JPS6221001Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to the structure of a motherboard with quartz rollers used in semiconductor manufacturing, particularly in diffusion, oxidation, and CVD processes.

Conventionally, the quartz boats used in the diffusion, oxidation, and CVD processes have changed from ladder-type boats to mother boats, and then cassette boats on top of them, due to the demands for larger wafers and increased processing numbers in one batch. This method has changed. The structure of the mother boat used rollers with a small contact area with the furnace core tube to prevent the quartz bar from rubbing against the furnace core tube and generating quartz powder. However, due to the structure described above, the temperature is relatively high (800℃~800℃).
During long-term processing at temperatures (1100℃), the mother boat with quartz rollers would bend due to the boat's own weight and the load of the wafers, which would rub against the furnace core tube, producing quartz powder and making it difficult to take the boat in and out. has occurred.

This invention uses a quartz pipe in a motherboard with a quartz roller, and vacuum-seals a solid SiC rod with a diameter smaller than the inner diameter of the quartz pipe inside the pipe.
The object of the present invention is to eliminate the above drawbacks and provide a motherboard with quartz rollers that does not bend.

Hereinafter, the present invention will be explained in detail using the drawings.

FIG. 1 shows a conventionally used motherboard with quartz rollers. That is, a quartz roller is provided on a solid quartz rod, a bucket board is placed on this rod, and the drawer rod is inserted into and taken out of the reaction tube using the hook part 1.

Figure 2 shows the motherboard with SiC-containing quartz rollers of the present invention. In this invention, instead of the solid quartz rod 3 in Fig. 1, a quartz pipe 4 (inner diameter 8 to 30 mm) is used.
A high-purity SiC rod 5 with a diameter of 6 to 25 mm is placed inside the pipe 4 to prevent the pipe 4 from bursting due to thermal expansion of the gas inside the pipe 4. Therefore, after evacuating the opening 6, the vacuum opening 6 is fused to form a motherboard.

The SiC rod 6-equipped motherboard with quartz rollers formed as described above can withstand high temperatures (800°C) compared to conventional motherboards with quartz rollers due to the excellent heat resistance and high strength of the SiC rods 6. Even during long-term processing at temperatures up to 1100℃, there is almost no settling, and almost no quartz powder is generated due to rubbing between the mother boat and the furnace core tube. Therefore, it also leads to an improvement in the yield of wafers. Also, when loading and unloading the boat, the contact area with the furnace core tube can be kept constant even during long-term use.
becomes easier. Moreover, the SiC solid rod 5 is vacuum-sealed within the quartz pipe 4. Therefore, contamination of the SiC rod 5 is prevented, gas expansion inside the quartz pipe 4 does not occur during heat treatment during semiconductor manufacturing, and destruction of the quartz pipe 4 is prevented. Furthermore, since the SiC solid rod 5 has a smaller inner diameter than the quartz pipe 4, the SiC solid rod 5 does not contact the inner wall of the quartz pipe 4 on its entire surface, but only partially contacts it. Therefore, the influence of contamination or cracks in the quartz pipe 4 does not directly affect the entire solid SiC rod 5, and a longer life is achieved. This means that even if the quartz pipe 4 should be damaged, the SiC bar 5 can be reused.

In addition, SiC's excellent heat resistance and high strength are not only effective when applied to motherboards with quartz rollers, but can also be applied to pull-out rods that are used at high temperatures.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing a conventional motherboard with quartz rollers, and FIG. 2 is a sectional view showing a motherboard with SiC-containing quartz rollers, which is an embodiment of the present invention. 1...Drawer rod hooking part when loading and unloading the motherboard, 2...Quartz roller, 3...Quartz bar, 4
...Quartz pipe, 5...SiC solid rod, 6...Vacuum opening.

Claims (1)

[Scope of utility model registration request] A quartz pipe having a SiC rod inside is used as a motherboard for loading and unloading semiconductor wafers into a reactor, and the SiC rod has a smaller diameter than the inner diameter of the quartz pipe, and a vacuum is placed inside the quartz pipe. A semiconductor manufacturing device characterized by being enclosed.