JPS62192648U - - Google Patents
Info
- Publication number
- JPS62192648U JPS62192648U JP1986079682U JP7968286U JPS62192648U JP S62192648 U JPS62192648 U JP S62192648U JP 1986079682 U JP1986079682 U JP 1986079682U JP 7968286 U JP7968286 U JP 7968286U JP S62192648 U JPS62192648 U JP S62192648U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- bonding pad
- recess
- chip component
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986079682U JPS62192648U (US20030157025A1-20030821-C00018.png) | 1986-05-27 | 1986-05-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986079682U JPS62192648U (US20030157025A1-20030821-C00018.png) | 1986-05-27 | 1986-05-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62192648U true JPS62192648U (US20030157025A1-20030821-C00018.png) | 1987-12-08 |
Family
ID=30929776
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986079682U Pending JPS62192648U (US20030157025A1-20030821-C00018.png) | 1986-05-27 | 1986-05-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62192648U (US20030157025A1-20030821-C00018.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008130618A (ja) * | 2006-11-16 | 2008-06-05 | Murata Mfg Co Ltd | 多層配線基板 |
-
1986
- 1986-05-27 JP JP1986079682U patent/JPS62192648U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008130618A (ja) * | 2006-11-16 | 2008-06-05 | Murata Mfg Co Ltd | 多層配線基板 |