JPS62193914A - Adhesive carrier tape for electronic part and method of mounting electronic part by said adhesive carrier tape - Google Patents
Adhesive carrier tape for electronic part and method of mounting electronic part by said adhesive carrier tapeInfo
- Publication number
- JPS62193914A JPS62193914A JP61036965A JP3696586A JPS62193914A JP S62193914 A JPS62193914 A JP S62193914A JP 61036965 A JP61036965 A JP 61036965A JP 3696586 A JP3696586 A JP 3696586A JP S62193914 A JPS62193914 A JP S62193914A
- Authority
- JP
- Japan
- Prior art keywords
- carrier tape
- tape
- electronic components
- adhesive carrier
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001070 adhesive effect Effects 0.000 title claims description 46
- 239000000853 adhesive Substances 0.000 title claims description 45
- 238000000034 method Methods 0.000 title description 22
- 238000005476 soldering Methods 0.000 claims description 14
- 238000002788 crimping Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920003051 synthetic elastomer Polymers 0.000 description 2
- 239000005061 synthetic rubber Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Packages (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、例えば半導体集積回路等の電子部品の実装を
合理的に行うための電子部品用接着キャリアテープ及び
この接着キャリアテープを使用した電子部品の実装方法
に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to an adhesive carrier tape for electronic components for rationally mounting electronic components such as semiconductor integrated circuits, and an electronic device using this adhesive carrier tape. Concerning how to mount parts.
本発明は、電子部品の実装工程で用いる電子部品用接着
キャリアテープにおいて、両面接着剤からなるセツティ
ングテープを実装すべき電子部品の取付面となる底面に
対応した大きさで剥離性を有するキャリアテープ上に貼
り合わせて構成することによって、電子部品をセツティ
ングテープを介して接着キャリアテープに保持せしめる
と共に、電子部品の実装に際して底面にセツティングテ
ープが付着した状態で接着キャリアテープより剥離し配
線基板の所定位置に電子部品を仮り固定できるようにし
たものである。The present invention relates to an adhesive carrier tape for electronic components used in the electronic component mounting process, in which a setting tape made of double-sided adhesive is attached to a removable carrier having a size corresponding to the bottom surface which is the mounting surface of the electronic component to be mounted. By laminating it on the tape, the electronic components are held on the adhesive carrier tape via the setting tape, and when the electronic components are mounted, they are peeled off from the adhesive carrier tape with the setting tape attached to the bottom surface and wires are removed. This allows electronic components to be temporarily fixed at predetermined positions on the board.
又、本発明は、上記の電子部品用接着キャリアテープに
圧着固定した電子部品を、一旦その底面にセツティング
テープが貼付いたままでキャリアテープより剥離して配
線基板の所定位置に転着固定して半田付けをすることに
よって、実装時の半田付工程を容易且つ正確に行えるよ
うにしたものである。Further, the present invention provides an electronic component which is crimped and fixed to the above-mentioned adhesive carrier tape for electronic components, is once peeled off from the carrier tape with the setting tape still attached to the bottom surface thereof, and then transferred and fixed to a predetermined position on a wiring board. By performing the soldering process, the soldering process during mounting can be performed easily and accurately.
従来、電子部品を配線基板上へ実装する際の半田付工程
は、ディップ方式又はリフロ一方式が採用されている。Conventionally, a dip method or a reflow method has been adopted as a soldering process when electronic components are mounted on a wiring board.
この方式は安価であること、工程が短かいこと、チップ
部品とディスクリート部品の混載ができる等の利点があ
る。しかし、フラットパッケージ型の半導体集積回路（
ＩＣ）等はディップ方式による１回の半田付は工程によ
る製造が困難である。その理由はＩＣ部品の配線基板に
対する位置決め、固定がむづかしく、半田ディツプの際
に位置がずれ易いこと、ＩＣ部品の耐熱信頼性が必要で
あること等による。現状ではチップ部品とディスクリー
ト部品の混載が必要な場合にはディップ方式によらざる
を得ないため、ＩＣ部品はディスクリート部品を半田付
けした後に手作業で半田付けしている。This method has the advantages of being inexpensive, requiring a short manufacturing process, and allowing mixed mounting of chip and discrete components. However, flat package semiconductor integrated circuits (
It is difficult to manufacture products such as ICs by one-time soldering using the dip method. The reasons for this are that it is difficult to position and fix the IC component to the wiring board, that the IC component is easily misaligned during soldering, and that the IC component must have heat resistance and reliability. Currently, when it is necessary to mix chip and discrete components, the dip method has to be used, so IC components are soldered manually after the discrete components are soldered.
上述した現状の方法では、半田デイツプ前に予め配線基
板上のＩＣ部品が配される部分をマスクする必要がある
こと、半田デイツプ後にマスクの剥離が必要なこと、Ｉ
Ｃ部品の手作業による半田が必要である等、実装工程が
煩雑になる欠点がある。しかし乍ら、このような欠点が
あっても部品単価の低減、小型薄型化のため特にフラッ
トパッケージ型ＩＣを使用することは不可欠となってい
る。In the current method described above, it is necessary to mask the area on the wiring board where the IC components are placed before soldering, it is necessary to peel off the mask after soldering, and there are problems with I.
There is a drawback that the mounting process is complicated, such as the need for manual soldering of C components. However, even with these drawbacks, it is essential to use flat package ICs in particular in order to reduce the unit cost of parts and make them smaller and thinner.
本発明は、上述の点に鑑み、電子部品の実装を容易にす
るための電子部品用接着キャリアテープ及びこの接着キ
ャリアテープを使用した電子部品の実装方法を提供する
ものである。In view of the above-mentioned points, the present invention provides an adhesive carrier tape for electronic components to facilitate the mounting of electronic components, and a method for mounting electronic components using this adhesive carrier tape.
本発明は、両面接着剤からなるセツティングテープ（１
）を、実装すべき電子部分の取付面となる底面に対応し
た大きさをもって、剥離性を有するキャリアテープ（６
）上に貼り合わせて電子部品用接着キャリアテープ（５
）を構成する。The present invention provides a setting tape (1) made of double-sided adhesive.
) with a removable carrier tape (6
) onto adhesive carrier tape for electronic components (5
).
セツティングテープ（１１はキャリアテープ（６）の−
面上に所定ピッチをもって多数配列形成する。セツティ
ングテープ（１）は１２０℃〜１３０℃以上の温度に耐
えられるような耐熱性を有し、例えばアクリル系樹脂１
合成ゴム系、その他耐熱性の粘着組成物により形成する
ことができ、さらには市販の両面接着テープを使用する
ことも可能である。Setting tape (11 is carrier tape (6) -
A large number of arrays are formed on the surface at a predetermined pitch. The setting tape (1) has a heat resistance that can withstand temperatures of 120°C to 130°C or higher, and is made of acrylic resin 1.
It can be formed from a synthetic rubber-based or other heat-resistant adhesive composition, and it is also possible to use a commercially available double-sided adhesive tape.
キャリアテープ（６）は両面接着性のあるセツティング
テープ１１）を容易に剥離し得るフィルムより成るもの
で、例えば塩化ビニルフィルム、酢酸ビニルフィルム、
塩化ビニル−酢酸ビニル共重合体フィルム、ポリエチレ
ンフィルム、ポリエステルフィルム、表面を剥離処理し
た紙等にて形成し得る。The carrier tape (6) is made of a film that can be easily peeled off from the double-sided adhesive setting tape 11), such as vinyl chloride film, vinyl acetate film, etc.
It can be formed from vinyl chloride-vinyl acetate copolymer film, polyethylene film, polyester film, paper whose surface has been subjected to release treatment, and the like.
またこのキャリアテープ（６）には、例えばカーボン等
の導電材を混入して導電性を付与して静電防止効果を有
せしめるを可とする。Further, the carrier tape (6) may be mixed with a conductive material such as carbon to impart conductivity and thereby have an antistatic effect.
しかして本発明においては、かかる電子部品用接着キャ
リアテープ（５）に夫々セツティングテープ（１）を介
して電子部品を配列保持する。耶ち電子部品（９）の底
面をセツティングテープ（１）上に圧着固定する。この
電子部品用接着キャリアテープ（５）は複数の電子部品
（９）が保持された状態でロール状に巻装される。そし
て電子部品（９）の実装に際しては接着キャリアテープ
（５）を移送しながらセツティングテープ（１）に固着
された電子部品（９）を、その底面にセツティングテー
プ（１）が貼り付いたままキャリアテープ（６）より剥
離し、実装すべき配線基板（１０）の所定位置に転着固
定する。次いで電子部品（９）を転着固定した配線基板
（１０）を半田付けする。According to the present invention, electronic components are arranged and held on the adhesive carrier tape (5) for electronic components via respective setting tapes (1). The bottom of the electronic component (9) is crimped and fixed onto the setting tape (1). This adhesive carrier tape for electronic components (5) is wound into a roll with a plurality of electronic components (9) held therein. When mounting the electronic component (9), the adhesive carrier tape (5) is transferred while the electronic component (9) is fixed to the setting tape (1), and the setting tape (1) is stuck to the bottom surface of the electronic component (9). It is then peeled off from the carrier tape (6) and transferred and fixed to a predetermined position on the wiring board (10) to be mounted. Next, the wiring board (10) on which the electronic component (9) is transferred and fixed is soldered.
電子部品（９）は、両面接着性を有するセツティングテ
ープｆｌ）によって確実に電子部品用接着キャリアテー
プ（５）上に配列保持される。又、セツティングテープ
＋１１は剥離紙を兼ねるキャリアテープ（６）に貼り合
わされているため、電子部品（９）をキャリアテープ（
６）より剥離したとき、電子部品（９）の底面にセツテ
ィングテープ（１）が貼り付いたまま剥離される。従っ
て、電子部品を接着キャリアテープ（５）より剥離して
配線基板（１０）に実装する際、電子部品（９）は底面
のセツティングテープ（１）によって配線基板（ｌＯ）
の所定位置に仮り固定される。従って、この後の半田工
程で電子部品（９）は位置ずれすることなく、確実に半
田付けされる。この電子部品用接着キャリアテープ（５
）を使用すれば電子部品（９）の配線基板（１０）への
実装工程の自動化が可能となる。The electronic components (9) are reliably arranged and held on the adhesive carrier tape (5) for electronic components by a setting tape (fl) having double-sided adhesive properties. Also, since the setting tape +11 is attached to the carrier tape (6) which also serves as a release paper, the electronic component (9) is attached to the carrier tape (
6) When the electronic component (9) is peeled off, the setting tape (1) remains stuck to the bottom surface of the electronic component (9). Therefore, when the electronic component is peeled off from the adhesive carrier tape (5) and mounted on the wiring board (10), the electronic component (9) is attached to the wiring board (lO) by the setting tape (1) on the bottom.
is temporarily fixed in a predetermined position. Therefore, in the subsequent soldering process, the electronic component (9) is reliably soldered without being displaced. This adhesive carrier tape for electronic components (5
) makes it possible to automate the process of mounting the electronic component (9) onto the wiring board (10).
以下、図面を参照して本発明の詳細な説明する。 Hereinafter, the present invention will be described in detail with reference to the drawings.
第１図乃至第４図は本発明による電子部品用接着キャリ
アテープの一実施例を示す。本例では先ず両面接着剤か
らなるセツティングテープｆｉｌとキャリアキープとか
らなるセパレータ（２）とが貼り合わされたテープ状素
材（３）を設ける（第１図参照）。1 to 4 show an embodiment of the adhesive carrier tape for electronic components according to the present invention. In this example, first, a tape-like material (3) is provided in which a setting tape fil made of a double-sided adhesive and a separator (2) made of a carrier keep are bonded together (see FIG. 1).
セパレータ（２）はセツティングチープロ）から容易に
剥離し易いフィルムにて形成される。このテープ状素材
（３）を所定の幅ｌに裁断して後（第２図参照）、裁断
されたテープ状体（４）のセツティングテープ（１）に
対して、実装すべき電子部品の取付面となる底面に対応
した大きさに残るように抜き加工を施し、第３図及び第
４図に示すようにセパレータ（２）よりなるキャリアテ
ープ（６）上に電子部品の底面に対応した大きさ、形状
のセツティングテープ（１）が所定ピッチで多数配列さ
れるように貼り合わされて成る電子部品用接着キャリア
テープ（５）を作成する。The separator (2) is formed of a film that is easily peeled off from the setting chip. After cutting this tape-shaped material (3) to a predetermined width l (see Figure 2), the electronic components to be mounted are placed on the setting tape (1) of the cut tape-shaped body (4). A die was punched out to a size corresponding to the bottom surface, which will be the mounting surface, and a shape corresponding to the bottom surface of the electronic component was placed on the carrier tape (6) made of the separator (2) as shown in Figures 3 and 4. An adhesive carrier tape (5) for electronic components is prepared by laminating a large number of setting tapes (1) of different sizes and shapes so that they are arranged at a predetermined pitch.
本例では各セツティングテープ（１）はリング状に形成
され、且つ各セツティングテープ（１）の中央孔に対応
したキャリアテープ（６）の部分も同時に透孔（７）が
設けられる。また実装時に電子部品用接着キャリアテー
プ（５）を移送するためにキャリアテープ（６）の両側
に沿ってテープ送り用の孔（８）が設けられる。In this example, each setting tape (1) is formed into a ring shape, and the portion of the carrier tape (6) corresponding to the center hole of each setting tape (1) is also provided with a through hole (7). In addition, holes (8) for tape feeding are provided along both sides of the carrier tape (6) in order to transfer the adhesive carrier tape (5) for electronic components during mounting.
所謂剥離紙を兼ねるキャリアテープ（６）は例えば塩化
ビニル、酢酸ビニル、塩化ビニル−酢酸ビニル共重合体
、ポリエチレン、ポリエステル等よりなるフィルム、或
いは剥離処理した紙等を使用することができる。特にこ
のキャリアテープ（６）は予めカーボン等の導電性材を
混入せしめて導電性を賦与せしめるを可とし、例えば通
常の磁気テープに使用される導電性プラスチックフィル
ムにて構成することもできる。又、セツティングテープ
は１２０℃〜１３０℃以上の耐熱性を有するもので、ア
クリル系樹脂１合成ゴム系、その他耐熱性の粘着組成物
等による接着剤層で形成でき、又は市販の両面接着テー
プを使用できる。As the carrier tape (6) which also serves as a so-called release paper, for example, a film made of vinyl chloride, vinyl acetate, vinyl chloride-vinyl acetate copolymer, polyethylene, polyester, or release-treated paper can be used. In particular, this carrier tape (6) can be preliminarily mixed with a conductive material such as carbon to give it conductivity, and can also be made of, for example, a conductive plastic film used in ordinary magnetic tapes. In addition, the setting tape has heat resistance of 120°C to 130°C or higher, and can be formed from an adhesive layer of acrylic resin, synthetic rubber, or other heat-resistant adhesive composition, or a commercially available double-sided adhesive tape. can be used.
しかして、このように構成した電子部品用接着キャリア
テープ（５）の各セツティングテープ（１）上に夫々電
子部品例えば第５図に示すフラットパッケージ型ＩＣ（
９１を圧着固定しく第６図、第７図参照）これを第８図
に示すようにロール状に巻装する。Therefore, electronic components such as the flat package type IC (
91 is crimped and fixed (see FIGS. 6 and 7) and wound into a roll as shown in FIG.
このフラットパッケージ型１（ｊ９）を配線基板の所定
−に実装する場合には、第９図に示すようにフラットパ
ッケージ型ＩＣ（９）を圧着固定した接着キャリアテー
プ（５）を移送して、このＩＣ＋９１を底面にセツティ
ングテープ（１）が付着した状態でキャリアテープ（６
）より剥離して後、第１０図に示すように配線基板（１
０）の所定位置に配置し、底面のセツティングテープ（
１１を介してその位置に仮り固定する。When mounting this flat package type 1 (j9) on a predetermined position on a wiring board, as shown in Fig. 9, the adhesive carrier tape (5) on which the flat package type IC (9) is fixed by pressure is transferred, Place this IC+91 on the carrier tape (6) with the setting tape (1) attached to the bottom.
), as shown in FIG. 10, the wiring board (1
0) in the specified position, and attach the setting tape (
It is temporarily fixed in that position via 11.
このようにフラットパケージ型ＩＣ（９）が仮り固定さ
れるためにディスクリート部品（１１）との混載ができ
る。次いでこの配線基板（１０）に対して、半田デイツ
プ方式により半田付けを行う。Since the flat package type IC (9) is temporarily fixed in this way, it can be mounted together with the discrete component (11). Next, this wiring board (10) is soldered using a solder dip method.
なお、ＩＣ（９）をキャリアテープ（６）より剥離する
際に、例えばキャリアテープ（６）の透孔（７）を通じ
て下からＩＣ＋９）を押し上げてとり出すことが可能で
ある。Note that when peeling the IC (9) from the carrier tape (6), it is possible to take out the IC+9) by pushing it up from below through the through hole (7) of the carrier tape (6), for example.
第１１図は電子部品用接着キャリアテープの他の例であ
る。この電子部品用接着キャリアテープ（５）、は第１
２図に示す如き外部端子を直角に折曲導出したタイプの
ｒｃ（１２）を圧着固定する場合に通したもので、第３
図の構成に加えて外部端子を挿入する切り込み（１３）
をキャリアテープ（６）に設けて構成する。従って、こ
のＴＣ（１２）は第１３図に示すような状態で電子部品
用接着キャリアテープ（５）に圧着固定される。又、実
装に際しては第１４図に示すように電子部品用接着キャ
リアテープ（５）から剥離してディスクリート部品（１
１）と同方向より配線基板（１０）の所定位置に配し、
仮り固定する。FIG. 11 shows another example of an adhesive carrier tape for electronic components. This adhesive carrier tape (5) for electronic components is the first
This is the type of rc (12) that has an external terminal bent at right angles as shown in Figure 2 and is passed through when crimping and fixing it.
In addition to the configuration shown in the diagram, a notch for inserting an external terminal (13)
is provided on the carrier tape (6). Therefore, this TC (12) is crimped and fixed to the adhesive carrier tape for electronic components (5) in the state shown in FIG. In addition, when mounting, as shown in Fig. 14, the discrete component (1) is peeled off from the adhesive carrier tape (5) for electronic components.
Place it at a predetermined position on the wiring board (10) from the same direction as 1),
Temporarily fixed.
そして通常の半田デイツプ方式で半田付けする。Then solder using the normal solder dip method.
一方、半田付工程としてリフロ一方式を用いる場合には
、配線基板の両面に電子部品例えばフラットパッケージ
型ＩＣを仮り固定することによって、両面同時に半田リ
フローを施すことができる。On the other hand, when using a single reflow soldering process, by temporarily fixing electronic components such as flat package ICs to both sides of the wiring board, it is possible to perform solder reflow on both sides at the same time.
尚、上例では各セツティングテープ（１１をリング状に
形成したが第１５図に示すように単に四角形状に形成す
ることもできる。In the above example, each setting tape (11) is formed into a ring shape, but it may also be formed into a simple square shape as shown in FIG.
上述の電子部品用接着キャリアテープ（５）によれば、
電子部品（９）又は（１２）をキャリアテープ（５）に
保持するセツティングテープ（１）が実装時には配線基
板（１０）に対する仮り固定用に供されることにより、
電子部品（９）又は（１２）の配線基板への転着作業を
容易にすることができる。又、キャリアテープ（６）と
しては所謂セツティングテープ（１１のセパレータ（２
）を利用して構成されるために、この電子部品用接着キ
ャリアテ“−ブ（５）を無駄なく安価に提供できる。又
、キャリアテープ（６）を導電性にすれば電子部品（９
） （，１２）の静電破壊を防止することができ、電子
部品（９）（１２）が扱い易くなる。電子部品（９）（
１２）の配線基板（１０）への実装に際しては、両面接
着性のあるセツティングテープ（１１によって電子部品
（９）（１２）を仮り固定できるので、半田デイツプ方
式では例えばＩＣとディスクリート部品の同時混載と、
同時半田ディツプが可能となる。According to the above adhesive carrier tape for electronic components (5),
The setting tape (1) that holds the electronic component (9) or (12) on the carrier tape (5) is used for temporary fixing to the wiring board (10) during mounting.
The work of transferring the electronic component (9) or (12) to the wiring board can be facilitated. Further, as the carrier tape (6), a so-called setting tape (11 separators (2)
), this adhesive carrier tape (5) for electronic components can be provided at low cost without any waste.Also, if the carrier tape (6) is made conductive, it can be used for electronic components (9).
) (, 12) can be prevented from being damaged by electrostatic discharge, and the electronic components (9) and (12) become easier to handle. Electronic parts (9) (
When mounting 12) on the wiring board (10), the electronic components (9) and (12) can be temporarily fixed using the double-sided adhesive setting tape (11), so the solder dip method, for example, allows IC and discrete components to be mounted at the same time. Mixed loading and
Simultaneous Santa dip becomes possible.
従って実装工程が少なくなり、従来のような手半田工程
、マスキング工程がなくなるために実装の自動化が可能
となる。又半田リフロ一方式では両面の同時リフローが
可能となり、同様に半田工程が減少し製造費を安くする
ことができる。Therefore, the number of mounting steps is reduced, and the conventional manual soldering and masking steps are eliminated, making it possible to automate the mounting. In addition, the one-sided solder reflow method allows simultaneous reflow of both sides, which similarly reduces the number of soldering steps and reduces manufacturing costs.
尚、上例では電子部品としてＩＣを適用したがその他の
電子部品にも通用できる。In the above example, an IC is used as the electronic component, but other electronic components can also be used.
本発明によれば、電子部品の配線基板への実装が容易且
つ正確に行える。特に電子部品の配線基板上への仮り固
定ができるので、チップ部品とディスクリート部品の混
載が可能となり、半田工程が簡単に行える。従って電子
部品の配線基板への実装の自動化が可能となり、工程の
省力化が図れる。According to the present invention, electronic components can be easily and accurately mounted on a wiring board. In particular, since electronic components can be temporarily fixed onto a wiring board, chip components and discrete components can be mounted together, and the soldering process can be easily performed. Therefore, it is possible to automate the mounting of electronic components onto the wiring board, and labor saving in the process can be achieved.
第１図乃至第３図は本発明による電子部品用接着キャリ
アテープの製造工程図、第４図は第３図のＡ−Ａ線上の
断面図、第５図はフラットパッケージ型ｒｅの斜視図、
第６図乃至第１０図は電子部品用接着キャリアテープを
利用して電子部品を配線基板へ実装するための説明図、
第１１図は本発明の電子部品用接着キャリアテープの他
の例を示す要部の平面図、第１２図は適用されるＩＣの
斜視図、第１３図は接着キャリアテープにＩＣを固着し
た状態図、第１４図はＩＣｏを配線基板に配した状態図
、第１５図は本発明の電子部品用接着キャリアテープの
他の例を示す要部の平面図である。
（１）はセツティングテープ、（２）はセパレータ、（
５）は電子部品用接着キャリアテープ、（６）はキャリ
アテープ、（９１（１２）はＩＣ，（１０）は配線基板
、（１１）はディスクリート部品である。1 to 3 are manufacturing process diagrams of an adhesive carrier tape for electronic components according to the present invention, FIG. 4 is a sectional view taken along the line A-A in FIG. 3, and FIG. 5 is a perspective view of a flat package type re.
6 to 10 are explanatory diagrams for mounting electronic components onto a wiring board using an adhesive carrier tape for electronic components;
Fig. 11 is a plan view of the main parts showing another example of the adhesive carrier tape for electronic components of the present invention, Fig. 12 is a perspective view of an applied IC, and Fig. 13 is a state in which the IC is fixed to the adhesive carrier tape. 14 is a state diagram in which ICo is arranged on a wiring board, and FIG. 15 is a plan view of a main part showing another example of the adhesive carrier tape for electronic components of the present invention. (1) is setting tape, (2) is separator, (
5) is an adhesive carrier tape for electronic parts, (6) is a carrier tape, (91 (12) is an IC, (10) is a wiring board, and (11) is a discrete component.
Claims (1)
き電子部品の取付面となる底面に対応した大きさをもっ
て剥離性を有するキャリアテープ上に貼り合わされて成
る電子部品用接着キャリアテープ。 ２、底面を有する電子部品を配線基板に実装するに際し
、 両面接着剤からなるセッティングテープが実装すべき電
子部品の底面に対応した大きさをもって剥離性を有する
キャリアテープ上に貼り合わされて成る電子部品用接着
キャリアテープの該セッティングテープに前記電子部品
の底面を圧着固定する工程と、 一旦前記接着キャリアテープ上のセッティングテープに
固定された前記電子部品を、該電子部品の底面に前記セ
ッティングテープを貼り付けたまま前記キャリアテープ
より剥離し、前記配線基板の所定位置に転着固定する工
程と、前記電子部品を転着固定した配線基板を半田付け
する工程とを含む電子部品用接着キャリアテープによる
電子部品の実装方法。[Claims] 1. An adhesive carrier for electronic components comprising a setting tape made of double-sided adhesive bonded onto a removable carrier tape with a size corresponding to the bottom surface, which is the mounting surface of the electronic component to be mounted. tape. 2. An electronic component in which, when an electronic component having a bottom surface is mounted on a wiring board, a setting tape made of double-sided adhesive is pasted onto a removable carrier tape with a size corresponding to the bottom surface of the electronic component to be mounted. a step of crimping and fixing the bottom surface of the electronic component to the setting tape of the adhesive carrier tape; An electronic device using an adhesive carrier tape for electronic components, which includes a step of peeling off the carrier tape while still attached and transferring and fixing it to a predetermined position on the wiring board, and a step of soldering the wiring board to which the electronic component is transferred and fixed. How to mount parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61036965A JPS62193914A (en) | 1986-02-21 | 1986-02-21 | Adhesive carrier tape for electronic part and method of mounting electronic part by said adhesive carrier tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61036965A JPS62193914A (en) | 1986-02-21 | 1986-02-21 | Adhesive carrier tape for electronic part and method of mounting electronic part by said adhesive carrier tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62193914A true JPS62193914A (en) | 1987-08-26 |
Family
ID=12484445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61036965A Pending JPS62193914A (en) | 1986-02-21 | 1986-02-21 | Adhesive carrier tape for electronic part and method of mounting electronic part by said adhesive carrier tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62193914A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01228670A (en) * | 1988-03-08 | 1989-09-12 | Matsushita Electric Ind Co Ltd | Method for soldering coil |
| JPH01276695A (en) * | 1988-04-27 | 1989-11-07 | Pfu Ltd | Surface mounted-type electronic device and its taped body |
| JP2007335296A (en) * | 2006-06-16 | 2007-12-27 | Sony Chemical & Information Device Corp | Flexible flat cable with carrier tape and its manufacturing method |
-
1986
- 1986-02-21 JP JP61036965A patent/JPS62193914A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01228670A (en) * | 1988-03-08 | 1989-09-12 | Matsushita Electric Ind Co Ltd | Method for soldering coil |
| JPH01276695A (en) * | 1988-04-27 | 1989-11-07 | Pfu Ltd | Surface mounted-type electronic device and its taped body |
| JP2007335296A (en) * | 2006-06-16 | 2007-12-27 | Sony Chemical & Information Device Corp | Flexible flat cable with carrier tape and its manufacturing method |
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