JPS62190343U - - Google Patents
Info
- Publication number
- JPS62190343U JPS62190343U JP1986079860U JP7986086U JPS62190343U JP S62190343 U JPS62190343 U JP S62190343U JP 1986079860 U JP1986079860 U JP 1986079860U JP 7986086 U JP7986086 U JP 7986086U JP S62190343 U JPS62190343 U JP S62190343U
- Authority
- JP
- Japan
- Prior art keywords
- capillary
- wire bonding
- tip surface
- view
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000011148 porous material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986079860U JPH0445241Y2 (fr) | 1986-05-26 | 1986-05-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986079860U JPH0445241Y2 (fr) | 1986-05-26 | 1986-05-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62190343U true JPS62190343U (fr) | 1987-12-03 |
| JPH0445241Y2 JPH0445241Y2 (fr) | 1992-10-23 |
Family
ID=30930127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986079860U Expired JPH0445241Y2 (fr) | 1986-05-26 | 1986-05-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0445241Y2 (fr) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD771168S1 (en) | 2014-10-31 | 2016-11-08 | Coorstek, Inc. | Wire bonding ceramic capillary |
| USD797172S1 (en) | 2015-02-03 | 2017-09-12 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
| USD797171S1 (en) | 2015-02-03 | 2017-09-12 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
| USD797826S1 (en) | 2015-02-03 | 2017-09-19 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
| CN108389806A (zh) * | 2018-01-22 | 2018-08-10 | 潮州三环（集团）股份有限公司 | 一种提高引线键合强度的劈刀 |
| CN109332901A (zh) * | 2018-09-14 | 2019-02-15 | 深圳市商德先进陶瓷股份有限公司 | 陶瓷劈刀及其制作方法和应用 |
| USD868123S1 (en) | 2016-12-20 | 2019-11-26 | Coorstek, Inc. | Wire bonding wedge tool |
| JP2022114619A (ja) * | 2021-01-27 | 2022-08-08 | 三菱電機株式会社 | ワイヤボンディング装置および半導体装置の製造方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014116334A (ja) * | 2012-12-06 | 2014-06-26 | Mitsubishi Electric Corp | ウェッジボンディング用ツール、及びウェッジボンディング方法 |
-
1986
- 1986-05-26 JP JP1986079860U patent/JPH0445241Y2/ja not_active Expired
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD771168S1 (en) | 2014-10-31 | 2016-11-08 | Coorstek, Inc. | Wire bonding ceramic capillary |
| USD797172S1 (en) | 2015-02-03 | 2017-09-12 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
| USD797171S1 (en) | 2015-02-03 | 2017-09-12 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
| USD797826S1 (en) | 2015-02-03 | 2017-09-19 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
| USD821468S1 (en) | 2015-02-03 | 2018-06-26 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
| USD824970S1 (en) | 2015-02-03 | 2018-08-07 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
| USD824969S1 (en) | 2015-02-03 | 2018-08-07 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
| USD868123S1 (en) | 2016-12-20 | 2019-11-26 | Coorstek, Inc. | Wire bonding wedge tool |
| CN108389806A (zh) * | 2018-01-22 | 2018-08-10 | 潮州三环（集团）股份有限公司 | 一种提高引线键合强度的劈刀 |
| CN109332901A (zh) * | 2018-09-14 | 2019-02-15 | 深圳市商德先进陶瓷股份有限公司 | 陶瓷劈刀及其制作方法和应用 |
| CN109332901B (zh) * | 2018-09-14 | 2021-01-08 | 深圳市商德先进陶瓷股份有限公司 | 陶瓷劈刀及其制作方法和应用 |
| JP2022114619A (ja) * | 2021-01-27 | 2022-08-08 | 三菱電機株式会社 | ワイヤボンディング装置および半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0445241Y2 (fr) | 1992-10-23 |