JPS62207008A - Piezoelectric oscillator - Google Patents

Abstract

PURPOSE:To obtain an oscillator with excellent shock-resistance by inserting a supporter having >=1 elastic layer to a fixed part between a piezoelectric oscillator chip and a circuit board mounted with an electric element oscillating the chip. CONSTITUTION:A flexible conductive adhesives 7 is placed on the circuit board 3 as a supporter and the flexible conductive adhesives is not completely cured but semi-cured. Moreover, another layer of a flexible conductive adhesive 4 is applied onto the flexible conductive adhesive agent 7 in the semi-cured state, electric conductivity is taken, a crystal oscillation chip 5 is placed on it and the layer of the flexible conductive adhesives 7 being a rubber elastic member after curing is provided between the crystal oscillation chip 5 and the circuit board 3. Thus, the buffer layer absorbs shock/vibration and even if shock/ vibration due to falling is exerted, the piezoelectric oscillation chip is hardly cracked.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a piezoelectric oscillator in which a piezoelectric oscillation piece and an oscillation circuit are housed in the same package.

[Conventional technology]

A conventional piezoelectric oscillation device 6 is shown in a front view in FIG. A gold @ size cylindrical supporter (support bin) 5 is placed on the circuit board 55 which is placed on the circuit board 55.
8 is fixed by soldering etc. in the same manner as the elements 52,
A piezoelectric oscillation piece (in this example, a crystal oscillation piece) 55 is fixed onto the support pin 58 with a conductive adhesive 54 .

Furthermore, a metal cap 59 is bonded and sealed to the stem 56 by resistance welding or the like.

[Problem that the invention seeks to solve]

However, according to the conventional configuration described above, the stem circuit board and support bin have almost no elasticity, and the conductive adhesive that joins them also has almost no elasticity, so Since shocks and vibrations are directly transmitted to the piezoelectric oscillating piece, cracking of the piezoelectric oscillating piece is likely to occur, and there is a problem that the impact and explosion resistance is poor. Its purpose is to provide a piezoelectric oscillator with excellent shock resistance.

[Means for solving intervening vertices]

The piezoelectric oscillator of the present invention has a configuration in which at least one layer of elastic agent is provided between the piezoelectric oscillator piece and the circuit board on which the air-chondrium element having the function of oscillating the piezoelectric oscillator piece is mounted. □ [Example] An example of the piezoelectric oscillator of the present invention is shown in FIG. 1(a), FIG. 1(b), and a crystal oscillator using a crystal oscillating piece. This will be explained with reference to FIG.

In this example, a conductor is constructed on a ceramic substrate 1 fixed on a stem 6 serving as a base. , a supporter is placed on a circuit board 6 which is constructed by fixing elements 2 such as transistors, resistors, capacitors, etc. to patterns 8 by soldering or the like.
as an elastic agent with electrical conductivity (hereinafter referred to as flexible 4C)
1, Adhesion Th1l) 7'! i1'' and make this flexible conductor into a semi-hardened state without completely curing the adhesive.Furthermore, on top of the flexible guide adhesive 7 which is in the semi-hardened state, another layer of the same flexible adhesive as above is applied. Apply a magnetically conductive adhesive 4'!r7 to establish electrical continuity. Place the entire crystal oscillator piece 5 on top of this and allow it to harden completely. As shown in Figure 2, between the crystal oscillator piece 5 and the circuit board 3, A flexible conductive adhesive 7 that hardens to become a rubber-like elastic material is provided.
It is constructed. Here, the semi-hardened flexible 41
1 The reason for providing the adhesive 1i1 is to reliably create a rubber-like elastic body without impairing conductivity.If you place the crystal oscillator directly on a low-viscosity adhesive, the adhesive This is because the crystal oscillation piece spreads laterally, the gap between the crystal oscillation piece and the circuit board becomes extremely small, and the elasticity 1i1 is almost completely lost, making it impossible to exhibit a sufficient effect.

Here, a flexible conductive adhesive is used as the elastic material, but it does not have to be conductive.As shown in FIG. The effect is the same even if the conductive material 24 is fixed to the outer periphery of the agent 27 to establish conduction. Also, as shown in FIG. 4, a cylindrical support bottle 7 made of gold 14 or a plate-like support (not shown) etc., it is convenient to use an elastic material such as a flexible conductive adhesive between the ceramic substrate 11 and the support bin 17, or between the support bin 17 and the crystal oscillation piece 15. However, it has the same effect. Also, as shown in Fig. 5, the support bin 67
Even if the ice crystal oscillation piece 65 is inserted into the slit, the same effect can be obtained if the gap is filled and fixed with the elastic material of the flexible 4-electromagnetic agent 454.

The drop test results of the crystal oscillator according to the first embodiment of the present invention and the crystal oscillator according to the conventional row configuration are shown in the sixth column. In Figure 46, the vertical axis shows the crack occurrence rate (regrettably), and the horizontal axis shows the fall height (crn).
). According to the book (Zo 1, the conventional crystal '@
In contrast to camera A, cracks occur from about 25 cyy+.
The crystal oscillator B according to the present invention cracks from about 75α, and the crystal oscillator with the structure of the present invention can withstand the impact when dropped from about 6 times the height compared to the conventional example.

Further, although this example has been explained using a crystal oscillator using a crystal oscillation piece, other piezoelectric oscillation pieces such as tantalum-plated lithium, ceramic, etc. have the same effect.

[Effects of the Invention] According to the piezoelectric oscillator having the configuration of the present invention described above, the buffer layer made of an elastic material provided between the piezoelectric oscillation piece and the circuit board absorbs shock and vibration gIh, so that the piezoelectric oscillator Even if a shock or vibration is applied due to a fall, etc., it is not directly transmitted to the piezoelectric oscillating piece, making it difficult for the piezoelectric oscillating piece to crack.

[Brief explanation of drawings]

1(a), 1(b), and 2 show embodiments of the piezoelectric oscillator of the present invention.
)) is a front view, and Figure 2 is an enlarged view of the contact layer. 1...Ceramic board 2...Elements 5...Circuit board 4...Flexible conductive adhesive 5...Crystal oscillator piece 6...Stem 7...Semi-rigid flexible conductive material Adhesive Figures 5, 4, and 5 are the pressure of the present invention! FIG. 6 is an enlarged front view of the oscillator. Figure 6I shows the effect of the piezoelectric oscillator of the present invention (the fir axis shows the cracking rate of the crystal oscillator piece, and the horizontal axis shows the falling height). ! 7 (Member J is a front cross-sectional view of a conventional pressure α oscillator.

Claims (1)

[Claims] A piezoelectric oscillator in which a circuit board forming an oscillation circuit having a function of oscillating a piezoelectric oscillator piece is fixed to a base stem, and a piezoelectric oscillator piece is fixed on the substrate with electrical continuity. A piezoelectric oscillator according to the above, further comprising a supporter having at least one layer of elastic material between the piezoelectric oscillation piece and the circuit board.