (2) in the plating bath (1), and Plating is performed by vertically pulling the material through a drawing die (5). There is also a method of drawing the line diagonally as shown in (b), and there is also a method of drawing the line horizontally as shown in FIG. In these plating methods, a flow of molten Sn occurs in the same direction as the direction in which the wire travels, and the quality of the coated wire may change depending on the quality of the pretreatment of the wire. Further, variations in plating thickness occur in the longitudinal direction of the wire, and it is necessary to apply Sn thickly, which is also a factor in increasing costs. Adjustment of this plating thickness is determined by the clearance of the drawing die, but the desired plating thickness cannot be obtained unless the pretreatment conditions, plating speed, temperature of molten Sn, etc. are properly adjusted.

In addition, if the Sn in the plating tank decreases, either solid Sn is supplied directly into the tank, or another molten 5nlfi is provided and molten metal is supplied from this tank to replenish solid Sn to this molten Sn tank. Either circulation method is used. However, in all of the above methods, dross and Sn oxide increase in the plating tank while plating is being performed, so that plating quality deteriorates significantly if plating is performed for a long time.

[Problem to be solved by the invention]

The present invention has been developed as a result of studies on the above-mentioned problems, and a method for stably manufacturing plated wires with excellent surface quality.

[Means and effects for solving the problem] The present invention provides S
This method of manufacturing a molten Sn-plated wire is characterized in that the n-plated portion is angled to create a flow of molten Sn, and plating is performed by running the wire in the opposite direction to the flow of the molten Sn.

That is, in the present invention, as shown in FIG. 1, for example, an angle (α
) to create a flow of molten Sn, run the wire (4) in the opposite direction to the flow of molten Sn, perform plating, adjust the plating thickness with a drawing die (5), and manufacture Sn-plated wire. It is something to do. Another example is a drawing die (
There is also a method of adjusting the plating thickness by arranging 5) immediately after the Sn plating part.

In the above method, the molten Sn is set separately.
It is filtered from a tank (not shown) by a transfer device such as a pump, and is supplied to the upper part of the plating tank (1), forming a concave groove (6) having a predetermined angle (α) as shown in FIG. It flows downhill.

However, the angle of the Sn plating part mentioned above affects the variation in the plating thickness in the longitudinal direction of the coating wire, and the variation in the plating thickness will be smaller if it is at an angle of 5° to 30° with respect to the horizontal. It is also easy to adjust the plating thickness.

In addition, the wire diameter, wire speed, temperature of molten Sn, etc. have a slight effect on variations in plating thickness and adjustment of plating thickness, but the wire diameter is 0.3 mm to 0.03 mn+, and the wire speed is 300 m/min. 1500m/min, molten Sn temperature 250°C to 350°
Good results can be obtained by appropriately combining conditions C.

As described above, the present invention angles the Sn plating part, creates a flow of molten Sn, and performs plating by running a wire in the opposite direction to the flow of the molten Sn. Since there is no flow of Sn, a plated wire with little variation in longitudinal plating thickness can be obtained.

Furthermore, since the present invention uses a complete circulation method in which Sn that has passed through a filter is always supplied, high-quality plated wire can be manufactured even if plating is performed for a long time.

〔Example〕

An embodiment of the present invention will be described below.

Example 1 Using an apparatus as shown in FIG.
With angles of 20° and 30°, the wire diameter is 0.16.0.
10. Line speed 50 for three types of wires of 0.05maφ
Sn plating was performed at a speed of 0 m/min and a molten Sn temperature of 270''C.

Example 2 Using an apparatus as shown in Fig. 3, lOo relative to the horizontal
With angles of 20° and 30°, the wire diameter is 0.16.0.
10. Line speed 50 for three types of wires of 0.05 + mφ
Sn plating was performed at a speed of 0 m/min and a molten Sn temperature of 270°C.

The coating thickness uniformity of the Sn-plated wire produced in this way and the Sn-plated wire produced by the conventional method was 5000.
Variation when measuring plating thickness at m intervals and 1
Table 1 shows the results of a comparison regarding the amount of plating per wire breakage. The plating thickness was measured by a constant current anodic dissolution method, and the uniformity of plating was measured by an ammonium persulfate method. The smaller the dots, the better the uniformity.

? EE2) Variation in plating thickness: 10 points in total, measured once every 5000 m As is clear from Table 1, Na 1-
The k 1 B according to the present invention has a thin Sn plating thickness and can be plated without impairing uniformity. Also, there was no variation in the plating thickness in the longitudinal direction.19
It can be seen that the results are superior to those obtained by the conventional method of ~Na24, and the amount of plating per wire breakage is also superior to that of the present invention.

〔effect〕

As explained above, according to the present invention, it is possible to obtain a Sn-plated wire of high quality and with small fluctuations in quality in the longitudinal direction, and it has a significant industrial effect.

[Brief explanation of the drawing]

FIG. 1 and FIG. 3 are front views showing one embodiment of the present invention;
FIG. 2 is a side view of FIG. 1, and FIGS. 4 and 5 are front views showing a conventional hot-dip Sn plating method. 1... Plating tank, 2... Molten Sn, 3...
Turn roll, 4... wire, 5... drawing die,
6...concave groove.

Claims (1)

[Claims] A method for producing a molten Sn-plated wire, characterized in that the Sn-plated part is angled to create a flow of molten Sn, and the wire is plated by running in the opposite direction to the flow of the molten Sn.