JPS62198262U - - Google Patents
Info
- Publication number
- JPS62198262U JPS62198262U JP1986088403U JP8840386U JPS62198262U JP S62198262 U JPS62198262 U JP S62198262U JP 1986088403 U JP1986088403 U JP 1986088403U JP 8840386 U JP8840386 U JP 8840386U JP S62198262 U JPS62198262 U JP S62198262U
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- laser beam
- spherical cavity
- optical device
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000003754 machining Methods 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 7
- 239000000498 cooling water Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
Description
第１図は本考案によるレーザ加工用光学装置の
原理を説明するための模式図、第２図は集光され
たレーザビームのデフオーカス特性に関する測定
結果の説明図、第３図は球面状キヤビテイ内面の
曲率半径の設定に関する説明図、第４図は本考案
を一態様で実施するレーザ加工用光学装置の一例
を示す構成図、第５図は従来の半球状キヤビテイ
を用いた際のレーザビーム多重反射挙動に関する
説明図、第６ａ図および第６ｂ図は本考案による
球面状キヤビテイを用いた際のレーザビーム多重
反射挙動についての説明図、第７ａ図、第７ｂ図
および第７ｃ図は、それぞれ、レンズのデフオー
カスのみでキヤビテイを用いない場合、従来の半
球状キヤビテイを用いた場合および本考案の球面
状キヤビテイを用いた場合によるレーザ焼入れ加
工の結果を説明する被加工材の断面をそれぞれに
示す説明図である。第８図は従来の半球状キヤビ
テイを用いた多重反射光学系の構成図である。
１，１′……レーザビーム、２……加工ヘツド
、３……レンズ、４……球面状キヤビテイ、５…
…レーザビーム通過孔、６……被加工物、７……
マイクロメータ、８……スライド管、９……ガス
供給口、１０……スパツタ除去ノズル、１１……
アシストガスノズル、１２……冷却水供給・排出
口、１３……半球状キヤビテイ。
Fig. 1 is a schematic diagram for explaining the principle of the optical device for laser processing according to the present invention, Fig. 2 is an explanatory diagram of the measurement results regarding the defocus characteristics of the focused laser beam, and Fig. 3 is the inner surface of the spherical cavity. 4 is a configuration diagram showing an example of an optical device for laser processing that implements the present invention in one embodiment, and FIG. 5 is a diagram showing the configuration of a laser beam multiplexing when using a conventional hemispherical cavity. FIGS. 6a and 6b are explanatory diagrams of the multiple reflection behavior of a laser beam when using the spherical cavity according to the present invention, and FIGS. 7a, 7b, and 7c are, respectively, Explanation showing the cross-section of the workpiece to explain the results of laser hardening when using only the lens defocus and no cavity, when using the conventional hemispherical cavity, and when using the spherical cavity of the present invention. It is a diagram. FIG. 8 is a block diagram of a conventional multiple reflection optical system using a hemispherical cavity. 1, 1'... Laser beam, 2... Processing head, 3... Lens, 4... Spherical cavity, 5...
...Laser beam passage hole, 6...Workpiece, 7...
Micrometer, 8...Slide tube, 9...Gas supply port, 10...Spatter removal nozzle, 11...
Assist gas nozzle, 12... Cooling water supply/discharge port, 13... Hemispherical cavity.
Claims (1)
ーザビームの光軸上に集光されたレーザビームが
通過するビーム通過孔を設けた球面状キヤビテイ
を配置し、集光されたレーザビームが被加工物の
表面と前記球面状キヤビテイの間を多重反射して
被加工物を照射し、加熱または溶融により加工を
行うレーザ加工用光学装置において、ビーム通過
孔下面から被加工物までの距離をｄとし、被加工
物上での加工幅をｗとするとき、前記球面状キヤ
ビテイの曲率半径ｒおよび有効直径Ｒの範囲を、 １．４ｄ≦ｒ≦２．６ｄおよびＲ≧２ｗ としたことを特徴とするレーザ加工用光学装置。[Claim for Utility Model Registration] A spherical cavity provided with a beam passage hole through which a laser beam focused on the optical axis of the laser beam passes is arranged between the laser beam generator and the workpiece, In an optical device for laser processing, a focused laser beam multiple-reflects between the surface of the workpiece and the spherical cavity, irradiates the workpiece, and processes the workpiece by heating or melting. When the distance to the workpiece is d and the machining width on the workpiece is w, the range of the radius of curvature r and effective diameter R of the spherical cavity is 1.4d≦r≦2.6d and An optical device for laser processing, characterized in that R≧2w.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986088403U JPS62198262U (en) | 1986-06-10 | 1986-06-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986088403U JPS62198262U (en) | 1986-06-10 | 1986-06-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62198262U true JPS62198262U (en) | 1987-12-17 |
Family
ID=30946481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986088403U Pending JPS62198262U (en) | 1986-06-10 | 1986-06-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62198262U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002059284A (en) * | 2000-05-31 | 2002-02-26 | Sumitomo Heavy Ind Ltd | Device and method for laser beam machining |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60218421A (en) * | 1984-04-13 | 1985-11-01 | Nippon Steel Corp | Heat treatment of steel by laser |
-
1986
- 1986-06-10 JP JP1986088403U patent/JPS62198262U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60218421A (en) * | 1984-04-13 | 1985-11-01 | Nippon Steel Corp | Heat treatment of steel by laser |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002059284A (en) * | 2000-05-31 | 2002-02-26 | Sumitomo Heavy Ind Ltd | Device and method for laser beam machining |
| JP4589546B2 (en) * | 2000-05-31 | 2010-12-01 | 住友重機械工業株式会社 | Laser processing apparatus and processing method |
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