JPS62195446U - - Google Patents
Info
- Publication number
- JPS62195446U JPS62195446U JP1986083974U JP8397486U JPS62195446U JP S62195446 U JPS62195446 U JP S62195446U JP 1986083974 U JP1986083974 U JP 1986083974U JP 8397486 U JP8397486 U JP 8397486U JP S62195446 U JPS62195446 U JP S62195446U
- Authority
- JP
- Japan
- Prior art keywords
- gears
- surface plates
- surface plate
- plates
- gear
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009434 installation Methods 0.000 claims 1
- 238000005498 polishing Methods 0.000 claims 1
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Description
第１図は本考案の一実施例を示す上定盤を下降
させた状態での縦断面図、第２図は上定盤を上昇
させた状態での要部拡大図である。
１１……上定盤、１２……下定盤、１３……太
陽歯車、１４……内歯歯車、１５……キヤリヤ、
１６……ワーク、２８……位置センサ。
FIG. 1 is a vertical sectional view showing an embodiment of the present invention with the upper surface plate lowered, and FIG. 2 is an enlarged view of the main parts with the upper surface plate raised. 11...Upper surface plate, 12...Lower surface plate, 13...Sun gear, 14...Internal gear, 15...Carrier,
16...Workpiece, 28...Position sensor.
Claims (1)
歯車により遊星歯車状に駆動されるキヤリヤに保
持させたワークを上下の定盤により研磨するよう
にしたものにおいて、上記上定盤に、下定盤に対
する該上定盤の位置を測定し、その位置が設定値
以下である場合にのみ両定盤及び両歯車の駆動回
路を閉成する位置センサを取付けたことを特徴と
する安全装置付き平面研磨装置。 In a device comprising upper and lower surface plates, a sun gear, and an internal gear, the upper and lower surface plates polish a workpiece held by a carrier driven by both gears in the form of a planetary gear. Equipped with a safety device characterized by the installation of a position sensor that measures the position of the upper surface plate relative to the lower surface plate and closes the drive circuits of both surface plates and both gears only when the position is below a set value. Surface polishing equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986083974U JPH0448925Y2 (en) | 1986-06-02 | 1986-06-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986083974U JPH0448925Y2 (en) | 1986-06-02 | 1986-06-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62195446U true JPS62195446U (en) | 1987-12-12 |
| JPH0448925Y2 JPH0448925Y2 (en) | 1992-11-18 |
Family
ID=30938056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986083974U Expired JPH0448925Y2 (en) | 1986-06-02 | 1986-06-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0448925Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013051184A1 (en) * | 2011-10-04 | 2013-04-11 | 信越半導体株式会社 | Wafer processing method |
| JP2016097450A (en) * | 2014-11-18 | 2016-05-30 | 信越半導体株式会社 | Processing device for workpiece |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5554173A (en) * | 1978-10-06 | 1980-04-21 | Ulvac Corp | Safety device for polisher |
| JPS5776406A (en) * | 1980-10-30 | 1982-05-13 | Supiide Fuamu Kk | Displacement detector in both side lapping plate |
-
1986
- 1986-06-02 JP JP1986083974U patent/JPH0448925Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5554173A (en) * | 1978-10-06 | 1980-04-21 | Ulvac Corp | Safety device for polisher |
| JPS5776406A (en) * | 1980-10-30 | 1982-05-13 | Supiide Fuamu Kk | Displacement detector in both side lapping plate |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013051184A1 (en) * | 2011-10-04 | 2013-04-11 | 信越半導体株式会社 | Wafer processing method |
| JP2013078826A (en) * | 2011-10-04 | 2013-05-02 | Shin Etsu Handotai Co Ltd | Wafer processing method |
| US9490180B2 (en) | 2011-10-04 | 2016-11-08 | Shin-Etsu Handotai Co., Ltd. | Method for processing wafer |
| JP2016097450A (en) * | 2014-11-18 | 2016-05-30 | 信越半導体株式会社 | Processing device for workpiece |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0448925Y2 (en) | 1992-11-18 |