JPS62202504A - Manufacture of chip resistor - Google Patents
Manufacture of chip resistorInfo
- Publication number
- JPS62202504A JPS62202504A JP61044090A JP4409086A JPS62202504A JP S62202504 A JPS62202504 A JP S62202504A JP 61044090 A JP61044090 A JP 61044090A JP 4409086 A JP4409086 A JP 4409086A JP S62202504 A JPS62202504 A JP S62202504A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- insulating substrate
- rod
- resistive
- shaped insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000010409 thin film Substances 0.000 claims description 52
- 239000000758 substrate Substances 0.000 claims description 25
- 238000005516 engineering process Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 description 14
- 239000010408 film Substances 0.000 description 10
- 238000005530 etching Methods 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、プリント基板にチップ状電子部品として装着
するのに適したリードの無いチップ抵抗器の製造方法に
関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a method for manufacturing a leadless chip resistor suitable for mounting as a chip-shaped electronic component on a printed circuit board.
（従来の技術）
従来、チップ抵抗器としては、チップ状絶縁板上にスク
リーン印刷法で抵抗膜を設け、端部電極を八ｇ−Ｐｄの
塗布、焼き付けで設けた厚膜法によるのものが一般的で
あった。(Prior art) Conventionally, chip resistors have been manufactured using a thick film method, in which a resistive film is formed on a chip-shaped insulating plate by screen printing, and end electrodes are formed by coating and baking 8g-Pd. It was common.
（発明が解決しようとする問題点）
ところで、厚膜系のチップ抵抗器は、抵抗ペーストを印
刷、焼き付けるため抵抗膜の抵抗精度、温度特性や高周
波特性の信頼性に不満足な点がある。(Problems to be Solved by the Invention) By the way, thick-film chip resistors are unsatisfactory in the resistance accuracy, temperature characteristics, and high-frequency characteristics of the resistive film because the resistive paste is printed and baked.
この点を考慮して、チップ状絶縁板に、真空蒸着、スパ
ッタ、イオンブレーティング等の薄膜技術で抵抗薄膜を
形成することが本出願人により検討されているが、この
場合には端部電極となる部分の剥離強度やはんだ耐熱性
が問題となる。Taking this point into consideration, the applicant is considering forming a resistive thin film on a chip-shaped insulating plate using thin film techniques such as vacuum evaporation, sputtering, and ion blating. The peel strength and solder heat resistance of the parts that become the problem become problems.
（問題点を解決するための手段）
本発明は、上記の点に鑑み、薄膜技術で抵抗薄膜を形成
して、抵抗精度、温度特性や高周波特性を向上させると
ともに、絶縁板の端部をコ字状に囲むように抵抗薄膜を
当該絶縁板の裏面の一部にまで延長して、端部電極とな
る部分の付着強度及びはんだ耐熱性を増大させた、信頼
性の高いチップ抵抗器の製造方法を提供しようとするも
のである。(Means for Solving the Problems) In view of the above points, the present invention forms a resistive thin film using thin film technology to improve resistance accuracy, temperature characteristics, and high frequency characteristics, and to improve the resistance accuracy, temperature characteristics, and high frequency characteristics, and to Manufacture of a highly reliable chip resistor in which the resistive thin film is extended to a part of the back surface of the insulating plate so as to surround it in a letter shape, increasing the adhesion strength and soldering heat resistance of the part that becomes the end electrode. It is intended to provide a method.
本発明は、棒状絶縁板又は穴明き絶縁基板の棒状部分の
上面、両端面及び下面の一部に薄膜技術により連続する
抵抗薄膜を形成し、該抵抗薄膜上に薄膜技術により電極
薄膜を形成し、該電極薄膜及び抵抗薄膜をエツチング加
工して所定の電極薄膜パターン及び抵抗薄膜パターンと
した後、前記棒状絶縁板又は前記絶縁基板の棒状部分を
複数個に切断、分離する工程により上記従来技術の問題
、儂を解決している。The present invention involves forming a continuous resistive thin film by thin film technology on the upper surface, both end faces, and a part of the lower surface of a rod-shaped part of a rod-shaped insulating plate or a perforated insulating substrate, and forming an electrode thin film on the resistive thin film by thin film technology. After etching the electrode thin film and the resistive thin film to form a predetermined electrode thin film pattern and resistive thin film pattern, the above-mentioned prior art is performed by cutting and separating the rod-shaped insulating plate or the rod-shaped portion of the insulating substrate into a plurality of pieces. problem, I have solved it.
（作用）
本発明のチップ抵抗器の製造方法においては、抵抗体と
なる抵抗薄膜を、真空蒸着、スパッタ、イオンブレーテ
ィング等の薄膜技術により作成しており、Ｊ１７膜技術
による場合の抵抗ペーストのような不純物を含まず、マ
イクロ波回路、Ａ／Ｄ変換回路等の抵抗素子の抵抗精度
、温度特性や高周波特性が特に要求される分野での要望
に応えることができる。また、抵抗ｒｇ膜を絶縁板の裏
面の一部にまで延長することにより、端部電極となる部
分の付着強度及びはんだ耐熱性を充分満足させる強さと
することがでｂる。抵抗薄膜の加工は、エツチングによ
り所定の抵抗値となるように加工できる。(Function) In the method for manufacturing a chip resistor of the present invention, the resistive thin film serving as the resistor is created using thin film techniques such as vacuum evaporation, sputtering, and ion blasting. It does not contain such impurities, and can meet the demands in fields where resistance accuracy, temperature characteristics, and high frequency characteristics of resistance elements such as microwave circuits and A/D conversion circuits are particularly required. Furthermore, by extending the resistor RG film to a part of the back surface of the insulating plate, it is possible to obtain a strength that satisfies the adhesion strength and soldering heat resistance of the portion that will become the end electrode. The resistive thin film can be processed to a predetermined resistance value by etching.
（実施例）
以下、本発明に係るチップ抵抗器の製造方法の実施例を
図面に従って説明する。(Example) Hereinafter, an example of the method for manufacturing a chip resistor according to the present invention will be described with reference to the drawings.
まず、第１図のように、１枚のアルミナ等の幅広絶縁基
板を特定の形状のブレード１で多数の棒状の絶縁基板２
に切断、分離する。この場合、第２図の棒状絶縁基板２
の上面Ｕと両端面Ｓとの角部は、ブレード１の先端形状
により自動的に円く形成される。これは、後述のエツチ
ング工程においてレジストを塗布する際に、鋭利な角部
でレノストが切れてしまわないようにするためである。First, as shown in FIG.
Cut and separate. In this case, the rod-shaped insulating substrate 2 in FIG.
The corners between the upper surface U and both end surfaces S of the blade 1 are automatically formed into a circle depending on the shape of the tip of the blade 1. This is to prevent the resist from being cut by sharp corners when applying the resist in the etching process described later.
次に、第３図のように、棒状の絶縁基板２の上面Ｕを下
にし、下面りにマスク３を配置した状態で、Ｎｉ−Ｃｒ
系合金等をるつぼＬから蒸発させる等して、真空蒸着、
スパッタ、イオンブレーティング等の薄膜技術で高抵抗
金属や高抵抗合金からなる抵抗Ｔｉｉ膜４を成膜する。Next, as shown in FIG.
Vacuum deposition, such as by evaporating the system alloy etc. from the crucible L,
A resistive Tii film 4 made of a high-resistance metal or a high-resistance alloy is formed using a thin film technique such as sputtering or ion blating.
この際、マスク３の位置する部分以外に抵抗ｍ膜４が形
成されるから、第４図のように棒状絶縁基板２の上面Ｕ
１両端面Ｓ及び下面りの一部にまで連続する抵抗薄膜４
が形成される。すなわち、絶縁基板２の端部をコ字状に
囲むように抵抗薄膜４は絶縁基板２の裏面の一部にまで
延長して付着する。また、抵抗薄膜４の絶縁基板２への
付着力は、抵抗薄膜４の組成にも関係があり、Ｎｉ−Ｃ
ｒ系合金の場合、Ｃｒ（クロム）の含有割合が３０重量
％以上であることが好ましし１゜
それから、Ｗ！！膜技術で同様に第５図のように銅、銅
合金等の電極薄膜５を前記抵抗薄膜４上に形成する。At this time, since the resistor m film 4 is formed in areas other than the portion where the mask 3 is located, the upper surface U of the rod-shaped insulating substrate 2 is
1. A resistive thin film 4 that continues to both end surfaces S and a part of the bottom surface.
is formed. That is, the resistive thin film 4 is attached to extend to a part of the back surface of the insulating substrate 2 so as to surround the end of the insulating substrate 2 in a U-shape. Furthermore, the adhesion force of the resistive thin film 4 to the insulating substrate 2 is also related to the composition of the resistive thin film 4;
In the case of r-based alloys, it is preferable that the content of Cr (chromium) is 30% by weight or more. ! Similarly, as shown in FIG. 5, an electrode thin film 5 of copper, copper alloy, etc. is formed on the resistive thin film 4 using a film technique.
さらに、第６図のように平板１０上に抵抗薄膜４及び電
極薄膜５を形成した後の棒状絶縁基板２を載置し、レジ
スト１１を棒状絶縁基板２の両端部分に塗布し、エツチ
ングで銅、銅合金等の電極薄膜５の不要部分を除去しで
ｆ：ｔＳ７図のように電極薄膜５を棒状絶縁基板２の両
端面及びその近傍の前記抵抗薄膜上に残す。Furthermore, as shown in FIG. 6, the rod-shaped insulating substrate 2 on which the resistive thin film 4 and the electrode thin film 5 have been formed is placed on the flat plate 10, a resist 11 is applied to both ends of the rod-shaped insulating substrate 2, and copper is removed by etching. , unnecessary portions of the electrode thin film 5 made of copper alloy or the like are removed, leaving the electrode thin film 5 on both end surfaces of the rod-shaped insulating substrate 2 and the resistive thin film in the vicinity thereof, as shown in Figure f:tS7.
その次のエツチング工程で抵抗薄膜４の方もエツチング
して所定の抵抗値のパターンとしてｆ５８図のように所
定のパターンの抵抗薄膜４を多数設けた棒状の絶縁基板
２を得る。In the next etching step, the resistive thin film 4 is also etched to obtain a rod-shaped insulating substrate 2 having a predetermined pattern of resistive thin films 4 as shown in FIG.
さらに、第８図の１点ｍｉｘの通りに棒状の絶縁基板２
を個々のチップ状絶縁板に切断、分離し、第９図のごと
くチップ状絶縁板２Ａの上面、両端面及び下面の一部に
薄膜技術による連続する抵抗薄膜４を有し、チップ状絶
縁板２Ａの両端面及びその近傍の前記抵抗薄膜上に薄膜
技術による電極Ｗ１．膜５を形成してなるチップ抵抗器
が得られる。Furthermore, as shown in the one-point mix in Fig. 8, a rod-shaped insulating substrate 2
The chip-shaped insulating plate 2A is cut and separated into individual chip-shaped insulating plates, and as shown in FIG. Electrodes W1.2A are formed by thin film technology on both end faces of W1.2A and on the resistive thin film in the vicinity thereof. A chip resistor formed by forming the film 5 is obtained.
通常、抵抗薄膜４の保護のために、樹脂又はガラス被膜
６をさらに設ける。Usually, a resin or glass coating 6 is further provided to protect the resistive thin film 4.
なお、棒状絶縁基板２の代わりに、第１０図のようにス
リット状の穴部２１を有するアルミナ等の穴明き絶縁基
板２０を用い、穴部２１にはさまれた棒状部分２２に第
３図乃至７１３８図の工程と同様の処理を行い、その後
棒状部分を切断、分離して第９図のチップ抵抗器を得る
ようにしてもよい。Note that instead of the rod-shaped insulating substrate 2, a perforated insulating substrate 20 made of alumina or the like having a slit-shaped hole 21 is used as shown in FIG. The chip resistor shown in FIG. 9 may be obtained by performing the same process as in the steps shown in FIGS. 71-38, and then cutting and separating the rod-shaped portion.
（発明の効果）
以上説明したように、本発明のチップ抵抗器の製造方法
によれば、以下のような効果を得ることができる。(Effects of the Invention) As explained above, according to the method for manufacturing a chip resistor of the present invention, the following effects can be obtained.
（１）抵抗薄膜は、薄膜技術で成膜されるため、高精度
の抵抗値が得られ、また温度特性、高周波特性も良好で
ある。従って、マイクロ波通信機器、計測機器、ビデオ
機器、ＯＡ機器等の回路素子として好適に利用できる。(1) Since the resistive thin film is formed using thin film technology, a highly accurate resistance value can be obtained, and the temperature characteristics and high frequency characteristics are also good. Therefore, it can be suitably used as a circuit element for microwave communication equipment, measuring equipment, video equipment, OA equipment, etc.
（２）抵抗薄膜がチップ状絶縁板の裏面にも回り込んで
付着しているので、付着力が大きく、チップ抵抗器端部
の端部電極となる部分の剥離強度やはんだ耐熱性を大き
くできる。また、端部電極となる部分も金属薄膜で形成
するので、外形寸法の精度を良（することができ、自動
装着の場合に有利である。(2) Since the resistive thin film wraps around and adheres to the back side of the chip-shaped insulating plate, the adhesion is strong and the peel strength and soldering heat resistance of the end electrode of the chip resistor can be increased. . In addition, since the portion that becomes the end electrode is also formed of a metal thin film, the accuracy of the external dimensions can be improved, which is advantageous in the case of automatic attachment.
（３）量産性に優れた製造工程であり、低コストである
。(3) The manufacturing process has excellent mass productivity and is low cost.
第１図は本発明に係るチップ抵抗器の実施例であって棒
状の絶縁基板を製造する工程を示す断面図、第２図は棒
状の絶縁基板の斜視図、第３図は棒状の絶縁基板に抵抗
薄膜を形成する工程の説明図、第４図は抵抗薄膜形成後
の正面図、第５図は電極Ｗｊ膜膜形後後正面図、ｆｊＩ
Ｊ６図は電極薄膜上にレノストを塗布した状態の正面図
、第７図は電極薄膜のエツチング処理後の正面図、第８
図は棒状の絶縁基板を切断分離する工程を示す斜視図、
第９図は本発明の実施例によるチップ抵抗器を示す正面
図、第１０図は棒状の絶縁基板の代わりに使用できる穴
明き絶縁基板を示す斜視図である。
１・・・ブレード、２・・・棒状の絶縁基板、２Ａ・・
・チップ状絶縁板、３・・・マスク、４・・・抵抗薄膜
、５・・・電極薄膜、２０・・・穴明き絶縁基板。Fig. 1 is an embodiment of the chip resistor according to the present invention, and is a sectional view showing the process of manufacturing a rod-shaped insulating substrate, Fig. 2 is a perspective view of the rod-shaped insulating substrate, and Fig. 3 is a rod-shaped insulating substrate. 4 is a front view after forming a resistive thin film, and FIG. 5 is a rear front view of the electrode Wj film shape, fjI
Figure J6 is a front view of the state in which lenost is applied on the electrode thin film, Figure 7 is a front view of the electrode thin film after etching treatment, and Figure 8
The figure is a perspective view showing the process of cutting and separating a rod-shaped insulating substrate.
FIG. 9 is a front view showing a chip resistor according to an embodiment of the present invention, and FIG. 10 is a perspective view showing a perforated insulating substrate that can be used in place of a rod-shaped insulating substrate. 1...Blade, 2...Bar-shaped insulating board, 2A...
- Chip-shaped insulating plate, 3... Mask, 4... Resistance thin film, 5... Electrode thin film, 20... Perforated insulating substrate.
Claims (1)
面、両端面及び下面の一部に薄膜技術により連続する抵
抗薄膜を形成し、該抵抗薄膜上に薄膜技術により電極薄
膜を形成し、該電極薄膜及び抵抗薄膜をエッチング加工
して所定の電極薄膜パターン及び抵抗薄膜パターンとし
た後、前記棒状絶縁基板又は前記絶縁基板の棒状部分を
複数個に切断、分離することを特徴とするチップ抵抗器
の製造方法。(1) A continuous resistive thin film is formed by thin film technology on the top surface, both end faces, and part of the bottom surface of the rod-shaped part of a rod-shaped insulating substrate or a perforated insulating substrate, and an electrode thin film is formed by thin film technology on the resistive thin film. , a chip characterized in that the electrode thin film and the resistive thin film are etched to form a predetermined electrode thin film pattern and resistive thin film pattern, and then the rod-shaped insulating substrate or the rod-shaped portion of the insulating substrate is cut and separated into a plurality of pieces. Method of manufacturing resistors.
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61044090A JPS62202504A (en) | 1986-03-03 | 1986-03-03 | Manufacture of chip resistor |
| US07/015,282 US4792781A (en) | 1986-02-21 | 1987-02-17 | Chip-type resistor |
| DE3705279A DE3705279C2 (en) | 1986-02-21 | 1987-02-19 | Process for manufacturing resistors in chip form |
| FR878702279A FR2595000B1 (en) | 1986-02-21 | 1987-02-20 | CHIP TYPE RESISTANCE AND MANUFACTURING METHOD THEREOF |
| CA000530229A CA1272769A (en) | 1986-02-21 | 1987-02-20 | Chip-type resistor |
| KR1019870001452A KR910000969B1 (en) | 1986-02-21 | 1987-02-20 | Chip-type resistor |
| GB08704141A GB2187598B (en) | 1986-02-21 | 1987-02-23 | Chip-type resistor |
| SG926/91A SG92691G (en) | 1986-02-21 | 1991-11-02 | Chip-type resistor |
| HK1064/91A HK106491A (en) | 1986-02-21 | 1991-12-23 | Chip-type resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61044090A JPS62202504A (en) | 1986-03-03 | 1986-03-03 | Manufacture of chip resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62202504A true JPS62202504A (en) | 1987-09-07 |
Family
ID=12681921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61044090A Pending JPS62202504A (en) | 1986-02-21 | 1986-03-03 | Manufacture of chip resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62202504A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009133420A (en) * | 2007-11-30 | 2009-06-18 | Ckd Corp | Actuator with rod |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5391366A (en) * | 1977-01-21 | 1978-08-11 | Nippon Electric Co | Method of manufacturing chip resistor |
| JPS5449558A (en) * | 1977-09-26 | 1979-04-18 | Mitsubishi Electric Corp | Chip tyre resistance body and method of fablicating same |
| JPS59143303A (en) * | 1983-02-03 | 1984-08-16 | 株式会社村田製作所 | Method of producing chip-shaped electronic part |
| JPS62195101A (en) * | 1986-02-21 | 1987-08-27 | ティーディーケイ株式会社 | Chip resistor |
-
1986
- 1986-03-03 JP JP61044090A patent/JPS62202504A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5391366A (en) * | 1977-01-21 | 1978-08-11 | Nippon Electric Co | Method of manufacturing chip resistor |
| JPS5449558A (en) * | 1977-09-26 | 1979-04-18 | Mitsubishi Electric Corp | Chip tyre resistance body and method of fablicating same |
| JPS59143303A (en) * | 1983-02-03 | 1984-08-16 | 株式会社村田製作所 | Method of producing chip-shaped electronic part |
| JPS62195101A (en) * | 1986-02-21 | 1987-08-27 | ティーディーケイ株式会社 | Chip resistor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009133420A (en) * | 2007-11-30 | 2009-06-18 | Ckd Corp | Actuator with rod |
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