JPS62196382A - Patterning method for conductive film - Google Patents

Abstract

PURPOSE:To prevent the generation of flaws and stains on a high-polymer film by sticking a surface protective film on the opposite face of the high- polymer film having a conductive film on one face, tentatively fixing the same to a plate and etching the conductive film. CONSTITUTION:The thin conductive film consisting of a metal such as Ag, Cu or Al or metallic oxide such as SnO or In2O3 is deposited by a vacuum deposition method on one face of the high-polymer film consisting of a polystyrene, polymethyl acrylate, PVC, etc., as a substrate. A photosensitive film resist mask of a water soluble treatment type is formed on such thin film and the protective film consisting of a PE film and acrylic self-adhesive agent is formed on the opposite surface of the high-polymer film. The photosensitive film resist mask is exposed with a desired pattern and thereafter, the protective film surface is fixed to the surface of the plate material. The resist mask in the unexposed part is dissolved and the film is etched. The resist film on the remaining surface is stripped and the film of the conductive pattern having no flaws and stains is thus formed on the high-polymer film.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for forming a pattern on a conductive film,
Specifically, it relates to the mode of transportation of a conductive film in the process of forming a pattern of the conductive film required by etching a conductor or semiconductor film made of a metal or metal oxide applied by vapor deposition or the like to a polymer film as a base. It is.

The conductive polymer film, which has a conductive thin film on the polymer film, can be used for wiring boards, heaters, touch panel electrodes,
Alternatively, it can be used for electrodes for liquid crystal displays, etc., but in general, when used for such purposes, the necessary part of the electrically conductive film provided on the surface is left and the other parts are dissolved. It is then necessary to remove or etch it into a predetermined pattern. Recently, there has been active development of liquid crystal displays that use conductive polymer films as electrodes, but when used as electrodes for such display elements, extremely thin electrodes are required due to the recent trend towards thinner, thinner, and smaller electrodes. It has become necessary to process conductive polymer films without causing scratches, stains, etc. during the pattern forming process.

(Prior Art) Conventionally, as a method of etching a conductive film formed on a substrate, a mask is first formed in a predetermined pattern on a conductive thin film using a screen printing method or a photoresist method, and then etched. Thereafter, the patterned mask is dissolved and removed using a release agent. This type of etching method has been widely used for Nesa glass in the past, but since the substrate is glass, there is no problem in performing etching, washing, etc. while moving it on a roller conveyor, but if the substrate is raised from glass When replaced with a molecular film, the polymer film is flexible and bends easily, and the friction with the roller causes scratches and dirt, so when the conductive polymer film is passed through the same etching process as Nesa Glass, it becomes more conductive than expected. I was only able to obtain an insufficient amount of information.

(Method for solving the problem) In order to improve the above-mentioned drawbacks, the present inventor tried a method of bonding a conductive polymer film onto a hard substrate and passing it through an etching process. It was found that contact caused scratches on the conductive polymer film and that it was very time-consuming, so further improvements were attempted and the present invention was achieved. That is, the present invention is a polymer film having a conductive film on one side.
This is an S-type film pattern forming method characterized by pasting a surface protection film on the molecular film surface opposite the conductive film, temporarily fixing it to a relatively hard-to-bend plate, and then performing etching or other processing. . Examples of the conductive film in the conductive polymer film required for the object to be treated in the method of the present invention include thin films of metals such as silver, copper, and aluminum, and thin films of metal oxides such as tin oxide and indium oxide. These thin films are usually applied by vaporization or the like. The vapor deposition method may be any method such as vacuum evaporation, DC sputtering, or ion blasting, and the polymer film may be polystyrene, polymethyl acrylate, or polycarbonate.

Polyvinyl chloride, acetate, polyester nalphone, polysulfone, polyethylene, polypyrene, polyamide, polytetrafluoroethylene.

Examples include plastics such as polyester.

The surface protection film used in the method of the present invention may be any film as long as it has adhesiveness on one side, but preferably has a standard adhesiveness of 5 to 1! A light adhesive film of about M/25m is good. Examples include a film made of a polyethylene film and an acrylic adhesive, a film made of a polyethylene film and a synthetic rubber adhesive, a film made of a polypropylene film and a synthetic rubber adhesive, a polyethylene coextruded film, and the like. These surface protection films are applied to the entire opposite side of the conductive film of a polymer film with a conductive film on one side, after or before the mask is applied.The method for applying the mask is the usual method. There are no particular limitations on the method as long as it is used, and screen printing or photoresist methods may be used.

In the screen printing method, a predetermined pattern may be formed by applying a masking agent onto a conductive film according to the pattern using a predetermined pattern screen plate, and then etching it. There are two types of photoresist methods: a coating type and a resist film attachment type. In both cases, a predetermined pattern can be formed by exposing and developing the resist together, followed by etching.

(Effects) In the present invention, since the surface retaining film is fully bonded to the surface of the conductive polymer film on the opposite side of the conductive film, it can be easily applied by passing it between two rollers. I can do it. The surface protection film does not damage the conductive polymer film, does not impair the transparency of the liquid crystal display element, and does not reduce the visibility due to diffused reflection.

In particular, since the surface protection film is bonded over the entire surface, there is no possibility of staining with etching solution, and cleaning is simple and requires only the conductive film.

Hereinafter, the method of the present invention will be explained in detail with reference to Examples.

Example 1 Polyethylene terephthalate film has a surface resistance of 30
One indium-tin oxide source was vapor-deposited so that the resistance was 0Ω/mouth. This film was laminated with a water-soluble photosensitive film resist (Liston J3410, manufactured by DuPont), and then a surface retention film (manufactured by Sunny Chemical Industries, Ltd.) was applied to polyethylene terephthalate on the opposite side to the side on which the photosensitive film resist was laminated. "Sanitect"PAC-3> was laminated. After the photosensitive film resist portion of this film was exposed, it was fixed onto a Bakelite board with adhesive tape so that the surface protection film was in contact with the Bakelite board.

Afterwards, while the film was fixed on the Bakelite plate, the unexposed parts of the photosensitive film resist were dissolved and removed with a dilute alkaline aqueous solution, and after drying, a 25 vol.
) After that, the resist agent was removed with a 1.5% sodium hydroxide aqueous solution (25°C), washed with water and dried, and etching was completed. Furthermore, after the pattern was formed, when the film was removed from the Bakelite plate and the surface protection film laminated on the polyethylene terephthalate film surface was peeled off, scratches and stains appeared on the polyethylene terephthalate film on which the indium-tin oxide thin film was deposited. A pattern was formed without The electrode formed in this manner could be used as a display electrode with extremely excellent display quality.

Comparative Example 1 In the same manner as in Example 1, an indium-tin oxide thin film having a surface resistance of 300 Ω/hole was deposited on a polyethylene terephthalate film. The same photosensitive film resist as in Example 1 was laminated thereon and exposed. Thereafter, the polyethylene terephthalate film surface opposite to the surface on which the photosensitive film resist was laminated was fixed onto the Bakelite board using adhesive tape so that it was in contact with the Bakelite board. While the film was fixed on the Bakelite plate, the non-exposed portions of the photosensitive Hunlum resist were dissolved and removed with a dilute aqueous alkaline solution, and after drying, it was etched with a 25% by volume aqueous hydrochloric acid solution (25°C). Thereafter, the resist agent was removed with a 1.5% sodium hydroxide aqueous solution (25°C), washed with water, and dried. As a result, etching was achieved and a pattern was formed, but when the film was removed from the Bakelite plate, scratches and stains appeared on the surface of the polyethylene terephthalate film, making it impossible to use it as a display electrode.

Claims (1)

[Claims] A polymer film with a conductive film on one side has a surface protection film attached to the surface of the polymer film on the opposite side of the conductive film, and is temporarily fixed to a plate that is relatively hard to bend, and then subjected to processing such as etching. Pattern formation method for conductive film