JPS597491A - Laser working device - Google Patents

Laser working device

Info

Publication number
JPS597491A
JPS597491A JP57116168A JP11616882A JPS597491A JP S597491 A JPS597491 A JP S597491A JP 57116168 A JP57116168 A JP 57116168A JP 11616882 A JP11616882 A JP 11616882A JP S597491 A JPS597491 A JP S597491A
Authority
JP
Japan
Prior art keywords
cutting
laser
optical fibers
welding
pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57116168A
Other languages
Japanese (ja)
Inventor
Osami Ichiko
市古 修身
Hiroshi Soga
曾我 弘
Naoya Hamada
直也 浜田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Priority to JP57116168A priority Critical patent/JPS597491A/en
Publication of JPS597491A publication Critical patent/JPS597491A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/04Tubular or hollow articles
    • B23K2101/06Tubes

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To make laser working of a metallic material easy in the stage of working such as welding, cutting, punching or the like by laser light, by using flexible photoconductive paths utilizing plural optical fibers. CONSTITUTION:The laser beam from a laser oscillator 1 is bisected to upper and lower beams by a beam splitter 6 consisting of a metallic mirror or the like, and the split beams are reflected by half mirrors 4, 5; 4', 5' whereby a metallic material 9, i.e., a pipe or the like to be worked, is subjected to working such as cutting, welding or the like. The laser light is passed through flexible photoconductor paths 2, 2' consisting of plural optical fibers and is condensed at the condensing parts 3, 3' of the material 9 to work said material. Since the laser light of a large output is condensed freely to the parts to be worked by using the flexible optical fibers, various workings such as welding, cutting, drilling or the like are easily made possible.

Description

【発明の詳細な説明】 本発明はレーザを用いて、材料の周囲に沿って溶接、切
断、穴あけ等の加工′ff:施すにあたり、通常行なわ
れている材料を回転しての加工が困難又は不利な場合に
、有効なレーザ加工装置に関するものであり、レーザ加
工ヘッドを材料の周囲に沿って移動可能としたレーザ加
工装置を提供するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention uses a laser to perform processing such as welding, cutting, and drilling along the periphery of a material. The present invention relates to an effective laser machining device in which the laser machining head can be moved around the circumference of the material.

例えば長尺の金属パイプの中央部奮レーザを用いて切断
する場合、パイプが長尺なために、一定速度で位置振れ
なく回転させることは難しく、このような回転ができる
回転装置は相当大がかジなものとなり、パイプを回転し
ての加工は得策ではない。このような場合レーザ加工ヘ
ッドをノぐイブの外周に沿って回転することにより、切
断を行なう集光スポットがパイプの円周上を移動するよ
うな構造のレーザ切断装置があれば良い。従来、集光ス
ポットが回転し得るレーザ加工装置としては第1図、第
2図に示すタイプのものが考案されている。第1図のも
のはレーザ発信器1がら出たレーザビームを、集光部3
で屈折させ切断材料9の切断個所にあて、集光部3のレ
ンズを回転して、集光スポラトラ移動する方式で、切断
後のパイプの切り口の形状、切断しるがあまり問題にな
らなめ場合でかつ比較的端部から近い部分で切断する場
合には適用できるが端部から離れた部分で切断したい場
合等、一般の場合は適用出来ない。第2図のものはレー
ザ発信器lから出たレーザビームの集光部3に、ビーム
を直角に折曲するミラーを設けた加工ヘッドを材料9の
中空部に差し込み架台7に支持されている集光部を回転
させて切断する形式のものなので、第1図のものと同様
に切断する箇所が端部から離れると切口形状、切断しろ
全問題にする切断が難しくなり、又実際的な装置として
は考えにくい。このように従来タイプのものは、切断材
料の端部附近の切断には適用できるが、その他の個所の
切断に適用することは困難である。
For example, when cutting a long metal pipe using a central laser, it is difficult to rotate the pipe at a constant speed without positional fluctuation because the pipe is long, and the rotating equipment that can perform this type of rotation is quite large. It becomes fragile, so rotating the pipe for machining is not a good idea. In such a case, it is sufficient to have a laser cutting device that has a structure in which the laser processing head is rotated along the outer circumference of the pipe so that the focused spot for cutting moves on the circumference of the pipe. BACKGROUND ART Conventionally, as a laser processing apparatus in which a focused spot can be rotated, the type shown in FIGS. 1 and 2 has been devised. In the one shown in Fig. 1, the laser beam emitted from the laser transmitter 1 is transferred to the condenser 3.
In this method, the lens of the condensing part 3 is rotated to move the condensing sporatra, and the shape of the cut end of the pipe after cutting is determined by the shape of the cut end of the pipe. This method can be applied when cutting at a portion that is large and relatively close to the end, but cannot be applied in general cases such as when cutting at a portion far from the end. In the one shown in Fig. 2, a processing head equipped with a mirror that bends the beam at right angles is inserted into the hollow part of the material 9 and supported by a pedestal 7 in the condensing part 3 of the laser beam emitted from the laser transmitter 1. Since it is of a type that cuts by rotating the condensing part, as in the case of the one in Figure 1, if the cutting point is far from the end, it becomes difficult to cut the cut shape and the cutting distance, and it also requires practical equipment. It's hard to imagine that. As described above, the conventional type can be applied to cutting near the end of the material to be cut, but it is difficult to apply it to cutting at other locations.

レーザ加工ヘッドを材料の周囲に沿って移動し得る装置
に類似のものとして、医療用のレーザメスがある。これ
は第3図に示すような構造を有し。
A medical laser scalpel is similar to a device that can move a laser processing head along the circumference of a material. This has a structure as shown in FIG.

加工ヘッド先端に相当するメス部分く集光部)3が移動
し得るように屈曲性のある導光路2′f:レーザ発信器
lからメス部分3に至る全区間に有している。この導光
路は通常第3図に示すように多数のミラー4を節々に設
けた多関節管又は光ファイノ々−で出来ている。この構
造は人体手術用のように必要な加工エネルギーが比較的
小さい場合は実用に供し得るが、金属材料の加工等加工
エネルギーが大きくなると、多関節管はミラーの重量増
により導光路の重量が厖大となり集光部の移動速度を早
くできず実用的でなく、父上記手術用の導光路の光ファ
イノ々−の許容透過エネルギーを越えてしまい金属材料
の加工等には実用不可能であった。
A flexible light guide path 2'f is provided in the entire section from the laser transmitter l to the female part 3 so that the female part corresponding to the tip of the processing head (light condensing part) 3 can move. This light guiding path is usually made of a multi-jointed tube or optical fibers in which a large number of mirrors 4 are provided at various joints, as shown in FIG. This structure can be put to practical use when the required machining energy is relatively small, such as in human surgery, but when the machining energy increases, such as when machining metal materials, the weight of the light guide path increases due to the increased weight of the mirror in the multi-jointed tube. Due to its large size, it was not practical because the moving speed of the light condensing part could not be increased, and it exceeded the permissible transmission energy of the optical fibers in the light guide path for the above-mentioned surgery, making it impractical for processing metal materials, etc. .

そこで、本発明においては、光ファイバーを複数本束ね
て合計として、金属材料等の加工可能なエネルギー量を
透過可能な屈曲性のある導光路をつくり、導光路の先端
に集光部を設けて集光部が適正な切断又は溶接速度で移
動できる機構とした。
Therefore, in the present invention, a plurality of optical fibers are bundled together to create a flexible light guide path that can transmit the amount of energy that can be processed into metal materials, and a light condensing section is provided at the tip of the light guide path to collect the energy. The mechanism allows the light section to move at an appropriate cutting or welding speed.

すなわち、本発明は、長尺、oイブの切断例のように、
レーザ加工ヘッド全材料の周囲に沿って適正な速度で移
動しながら、溶接、切断、穴あけ等の加工を施せるよう
に、複数の光ファイバーを束ねることにより、大出力の
レーザ光のガイドを可能とする可撓性の導光路を有する
ことを特徴とするレーザ加工装置である。
That is, the present invention, as in the case of cutting a long length or an ove,
By bundling multiple optical fibers, it is possible to guide high-power laser light so that the laser processing head can perform processes such as welding, cutting, and drilling while moving around the entire material at an appropriate speed. This is a laser processing device characterized by having a flexible light guide path.

以下本発明を、その応用例の1つであるパイプ切断の場
合について図面に基いて説明する。第4図は訓エヘッド
移動型レーザ切断装置の構成説明図である。レーザ発振
器lから出たレーザビームは金属ミラー等から成るビー
ムスシリツタ−6で上下に分けられ、平面ミラー4,5
:4’、5’によってパイプの上面および下面まで導か
れる。そして次に入口先端にそれぞれ個別のカッシラー
を有する複数の光ファイバーよ構成る可撓性の導光路2
 、2’t−通って集光部3,3′によりパイプ9の表
面に適正な集光を行なう。ここにカッシラーとはレーザ
光を効率良く光フアイバー内へ導入するための集光レン
ズより成っており、通常1本1本の光ファイバーと一体
になっている。上記集光部33/はそれぞれ架台7上に
設けられた案内レール8.8′上を移動し得る構造とな
っており、起動信号によって上側集光部3は例えばA点
からB点へ、下側集光部3′は例えばB点からA点まで
移動して、uイブの切断を完了する。この際、切断中の
パイプ変形が生ずる場合は加工ヘッド(導光路+集光部
)の両01lI kクランプする必要がある。
The present invention will be described below with reference to the drawings in the case of pipe cutting, which is one of its application examples. FIG. 4 is an explanatory diagram of the configuration of a moving head type laser cutting device. The laser beam emitted from the laser oscillator 1 is divided into upper and lower parts by a beam sinter 6 consisting of a metal mirror, etc.
: Guided to the upper and lower surfaces of the pipe by 4' and 5'. Next, a flexible light guide path 2 consisting of a plurality of optical fibers each having an individual cassiller at the entrance tip.
, 2't-, and is appropriately focused on the surface of the pipe 9 by the focusing portions 3, 3'. Here, the Cassillor consists of a condensing lens for efficiently introducing laser light into the optical fiber, and is usually integrated with each optical fiber. Each of the light condensing parts 33/ has a structure in which it can move on guide rails 8.8' provided on the pedestal 7, and the upper light condensing part 3 moves downward, for example from point A to point B, in response to a start signal. The side condensing section 3' moves, for example, from point B to point A, and completes the cutting of the u-wave. At this time, if the pipe deforms during cutting, it is necessary to clamp both the processing head (light guide path + light condensing section).

集光部3,3′は通常第5−(1)図に示すように1個
のレンズlOを用いて複数ファイバー19.19、−・
−・からの複数の光を受けて集光するが第5−・(2)
図のようにファイバー19個々に対応した個別レンズl
O′から成るレンズ群又は第5−(3)図に示すような
集光ミラー21から成る構造も目的によって親用できる
The condensing parts 3, 3' are usually constructed by using one lens lO to connect multiple fibers 19, 19, -.
It receives and condenses multiple lights from −・, but the 5th −・(2)
Individual lenses corresponding to each fiber 19 as shown in the figure
A lens group consisting of O' or a structure consisting of a condensing mirror 21 as shown in FIG. 5-(3) can also be used depending on the purpose.

更にパイプが長手方向に走行している場合には、第6図
に示すように平面ミラー14の傾きを変え平面ミラー1
5の前に新たに平面ミラーlOを設け、この平面ミラー
10及び平面ミラー15および加工ヘッドを一緒にノξ
イゾの長手方行に移動6丁能な構造とし、パイプの走行
に合わせて移行させれば艮い。
Furthermore, when the pipe runs in the longitudinal direction, the inclination of the plane mirror 14 is changed as shown in FIG.
A new plane mirror 10 is installed in front of 5, and the plane mirror 10, the plane mirror 15, and the processing head are connected together to the
It is possible to create a structure in which six Izos can be moved in the longitudinal direction, and to move them according to the movement of the pipe.

〔実施例〕・ξイブ切断(静止中] ・パイプサイズ 外径101.6+n、肉厚5.7m。[Example] - ξ Eve cutting (while stationary) ・Pipe size: outer diameter 101.6+n, wall thickness 5.7m.

長さ12m ・レーザ出力  2KW ・ビームスプリッタ−銅製ミラー ・集光部      にCZレソズ ・加工ヘッド移動速度 20ta/sec上記実施例に
よる切断は切断面が平滑であり。
Length: 12 m - Laser output: 2 KW - Beam splitter - copper mirror - CZ resin for condensing part - Machining head movement speed: 20 ta/sec Cutting according to the above embodiment results in a smooth cut surface.

切断中も狭いものであった。The cutting process was also narrow.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は集光部のレンズが回転し得るレーザ加工装置の
従来例の説明図、第2図は別の機構による従来例の説明
図、第3図は医療用レーザメスの丸部の構成例を示す説
明図、第6図は走行中のパイプの切断が可能なレーザ加
工装置の概念図である。 l・・・レーザー発信器 2・・・導光路 3・・・集光部 4.4′・・・ミラー 5.5′・・・ミラー 19・・・光ファイバー 20・・・レンズ 代理人 弁理士   秋 沢 政 光 外2名
Fig. 1 is an explanatory diagram of a conventional example of a laser processing device in which the lens of the condensing part can rotate, Fig. 2 is an explanatory diagram of a conventional example with a different mechanism, and Fig. 3 is an example of the configuration of the round part of a medical laser scalpel. FIG. 6 is a conceptual diagram of a laser processing device capable of cutting a pipe while it is running. l...Laser transmitter 2...Light guide path 3...Condenser section 4.4'...Mirror 5.5'...Mirror 19...Optical fiber 20...Lens agent Patent attorney Aki Sawamasa Mitsugai 2 people

Claims (1)

【特許請求の範囲】[Claims] (1)  複数の光ファイノ々−を束ねることにより構
成した大出力のレーザ光のガイドを可能とする可撓性の
導光路を有することを特徴とするレーザ加工装置。
(1) A laser processing device characterized by having a flexible light guide path configured by bundling a plurality of optical fibers and capable of guiding a high-output laser beam.
JP57116168A 1982-07-06 1982-07-06 Laser working device Pending JPS597491A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57116168A JPS597491A (en) 1982-07-06 1982-07-06 Laser working device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57116168A JPS597491A (en) 1982-07-06 1982-07-06 Laser working device

Publications (1)

Publication Number Publication Date
JPS597491A true JPS597491A (en) 1984-01-14

Family

ID=14680469

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57116168A Pending JPS597491A (en) 1982-07-06 1982-07-06 Laser working device

Country Status (1)

Country Link
JP (1) JPS597491A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05508808A (en) * 1990-08-17 1993-12-09 シーメンス アクチエンゲゼルシヤフト Pipe laser welding equipment and method
US7304265B2 (en) * 2002-03-12 2007-12-04 Mitsuboshi Diamond Industrial Co., Ltd. Method and system for machining fragile material

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05508808A (en) * 1990-08-17 1993-12-09 シーメンス アクチエンゲゼルシヤフト Pipe laser welding equipment and method
US7304265B2 (en) * 2002-03-12 2007-12-04 Mitsuboshi Diamond Industrial Co., Ltd. Method and system for machining fragile material
US7816623B2 (en) 2002-03-12 2010-10-19 Mitsuboshi Diamond Industrial Co., Ltd. Method and apparatus for processing brittle material

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