JPS62203748A - Machining method for magnetic disc substrate - Google Patents
Machining method for magnetic disc substrateInfo
- Publication number
- JPS62203748A JPS62203748A JP4665786A JP4665786A JPS62203748A JP S62203748 A JPS62203748 A JP S62203748A JP 4665786 A JP4665786 A JP 4665786A JP 4665786 A JP4665786 A JP 4665786A JP S62203748 A JPS62203748 A JP S62203748A
- Authority
- JP
- Japan
- Prior art keywords
- substrate surface
- substrate
- fine
- magnetic disk
- modulus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000003754 machining Methods 0.000 title abstract description 10
- 238000005498 polishing Methods 0.000 claims description 18
- 230000000694 effects Effects 0.000 abstract description 3
- 238000001179 sorption measurement Methods 0.000 abstract description 3
- 230000003247 decreasing effect Effects 0.000 abstract 2
- 239000010408 film Substances 0.000 description 12
- 239000006061 abrasive grain Substances 0.000 description 7
- 239000010419 fine particle Substances 0.000 description 5
- 229910000838 Al alloy Inorganic materials 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000003672 processing method Methods 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 241000218220 Ulmaceae Species 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分封〕
本発明は磁気ディスク基板の加工方法に関し、特に磁気
ディスク等の高密度磁気ディスク基板(例えば、メッキ
またはスバ、り法による薄膜媒体磁気ディスク用基板)
を加工する場合に用いられ、潤滑性がすぐれ、かつ記録
エラーの少ない磁気ディスク基板の加工方法に関する0
〔従来の技術〕
一般に、磁性薄膜を用いる磁気ディスク媒体は装置の起
動・停止時に生ずる磁気へ、ドとの接触走行に耐えるた
めの耐へ、ドクラ、シ、性を具える必賛がある。このた
め、磁気ディスク基板面上に形成された磁性薄膜の上に
5i01膜を保@膜として設けたシ、潤滑性能を向上さ
せるために保融膜表面に液体または固体の潤滑剤を塗布
することなどがなされてきた。[Detailed Description of the Invention] [Industrial Application Separation] The present invention relates to a method for processing a magnetic disk substrate, and particularly to a method for processing a magnetic disk substrate such as a high-density magnetic disk substrate (for example, a method for processing a thin film medium magnetic disk by plating or sputtering method). substrate)
[Prior art] In general, magnetic disk media using magnetic thin films are sensitive to the magnetism generated when starting and stopping devices. In order to withstand contact with the vehicle, it is necessary to have the characteristics of the vehicle, the vehicle, and the vehicle. For this reason, a 5i01 film is provided as a retaining film on the magnetic thin film formed on the magnetic disk substrate surface, and a liquid or solid lubricant is applied to the surface of the retaining film to improve the lubrication performance. etc. have been done.
この磁気ディスク基板としては、記録媒体の楡類に対応
してアルミニウム合金面またはアルミニウム合金面上に
形成された金属メ、キー、あるいはアルミニウム合金面
上に形成された陽極酸化面を所要精1fK加工されたも
のが使用されている。For this magnetic disk substrate, an aluminum alloy surface, a metal key formed on an aluminum alloy surface, or an anodized surface formed on an aluminum alloy surface is processed with the required precision of 1fK, corresponding to the elms of the recording medium. is used.
磁気ディスク面の表面粗さを非常に小さく(50X)仕
上げた場合、磁気ディスク面に磁気へ、ドが吸着する。If the surface roughness of the magnetic disk surface is finished to be very small (50X), the magnetic field will be attracted to the surface of the magnetic disk.
この解決策として、本発明者らKよって、磁気ディスク
基板の加工方法が提案された(特許59−150582
)。As a solution to this problem, the inventors K proposed a method for processing magnetic disk substrates (Patent No. 59-150582
).
すなわち、この加工方法は回転する磁気ディスり基板面
と弾性体に保持されたラッピングフィルムとを加工接触
させ、該磁気ディスク基板面に微細な凹凸を形成するこ
とを特徴とするもので、同心円状の深さ150Xの微細
な凹凸を磁気ディスク基板面に形成した場合、磁気へ、
ドの吸着を防止できる。しかし、この方法においては基
板面に磁性薄膜を形成後の記録エラーが多いという問題
があることがわかった。That is, this processing method is characterized by bringing the surface of a rotating magnetic disk substrate into processing contact with a wrapping film held by an elastic body to form fine irregularities on the surface of the magnetic disk substrate. When fine irregularities with a depth of 150X are formed on the surface of the magnetic disk substrate, the magnetic
This prevents adsorption of the card. However, it has been found that this method has a problem in that there are many recording errors after the magnetic thin film is formed on the substrate surface.
上述した磁気ディスク基板の加工方法においては磁気デ
ィスク基板面に!細な凹凸を形成した場合、ラッピング
フィルムの砥粒による微小切削の加工屑が基板面に残り
、記録エラーの原因となっていることが考えられた。こ
の基板の加工方法では加工屑の大部分は磁気ディスク基
板の回転による遠心力によって排出されるが、磁気ディ
スク基板面に強く付着した加工屑は排出されずに残って
しまう。In the above-mentioned method of processing a magnetic disk substrate, the surface of the magnetic disk substrate is processed! When fine irregularities were formed, it was thought that fine cutting debris from the abrasive grains of the lapping film remained on the substrate surface, causing recording errors. In this substrate processing method, most of the processing debris is discharged by the centrifugal force caused by the rotation of the magnetic disk substrate, but processing debris that is strongly attached to the surface of the magnetic disk substrate remains without being discharged.
本発明の目的は、従来の磁気ディスク基板の加工方法に
よる問題点を解決し、潤滑性がすぐれ、がつ記録エラー
を大幅に少くした磁気ディスク基板加工力法を提供する
ことにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a magnetic disk substrate machining method that solves the problems caused by conventional magnetic disk substrate machining methods, has excellent lubricity, and significantly reduces recording errors.
本発明の方法によれば、磁気ディスク基板面にラッピン
グフィルムを用いて微細な凹凸を形成後、ヤング率がl
X102g/關2 以下の研磨工具を用いて該基板を研
磨することを特徴とする磁気ディスク基板の加工方法が
得られる◇
〔実施例〕
以下、本発明の実施例について図面を鉾照して説明する
。According to the method of the present invention, after forming fine irregularities on the surface of a magnetic disk substrate using a lapping film, the Young's modulus becomes l.
A method for processing a magnetic disk substrate is obtained, which is characterized by polishing the substrate using the following polishing tool ◇ [Example] Examples of the present invention will be described below with reference to the drawings. do.
第1図は本発明の一実施例により得られた結果を示す。FIG. 1 shows the results obtained according to one embodiment of the invention.
本実施例に用いる磁気ディスク基板はアルミニウム合金
板にN1−Pメ、キを施したものを用いた。この磁気デ
ィスク基板は高速回転(1000rpm)せしめ、この
回転する基板面にラッピングフィルム(ダイヤモンド砥
粒3μm)を加工接触(圧力5g/cIrL) させ
、その基板面に微細凹凸(深さ200X)を形成する。The magnetic disk substrate used in this example was an aluminum alloy plate with N1-P holes and holes applied thereto. This magnetic disk substrate was rotated at high speed (1000 rpm), and a lapping film (diamond abrasive grains 3 μm) was brought into contact (pressure 5 g/cIrL) with the rotating substrate surface to form fine irregularities (depth 200×) on the substrate surface. do.
次に微細凹凸を形成した磁気ディスク基板はヤング率E
の異なる3楕類の研磨工具(Es = 5 X ] O
gA′IIL2. E鵞=I X 102g/CR2
,BH= I X 103g/儂2)を用いてそれぞれ
研磨する0研磨する条件は加工圧力106 g/an2
.相対速度IQm/mil、加工時間1m1nとし、研
磨遊離砥粒は二酸化ケイ素の微粒子(0,01μm)を
用いた0
このようにして研磨した結果は第1図に示すように3種
の研磨工具のいずれについても基板面の加工屑は除去さ
れ、記録エラーが大幅(約1/10 )K減少した。し
かし、ヤング率の大きい研磨工具(E、=I XI 0
3g/c!IL2)でう、ピングフィルムにより微細凹
凸を形成した基板を研磨した場合は微細凹凸までが除去
されてしまい、磁気ヘッドがディスク面に吸着する欠点
がある。これに対し、−?7グ率の小さい研磨工具(E
t = 5 X 10 g/cIIL−E雪=1×1
02g/cTIL2)を用いた’a 合’tt Do
1屑のみを除去し、微細凹凸はほぼ残り、磁気へ。Next, the magnetic disk substrate on which fine irregularities are formed has a Young's modulus of E
Three elliptical polishing tools with different values (Es = 5 x ] O
gA′IIL2. E go = I X 102g/CR2
, BH = I
.. The relative speed was IQm/mil, the machining time was 1m1n, and the free abrasive grains used were silicon dioxide fine particles (0.01μm).The results of polishing in this way were as shown in Figure 1. In both cases, processing debris on the substrate surface was removed, and recording errors were significantly reduced (by about 1/10). However, a polishing tool with a large Young's modulus (E, = I XI 0
3g/c! In IL2), when a substrate on which fine irregularities have been formed using a pin film is polished, even the fine irregularities are removed, and there is a drawback that the magnetic head is attracted to the disk surface. On the other hand, -? 7 Polishing tool with small grating rate (E
t = 5 x 10 g/cIIL-E snow = 1 x 1
02g/cTIL2)
Only one piece of debris is removed, and most of the fine irregularities remain, making them magnetic.
ドの吸着を防止できた。It was possible to prevent the adsorption of
このように本実施例においてはラッピングフィルムで磁
気ディスク基板面に微細な凹凸を形成後に1基板全面を
研磨する仁とにより形成した微細凹凸を残しつつ、基板
面に強く付着した加工屑を除去するものである。研磨工
具と基板面との間に介在する微小遊離砥粒が研磨工具の
回転によシ相対運動し、基板面を研磨して付着した加工
屑を除去できる。In this example, after forming fine irregularities on the surface of a magnetic disk substrate using a wrapping film, the entire surface of one substrate is polished to remove processed debris strongly adhered to the substrate surface while leaving the fine irregularities formed. It is something. Microscopic free abrasive grains interposed between the polishing tool and the substrate surface are moved relative to each other by the rotation of the polishing tool, and the substrate surface can be polished to remove attached machining debris.
この場合、ヤング率の大きい研磨工具を用いて研磨する
と、加工屑とともにう、ピングフィルムで付与した基板
面の微細凹凸までも除去してしまうが、ヤング率の小さ
い研磨工具を用いて研磨する場合は、基板面の微細凹凸
を残して加工屑のみを除去できる。これは、ヤング率の
小さい研磨工具の場合は研磨工具が基板面の微細凹凸に
倣いながら研磨するためと考えられる◇よって、磁気デ
ィスク基板面に強く付着した加工屑が記録工2−の要因
となる問題点を解決できる。In this case, if a polishing tool with a high Young's modulus is used for polishing, the fine irregularities on the substrate surface imparted by the ping film will be removed along with the processing debris, but if polishing is performed using a polishing tool with a low Young's modulus. can remove only the processing debris, leaving only fine irregularities on the substrate surface. This is thought to be because when using a polishing tool with a small Young's modulus, the polishing tool follows the minute irregularities on the substrate surface while polishing. Therefore, processing debris strongly attached to the magnetic disk substrate surface is the cause of the recording process 2-. can solve problems.
なお、本発明の一実施例においては、ダイヤモンド砥粒
の2.ピンクフィルムを用いたが、酸化アルミニウム砥
粒、炭化ケイ素砥粒のラッピングフィルムを用いても良
い。基板の研磨に研磨遊離砥粒として二酸化ケイ素の微
粒子(0,01μm)を用いたが、酸化アルミニウムの
微粒子、炭化ケイ素の微粒子、ダイヤモンド微粒子を用
いても良い0
〔発明の効果〕
以上、述べたように、本発明の加工方法は記録エラーの
少ない、かつ磁気へ、ドが吸着しない潤滑性のすぐれた
効果が得られる。In addition, in one embodiment of the present invention, 2. Although a pink film was used, a lapping film of aluminum oxide abrasive grains or silicon carbide abrasive grains may also be used. Although silicon dioxide fine particles (0.01 μm) were used as polishing free abrasive grains to polish the substrate, aluminum oxide fine particles, silicon carbide fine particles, and diamond fine particles may also be used. [Effects of the Invention] As described above. As can be seen, the processing method of the present invention has the effect of reducing recording errors and having excellent lubricity in that magnetic fields do not attract magnets.
Claims (1)
な凹凸を形成した後、ヤング率が1×10^2g/mm
^2以下の研磨工具を用いて、該磁気ディスク基板を研
磨することを特徴とする磁気ディスク基板の加工方法。After forming fine irregularities on the surface of the magnetic disk substrate using a wrapping film, the Young's modulus is 1 x 10^2 g/mm.
A method for processing a magnetic disk substrate, comprising polishing the magnetic disk substrate using a polishing tool of ^2 or less.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4665786A JPS62203748A (en) | 1986-03-03 | 1986-03-03 | Machining method for magnetic disc substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4665786A JPS62203748A (en) | 1986-03-03 | 1986-03-03 | Machining method for magnetic disc substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62203748A true JPS62203748A (en) | 1987-09-08 |
Family
ID=12753399
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4665786A Pending JPS62203748A (en) | 1986-03-03 | 1986-03-03 | Machining method for magnetic disc substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62203748A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03142158A (en) * | 1989-10-27 | 1991-06-17 | Sumitomo Special Metals Co Ltd | Surfacing method for magnetic disk board |
US5202810A (en) * | 1989-04-27 | 1993-04-13 | Hitachi, Ltd. | Magnetic disk having an improved surface configuration |
US5825591A (en) * | 1993-07-23 | 1998-10-20 | Hitachi, Ltd. | Frictionally sliding head magnet disk apparatus |
-
1986
- 1986-03-03 JP JP4665786A patent/JPS62203748A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5202810A (en) * | 1989-04-27 | 1993-04-13 | Hitachi, Ltd. | Magnetic disk having an improved surface configuration |
US5353182A (en) * | 1989-04-27 | 1994-10-04 | Hitachi, Ltd. | Magnetic disk unit having magnetic disks and a magnetic head with a head slider which is in contact with surfaces of the magnetic disk |
JPH03142158A (en) * | 1989-10-27 | 1991-06-17 | Sumitomo Special Metals Co Ltd | Surfacing method for magnetic disk board |
US5825591A (en) * | 1993-07-23 | 1998-10-20 | Hitachi, Ltd. | Frictionally sliding head magnet disk apparatus |
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