JPS62199974U - - Google Patents
Info
- Publication number
- JPS62199974U JPS62199974U JP8809486U JP8809486U JPS62199974U JP S62199974 U JPS62199974 U JP S62199974U JP 8809486 U JP8809486 U JP 8809486U JP 8809486 U JP8809486 U JP 8809486U JP S62199974 U JPS62199974 U JP S62199974U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- predetermined portion
- conductive material
- conductive
- permeated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
- 239000012466 permeate Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第1図は本考案の一実施例の断面図、第2図は
本考案の印刷配線板の作製方法を示すフローチヤ
ート、第3図は従来例の断面図である。
2……基板、6,7……絶縁性レジスト、20
,21……配線パターン。
FIG. 1 is a sectional view of an embodiment of the present invention, FIG. 2 is a flowchart showing a method of manufacturing a printed wiring board of the present invention, and FIG. 3 is a sectional view of a conventional example. 2... Substrate, 6, 7... Insulating resist, 20
, 21... Wiring pattern.
Claims (1)
なくとも一方の側に、所定箇所を除いて絶縁性レ
ジストを設け、上記導電材料を上記所定箇所から
基板内に浸透させて、上記基板の両側に設けられ
る配線パターンを導通させる導通部を形成したこ
とを特徴とする印刷配線板。 An insulating resist is provided on at least one side of a substrate made of a material into which the conductive material can permeate, except for a predetermined portion, and the conductive material is permeated into the substrate from the predetermined portion and provided on both sides of the substrate. What is claimed is: 1. A printed wiring board characterized in that a conductive portion is formed to conduct a wiring pattern.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8809486U JPS62199974U (en) | 1986-06-09 | 1986-06-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8809486U JPS62199974U (en) | 1986-06-09 | 1986-06-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62199974U true JPS62199974U (en) | 1987-12-19 |
Family
ID=30945897
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8809486U Pending JPS62199974U (en) | 1986-06-09 | 1986-06-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62199974U (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS618597A (en) * | 1984-06-21 | 1986-01-16 | Sumitomo Chem Co Ltd | Hollow planar body for heat accumulating panel and manufacture thereof |
JPS6260288A (en) * | 1985-09-10 | 1987-03-16 | カシオ計算機株式会社 | Circuit board having through hole |
-
1986
- 1986-06-09 JP JP8809486U patent/JPS62199974U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS618597A (en) * | 1984-06-21 | 1986-01-16 | Sumitomo Chem Co Ltd | Hollow planar body for heat accumulating panel and manufacture thereof |
JPS6260288A (en) * | 1985-09-10 | 1987-03-16 | カシオ計算機株式会社 | Circuit board having through hole |