JPS62192632U - - Google Patents

Info

Publication number
JPS62192632U
JPS62192632U JP8146986U JP8146986U JPS62192632U JP S62192632 U JPS62192632 U JP S62192632U JP 8146986 U JP8146986 U JP 8146986U JP 8146986 U JP8146986 U JP 8146986U JP S62192632 U JPS62192632 U JP S62192632U
Authority
JP
Japan
Prior art keywords
resin
electronic component
electrode lead
exterior
resin body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8146986U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8146986U priority Critical patent/JPS62192632U/ja
Publication of JPS62192632U publication Critical patent/JPS62192632U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Details Of Resistors (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の断面図、第2図は
第1図の要部の拡大断面図、第3図は従来のチツ
プ状樹脂外装電子部品の断面図である。 1……電子部品の素子、2……電極リード、2
a……電極リード樹脂体埋設部、2b……第1の
角部、3……外装樹脂体、4……柔軟な樹脂。
FIG. 1 is a sectional view of an embodiment of the present invention, FIG. 2 is an enlarged sectional view of the main part of FIG. 1, and FIG. 3 is a sectional view of a conventional chip-shaped resin-clad electronic component. 1...Electronic component element, 2...Electrode lead, 2
a...Electrode lead resin body embedded portion, 2b...First corner, 3...Exterior resin body, 4...Flexible resin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電極リードを導出した電子部品素子を絶縁性樹
脂で外装し、前記電極リードを前記外装樹脂体の
外面に沿つて折り曲げてなる電子部品において、
前記電極リードの前記外装樹脂体に埋没されてい
る部分の接触界面に前記外装樹脂とは異なる柔軟
な樹脂層が介在されていることを特徴とするチツ
プ状樹脂外装電子部品。
An electronic component in which an electronic component element from which an electrode lead is led is sheathed with an insulating resin, and the electrode lead is bent along the outer surface of the sheathing resin body,
A chip-shaped resin-clad electronic component, characterized in that a flexible resin layer different from the exterior resin is interposed at a contact interface of a portion of the electrode lead that is embedded in the exterior resin body.
JP8146986U 1986-05-28 1986-05-28 Pending JPS62192632U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8146986U JPS62192632U (en) 1986-05-28 1986-05-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8146986U JPS62192632U (en) 1986-05-28 1986-05-28

Publications (1)

Publication Number Publication Date
JPS62192632U true JPS62192632U (en) 1987-12-08

Family

ID=30933236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8146986U Pending JPS62192632U (en) 1986-05-28 1986-05-28

Country Status (1)

Country Link
JP (1) JPS62192632U (en)

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