JPS62195829A - Method of forming spacer of gas discharge panel - Google Patents

Method of forming spacer of gas discharge panel

Info

Publication number
JPS62195829A
JPS62195829A JP61036830A JP3683086A JPS62195829A JP S62195829 A JPS62195829 A JP S62195829A JP 61036830 A JP61036830 A JP 61036830A JP 3683086 A JP3683086 A JP 3683086A JP S62195829 A JPS62195829 A JP S62195829A
Authority
JP
Japan
Prior art keywords
forming
layer
spacer
melting point
point glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61036830A
Other languages
Japanese (ja)
Inventor
Toshiyuki Nanto
利之 南都
Tsutae Shinoda
傳 篠田
Mamoru Miyahara
宮原 衛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP61036830A priority Critical patent/JPS62195829A/en
Publication of JPS62195829A publication Critical patent/JPS62195829A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To improve the forming accuracy by print-forming an insulator layer in lamination of at least 2 layers, using a thin screen printing mask for the first layer and thick screen printing layer for the second layer and the rest, on dielectric layers of both substrates. CONSTITUTION:On dielectric layers 5, 6 covering multiple electrodes 3, 4 arranged on substrates 1, 2 for the respective panels, low melting point glass layers 21a, 22a for the forming of 1st spacer layer are formed with good pattern width accuracy by means of screen printing of small mesh number and thin stencil film making the mask, and are then dried. Glass layers 21b, 22b, of a similar linear pattern and thickness as large as possible to the extent that no drooping occurs in the applied low melting point glass layer for the forming of spacer, are formed on the lower melting point glass layers 21a, 22a for the forming of 1st spacer layer, and then dried. Further on these layers, thick spacers 21, 22 consisting of low melting point glass layers of specified dimensions and shapes are formed in lamination. By this process, linear pattern of good width accuracy and relatively large thickness can easily be formed in the specified dimensions and shapes.

Description

【発明の詳細な説明】 〔概 要〕 本発明は各種表示装置に用いられるガス放電パネルのガ
ス放電空間の間隙を規定するための厚膜スペーサの形成
方法であって、パネルを構成する各基板における複数の
電極を被覆した誘電体層−1−に、それぞれ前記電極対
向間隙を避けたパターンでスペーサとなる絶縁材層を、
当初はメッシュ数が小さく、マスクを構成するステンシ
ル膜厚の薄いスクリーン印刷マスクを用い、2回目以降
はメッシュ数が大きく、ステンシル膜厚の厚いスクリー
ン印刷マスクを用いて、少なくとも2層以−にに分けて
積層状に印刷形成することにより、1OOlノm程度の
比較的高い(厚い)厚膜スペーサを、ダレさせることな
く所定パターン幅で精度よく、かつ容易に得るようにし
たものである。
[Detailed Description of the Invention] [Summary] The present invention is a method for forming a thick film spacer for defining a gap in a gas discharge space of a gas discharge panel used in various display devices. An insulating material layer serving as a spacer is provided on the dielectric layer -1- covering the plurality of electrodes in a pattern that avoids the electrode facing gap, respectively.
Initially, a screen printing mask with a small mesh number and a thin stencil film is used, and from the second time onwards, a screen printing mask with a large mesh number and a thick stencil film is used to create at least two layers. By separately printing and forming the spacer in a laminated form, a relatively high (thick) thick film spacer of about 100 nm can be easily obtained with high accuracy and a predetermined pattern width without sagging.

〔産業上の利用分野〕[Industrial application field]

本発明は各種表示装置に用いられるガス放電パネルのガ
ス放電空間の間隙を規定するためのスぺ−サ形成方法に
係り、特に厚膜形成法により、比較的高い(厚い)スペ
ーサをダレが生しないように精度良く形成する方法に関
するものである。
The present invention relates to a method of forming a spacer for defining the gap between the gas discharge spaces of gas discharge panels used in various display devices, and in particular, a thick film forming method may cause relatively tall (thick) spacers to sag. The present invention relates to a method of forming with high precision so as to avoid

プラズマディスプレイパネルの名称で知られる平板状の
ガス放電パネル、例えばトノ1表示形式の7トリソクス
型パネル等の対向電極放電型のガス放電パネルは、それ
ぞれ表面に誘電体層で被覆された複数の電極を配設して
なる一対の基板を、所定ガス放電空間を挟んで対向配置
し、その周囲を封着材により気密に封止した状態で、そ
の所定ガス放電空間内に放電ガスを封入した構造を有し
ている。
A flat gas discharge panel known as a plasma display panel, for example, a counter-electrode discharge type gas discharge panel such as a 7-trisox type panel with a one-top display type, has a plurality of electrodes each covered with a dielectric layer on the surface. A structure in which a pair of substrates arranged with the above are placed facing each other with a predetermined gas discharge space in between, and a discharge gas is sealed in the predetermined gas discharge space while the periphery thereof is hermetically sealed with a sealing material. have.

このような構造のガス放電パネルのガス放電特性は、そ
のガス放電空間の間隙精度に大きく依存して変化するこ
とから、これら放電間隙を全領域にわたって均一に維持
すると共に、各対向電極交点により構成される放電セル
での放電が隣接放電セル間で結合することを防止ために
、表面に誘電体層で被覆された複数の電極を配設してな
る一対の基板上に、それぞれ前記電極対向間隙を避けた
線状パターンの絶縁材層からなる厚膜スペーサを形成し
、この両方のスペーサを基板対向間で衝合介在すること
により前記放電間隙を均一に規定する構成がとられてい
る。
The gas discharge characteristics of a gas discharge panel with such a structure vary greatly depending on the gap accuracy of the gas discharge space. In order to prevent discharges in discharge cells from being coupled between adjacent discharge cells, a pair of substrates each having a plurality of electrodes whose surfaces are covered with a dielectric layer are provided with gaps between the electrodes facing each other. The discharge gap is uniformly defined by forming a thick film spacer made of an insulating material layer in a linear pattern that avoids the discharge gap, and by interposing both spacers against each other between the opposing substrates.

しかし、−に記のような厚膜スペーサを比較的厚く形成
するとダレが生し易く、比較的高い(厚い)厚膜スペー
サをパターン幅を拡げることなく精度良(形成すること
は難しい。このため、そのような比較的高い厚膜スペー
サを必要とする規定のパターン幅に精度良く、かつ容易
に形成し得る方法が必要とされている。
However, if a thick film spacer like the one described in - is formed relatively thick, it tends to sag, and it is difficult to form a relatively tall (thick) thick film spacer with good precision without increasing the pattern width. There is a need for a method that can easily and accurately form a pattern with a specified width that requires such relatively thick film spacers.

〔従来の技術〕[Conventional technology]

従来の対向電極放電型のガス放電パネルの厚膜スペーサ
の形成方法は、例えば第3図に示すようにそれぞれ表面
に誘電体層5.6で被覆された複数の電極3,4を配設
してなる一対の基板1,2上に、該各誘電体層5.6で
被覆された複数の電極3.4と直交する方向でそれぞれ
両電極3.4の対向間隙を避けた線状パターンの低融点
ガラス層からなる厚膜スペーサ7.8を、スクリーン印
刷による厚膜形成法によって塗着し、焼成して形成して
いる。
A conventional method for forming a thick film spacer for a gas discharge panel of the opposed electrode discharge type involves disposing a plurality of electrodes 3 and 4 each covered with a dielectric layer 5, 6 on the surface thereof, as shown in FIG. A linear pattern is formed on a pair of substrates 1 and 2 consisting of a plurality of dielectric layers 5.6 in a direction perpendicular to the plurality of electrodes 3.4, avoiding the opposing gaps between the electrodes 3.4. A thick film spacer 7.8 made of a low melting point glass layer is applied by a thick film forming method using screen printing and is formed by baking.

この際、これら各厚膜スペーサ7.8の厚さは、例えば
前記一対の基板1.2の対向する各誘電体層5,6間の
所定ガス放電空間に規定する間隙の丁度半分の寸法とし
ている。
At this time, the thickness of each thick film spacer 7.8 is, for example, exactly half the gap defined in the predetermined gas discharge space between the opposing dielectric layers 5 and 6 of the pair of substrates 1.2. There is.

しかして、上記のように構成した一対のパネル板を第4
図に示すように重ね合わせて組み立てると、前記厚膜ス
ペーサ7と8が交差した状態で部分的に衝合され、この
両スペーサ7.8の交差衝合によって所定ガス放電空間
の間隙を規定している。
Therefore, the pair of panel boards configured as described above was
When stacked and assembled as shown in the figure, the thick film spacers 7 and 8 are partially abutted in a crossing state, and the gap between the predetermined gas discharge space is defined by the cross abutment of both spacers 7 and 8. ing.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

ところで、上記した従来の低融点ガラス層からなる厚膜
スペーサ7.8をスクリーン印刷による厚膜形成法によ
って塗着形成する場合、その配設ピッチは0.3 mm
で、線状パターン幅は100μm。
By the way, when the above-described conventional thick film spacer 7.8 made of a low melting point glass layer is applied and formed by a thick film forming method using screen printing, the arrangement pitch is 0.3 mm.
The linear pattern width is 100 μm.

高さく厚さ)が50μm程度の寸法が要求されているた
め、スクリーン印刷により低融点ガラスペーストを各基
板1.2上の電極3.4を被覆じてなる誘電体層5,6
上に、スペーサ形成用の低融点ガラスペーストを用いて
スクリーン印刷により低融点ガラス層を塗着した際に、
該低融点ガラス層にダレが生じ易く、規定の寸法形状の
低融点ガラス層からなる厚膜スペーサ7.8を精度よく
形成することが容易でないという欠点があった。
Dielectric layers 5 and 6 are formed by covering the electrodes 3.4 on each substrate 1.2 with a low melting point glass paste by screen printing.
When a low melting point glass layer was applied on top by screen printing using a low melting point glass paste for spacer formation,
There is a drawback that the low melting point glass layer tends to sag, and it is not easy to accurately form the thick film spacer 7.8 made of the low melting point glass layer with a specified size and shape.

本発明はこのような従来の欠点に鑑み、各基板上の電極
を被覆してなる誘電体層の所定領域面に、少なくとも2
種類のメッシュ数及びマスクを構成するステンシル膜の
膜厚の異なるスクリーン印刷マスクを用いて、スクリー
ン印刷により低融点ガラス層からなる厚膜スペーサを少
なくとも2回以上の塗着回数で積層形成するようにして
、規定の寸法形状の低融点ガラス層からなる厚膜スペー
サを、精度よく形成し得るようにした新規なガス放電パ
ネルのスペーサ形成方法を提供することを目的とするも
のである。
In view of such conventional drawbacks, the present invention provides at least two
Using screen printing masks with different numbers of meshes and different thicknesses of stencil films constituting the masks, a thick film spacer made of a low melting point glass layer is laminated by screen printing at least two times or more. Therefore, it is an object of the present invention to provide a novel method for forming spacers for gas discharge panels, which enables the formation of thick film spacers made of a low-melting glass layer having a specified size and shape with high precision.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は上記目的を達成するため、第1図に示すように
、各パネル川基板1,2十の電極3.4を被覆してなる
誘電体層5.G十に、該各誘電体層5.6で被覆された
複数の電極3,4と直交する方向でそれぞれ両電極3,
4の対向間隙を避けた線状パターンを有し、かつ形成す
べき厚膜スペーサ21.22のパターン幅粘度を高める
ために、例えばメッシュ数が小さく、マスクを構成する
ステンシル膜の膜厚が薄い第1スクリーン印刷マスクを
用いたスクリーン印刷により、パターン幅精度の良好な
膜厚の薄い第一層目のスペーサ形成用低融点ガラス層2
]a、 22aを塗着形成する。
In order to achieve the above object, the present invention has a dielectric layer 5.4 covering the electrodes 3.4 of each panel substrate 1, 20, as shown in FIG. G1, both electrodes 3, 4 in a direction orthogonal to the plurality of electrodes 3, 4 covered with each dielectric layer 5.6, respectively.
In order to increase the pattern width viscosity of the thick film spacers 21 and 22 to be formed, for example, the number of meshes is small and the thickness of the stencil film constituting the mask is thin. The first layer of low melting point glass layer 2 for forming spacers has a thin film thickness with good pattern width accuracy by screen printing using the first screen printing mask.
]a, 22a is formed by coating.

次に乾燥後の該第一層目のスペーサ形成用低融点ガラス
121a、 22a、、l−に、前記第1スクリーン印
刷マスクと同様の綿状パターンを有し、かつ塗着するス
ペーサ形成用低融点ガラス層にダレが律しない範囲で出
来るだけ厚く形成しiυる、例えばメソシブ数が大きく
、マスクを構成するステンシル膜の膜厚が厚い第2スク
リーン印刷マスクを用いたスクリーン印刷により、膜厚
が比較的厚い第二層目のスペーサ形成用低融点ガラス層
21b、22bを塗着形成する。
Next, after drying, the first layer of low melting glass for spacer formation 121a, 22a, . The melting point glass layer is formed as thick as possible without sagging, for example, by screen printing using a second screen printing mask with a large mesoside number and a thick stencil film forming the mask. A relatively thick second spacer-forming low melting point glass layer 21b, 22b is formed by coating.

以F、乾燥後の該第二l1ji1」のスパー9゛形成用
低融点ガラス層21b、 22b上に、前記第2スクリ
ーン印刷マスクを用いたスクリーン印刷により同様に第
三層目のスペーサ形成用低融点ガラス層21(1,22
cを塗着形成し、引続き乾燥後、焼成処理を行って、規
定の寸法形状の低融点ガラス層からなる厚膜スペーサを
積層状に形成する。
Thereafter, on the dry low melting point glass layers 21b and 22b for forming the spar 9' of the second l1ji1', a low melting point glass layer for forming the third layer spacer is similarly applied by screen printing using the second screen printing mask. Melting point glass layer 21 (1, 22
c is applied and formed, followed by drying and firing treatment to form a laminated thick film spacer made of a low melting point glass layer having a prescribed size and shape.

〔作 用〕[For production]

このように本発明のスペーサ形成方法は、少な(とも2
種類のメソンユ数及びマスクを構成するステンシル膜の
II―厚の異なるスクリーン印刷マスクを用いて、当初
のスクリーン印刷によりパターン@精度の良好な膜厚の
薄い第一層目のスペーサ形成用低融点ガラス層21a、
 22aを塗着形成し7、その十面に少なくとも1回以
−トの塗着回数に分けて比較的膜厚の厚いスペーサ形成
用低融点ガラス層21b、 22b及び21c、 22
cを積層して厚膜スペー9−を形成しているため、該厚
いスペーサ形成用低融点ガラス層21b、 22b及び
21c、 22c等の塗着時にダレが生じることなく、
線状パターン幅が100μm、高さく厚さ)が50μm
と比較的高い規定寸法形状の低融点ガラス層からなる厚
膜スペーサを精度よく、かつ容易に形成することができ
る。
In this way, the spacer forming method of the present invention can be used to form small
Types of mesonules and stencil films constituting the mask II - Using screen printing masks with different thicknesses, the initial screen printing pattern @ low melting point glass for forming the first layer spacer with a thin film thickness and good accuracy layer 21a,
22a is coated and formed 7, and relatively thick low melting point glass layers 21b, 22b, 21c, 22 for spacer formation are coated on ten sides thereof at least once.
Since the thick film spacer 9- is formed by laminating the thick glass layers 21b, 22b, 21c, 22c, etc., no sagging occurs when applying the thick spacer forming low melting point glass layers 21b, 22b, 21c, 22c, etc.
Linear pattern width is 100μm, height and thickness is 50μm
A thick film spacer made of a low melting point glass layer having a relatively high specified size and shape can be easily formed with high precision.

〔実施例〕〔Example〕

以ド図面を用いて本発明の実施例について詳細に説明す
る。
Embodiments of the present invention will be described in detail below with reference to the drawings.

第1図は本発明に係るガス放電パネルのスペーサ形成方
法の一実施例を説明するための要部断面図である。
FIG. 1 is a sectional view of a main part for explaining an embodiment of the method for forming spacers in a gas discharge panel according to the present invention.

図示のように、例えば各パネル用基Fi1.2」−にそ
れぞれ配設された複数の電極3.4を被覆してなる誘電
体層5.6−Fに、先ず、該各誘電体層5.6で被覆さ
れた複数の電極3,4と直交する方向で、それぞれ両電
極3,4の対向間隙を避けた平行な線状パターンを有し
、かつ形成すべき厚膜スペーサ21.22のパターン幅
精度を高めるために、例えばメツシュ数が300と小さ
く、マスクを構成するステンシル膜の膜厚が例えば]0
メツmと薄い第1スクリーン印刷マスクを用いたスクリ
ーン印刷により、乾燥後の膜厚が例えば10μmでパタ
ーン幅精度の良好な第一層目のスペーサ形成用低融点ガ
ラス層21a、 22aを塗着形成し、引続き乾燥を行
う。
As shown in the figure, first, each dielectric layer 5.6-F is coated with a plurality of electrodes 3.4 disposed on each panel substrate Fi1.2''-. Thick film spacers 21 and 22 to be formed have parallel linear patterns in a direction perpendicular to the plurality of electrodes 3 and 4 covered with . In order to improve pattern width accuracy, the mesh number is as small as 300, and the thickness of the stencil film constituting the mask is, for example, 0.
By screen printing using a thin first screen printing mask and a thin first screen printing mask, a first layer of low melting point glass layers 21a and 22a for forming a spacer with a dry film thickness of, for example, 10 μm and good pattern width accuracy is formed by coating. Then continue drying.

次に乾燥後の該第一層目のスペーサ形成用低融点ガラス
層2+a、 22alに、前記第1スクリーン印刷マス
クと同様の線状パターンを有し、が一つ塗着するスペー
サ形成用低融点ガラス層にダレが生しない範囲で出来る
だけ厚く形成し得る、例えばメッシュ数が200と大き
く、マスクを構成するステンシル膜の膜厚が例えば25
μmと厚い第2スクリーン印刷マスクを用いたスクリー
ン印刷により、乾燥後の膜厚が比較的厚い例えば25μ
mの第一層目のスペーサ形成用低融点ガラスWi 2 
] +1 、22 bを塗着形成し、引続き乾燥を行う
Next, after drying, the first layer of low melting point glass for spacer formation 2+a, 22al has a linear pattern similar to the first screen printing mask and is coated with one low melting point glass for spacer formation. The glass layer can be formed as thick as possible without causing sag, for example, the number of meshes is as large as 200, and the thickness of the stencil film constituting the mask is, for example, 25.
By screen printing using a second screen printing mask as thick as μm, the film thickness after drying is relatively thick, e.g. 25 μm.
Low melting point glass Wi 2 for forming a spacer in the first layer of m
] +1 and 22b are applied and formed, and then dried.

更に、その乾燥後の第二層目のスペーサ形成用低融点ガ
ラス層21b、 22b上に、前記第2スクリーン印刷
マスクを用いたスクリーン印刷により同様に第三層目の
スペーサ形成用低融点ガラス層21c。
Further, on the dried second layer of low melting point glass layers 21b and 22b for spacer formation, a third layer of low melting point glass layer for spacer formation is similarly applied by screen printing using the second screen printing mask. 21c.

22cを塗着形成し、引続き乾燥後、焼成処理を行って
、規定の寸法形状の低融点ガラス層からなる厚膜スペー
サ21.22を積層状に形成する。
22c is applied and formed, and then, after drying, a firing process is performed to form a thick film spacer 21, 22 made of a low melting point glass layer having a prescribed size and shape in a laminated manner.

このような形成方法では、厚膜スペーサ21.22のパ
ターン幅の精度は、第一層目のスペーサ形成用低融点ガ
ラス層21a、 22aにより定まり、その上面に少な
くとも1回以上の塗着回数に分けて、ダレが生じない範
囲で出来るだけ膜厚の厚いスペーサ形成用低融点ガラス
層、例えば21b、 22b及び21c。
In such a forming method, the accuracy of the pattern width of the thick film spacer 21, 22 is determined by the first low melting point glass layer 21a, 22a for spacer formation, and the upper surface thereof is coated at least once. Separately, low melting point glass layers for spacer formation, for example, 21b, 22b and 21c, are made as thick as possible without causing sag.

22cを順次、積層形成することにより、線状パターン
幅が100μm、高さ (厚さ)が50μmと比較的高
い規定寸法形状の低融点ガラス層からなる厚膜スペーサ
21.22を精度よく、かつ容易に形成することが可能
となる。
By sequentially laminating 22c, thick film spacers 21 and 22 made of a low melting point glass layer with relatively high specified dimensions and shape with a linear pattern width of 100 μm and a height (thickness) of 50 μm can be formed with high precision. It becomes possible to form it easily.

従って、このようにして厚膜スペーサ21.22が形成
された一対のパネル基板を第2図に示すように、その各
厚膜スペーサ21.22同士を対向させた状態で組み立
てることにより、この両厚膜スペーサ21.22の交差
衝合によってガス放電空間を所定寸法の間隙に精度良く
規定することができる。
Therefore, by assembling the pair of panel substrates on which the thick film spacers 21, 22 are formed in this manner with the thick film spacers 21, 22 facing each other, as shown in FIG. The cross-abutment of the thick film spacers 21, 22 allows the gas discharge space to be precisely defined in a gap of a predetermined size.

尚、以上の実施例では複数の電極を被覆してなる誘電体
層」二に、該誘電体層で被覆された複数の電極と直交す
る方向で、それぞれ対向型間隙を避けた平行な線状パタ
ーンで厚膜スペーサを形成する場合の例について説明し
たが、本発明はこの例に限定されるものではなく、例え
ば前記誘電体層上に、該誘電体層で被覆された複数の電
極の各電極間に相対する位置で、それぞれ対向型間隙を
避けた平行な線状パターンで厚膜スペーサを形成するよ
うにしてもよく、同様の効果が得られる。
In the above embodiments, a dielectric layer is formed by covering a plurality of electrodes. Secondly, parallel lines are formed in a direction orthogonal to the plurality of electrodes covered with the dielectric layer, avoiding gaps between opposing types. Although an example has been described in which a thick film spacer is formed in a pattern, the present invention is not limited to this example. For example, each of a plurality of electrodes covered with the dielectric layer is A similar effect can be obtained by forming thick film spacers in parallel linear patterns at positions facing each other between the electrodes, avoiding opposing gaps.

また、上記実施例では対となる両方の基板の各誘電体層
上に厚膜スペーサを形成し、この双方の厚膜スペーサに
よりガス放電空間の間隙を規定する場合の例について説
明したが、この例に限らず、例えば対となる基板の内の
一方の基板の誘電体層上のみにガス放電空間の間隙を規
定する高い厚膜スペーサを形成することも勿論可能であ
り、同様の効果が得られる。
Furthermore, in the above embodiment, a thick film spacer is formed on each dielectric layer of both substrates forming a pair, and the gap between the gas discharge spaces is defined by both thick film spacers. For example, it is of course possible to form a tall thick film spacer that defines the gap between the gas discharge spaces only on the dielectric layer of one of the paired substrates, and the same effect can be obtained. It will be done.

〔発明の効果〕〔Effect of the invention〕

以上の説明から明らかなように、本発明に係るガス放電
パネルのスペーサ形成方法によれば、ガス放電空間の間
隙寸法を規定する厚膜スペーサを、0.3 ms+ピッ
チ程度で、線状パターンの幅精度が良く、しかも100
μ−程度の比較的高い(厚い)規定寸法形状に容易に形
成することが可能となる優れた利点を有する。
As is clear from the above description, according to the method for forming spacers for a gas discharge panel according to the present invention, the thick film spacers that define the gap size of the gas discharge space are formed in a linear pattern with a pitch of about 0.3 ms + pitch. Good width accuracy and 100
It has the excellent advantage that it can be easily formed into a relatively high (thick) prescribed size and shape on the order of μ.

従って本実施例で説明したタイプのガス放電パネルに限
らず、比較的高い(厚い)寸法形状の厚膜スペーサを必
要とする各種ガス放電パネル、更には平板状液晶表示パ
ネル等に適用して極めて有利である。
Therefore, it is extremely applicable not only to the type of gas discharge panel described in this embodiment, but also to various gas discharge panels that require thick film spacers with relatively high (thick) dimensions, as well as to flat liquid crystal display panels. It's advantageous.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明に係るガス放電パネルのスペーサ形成方
法の一実施例を説明するため の要部断面図、 第2図は本発明による厚膜スペーサを用いたパネル構成
を示す要部断面図、 第3図は従来のガス放電パネルのスペーサ形成方法を説
明するための要部断面図、 第4図は従来のガス放電パネルのスペーサの介在構成を
示す要部断面図である。 第1図及び第2図において、
FIG. 1 is a cross-sectional view of a main part for explaining an embodiment of a method for forming a spacer for a gas discharge panel according to the present invention. FIG. 2 is a cross-sectional view of a main part showing a panel configuration using a thick film spacer according to the present invention. , FIG. 3 is a cross-sectional view of a main part for explaining a method of forming a spacer in a conventional gas discharge panel, and FIG. 4 is a cross-sectional view of a main part showing an intervening structure of a spacer in a conventional gas discharge panel. In Figures 1 and 2,

Claims (1)

【特許請求の範囲】  それぞれ表面に誘電体層(5、6)で被覆された複数
の電極(3、4)を配設してなる一対の基板(1、2)
を、所定ガス放電空間を挟んで対向配置してなるパネル
構成における前記ガス放電空間の間隙を規定するための
スペーサ形成方法であって、 上記両基板(1、2)の誘電体層(5、6)上にそれぞ
れ前記電極対向間隙を避けたパターンでスペーサ(21
、22)となる絶縁材層を、当初はメッシュ数が小さく
、ステンシル膜厚の薄いスクリーン印刷マスクを用い、
2回目以降はメッシュ数が大きく、ステンシル膜厚の厚
いスクリーン印刷マスクを用いて、少なくとも2層以上
に分けて積層状に印刷形成することを特徴とするガス放
電パネルのスペーサ形成方法。
[Claims] A pair of substrates (1, 2) each having a plurality of electrodes (3, 4) each covered with a dielectric layer (5, 6) on its surface.
A method for forming a spacer for defining a gap between the gas discharge spaces in a panel configuration in which: 6) Place spacers (21
, 22) using a screen printing mask with a small mesh number and a thin stencil film thickness.
A method for forming a spacer for a gas discharge panel, characterized in that from the second time onwards, a screen printing mask with a large mesh number and a thick stencil film thickness is used to print and form at least two or more layers in a laminated form.
JP61036830A 1986-02-20 1986-02-20 Method of forming spacer of gas discharge panel Pending JPS62195829A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61036830A JPS62195829A (en) 1986-02-20 1986-02-20 Method of forming spacer of gas discharge panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61036830A JPS62195829A (en) 1986-02-20 1986-02-20 Method of forming spacer of gas discharge panel

Publications (1)

Publication Number Publication Date
JPS62195829A true JPS62195829A (en) 1987-08-28

Family

ID=12480661

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61036830A Pending JPS62195829A (en) 1986-02-20 1986-02-20 Method of forming spacer of gas discharge panel

Country Status (1)

Country Link
JP (1) JPS62195829A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03505648A (en) * 1988-06-28 1991-12-05 ノキア(ドイチュラント)ゲーエムベーハー Method for manufacturing control plate structure for flat display device
EP0739026A2 (en) * 1995-04-20 1996-10-23 Matsushita Electronics Corporation Gas discharge display panel and its fabrication method
US6838824B2 (en) * 1992-01-28 2005-01-04 Fujitsu Limited Full color surface discharge type plasma display device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03505648A (en) * 1988-06-28 1991-12-05 ノキア(ドイチュラント)ゲーエムベーハー Method for manufacturing control plate structure for flat display device
US6838824B2 (en) * 1992-01-28 2005-01-04 Fujitsu Limited Full color surface discharge type plasma display device
US7030563B2 (en) 1992-01-28 2006-04-18 Hitachi, Ltd. Full color surface discharge type plasma display device
US7133007B2 (en) 1992-01-28 2006-11-07 Hitachi, Ltd. Full color surface discharge type plasma display device
US7208877B2 (en) 1992-01-28 2007-04-24 Hitachi, Ltd. Full color surface discharge type plasma display device
US7825596B2 (en) 1992-01-28 2010-11-02 Hitachi Plasma Patent Licensing Co., Ltd. Full color surface discharge type plasma display device
EP0739026A2 (en) * 1995-04-20 1996-10-23 Matsushita Electronics Corporation Gas discharge display panel and its fabrication method
EP0739026A3 (en) * 1995-04-20 1998-04-22 Matsushita Electronics Corporation Gas discharge display panel and its fabrication method
US5876542A (en) * 1995-04-20 1999-03-02 Matsushita Electronics Corporation Gas discharge display panel and its fabrication method
CN1073273C (en) * 1995-04-20 2001-10-17 松下电子工业株式会社 Gas discharging display device and its producing method

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