JPS62189154A - Manufacture of metallic-foil lined laminated board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention]

[Technical Field] The present invention relates to continuous forming of metal foil-clad laminates. [Background technology 1] A laminate obtained by sandwiching a predetermined number of resin-impregnated base materials between endless belts and continuously heating and pressing them is better than a laminate obtained by stacking a large number of resin-impregnated base materials between hot platens and press-forming them. However, due to equipment constraints in this continuous molding, it is essential to harden the impregnated resin quickly, so for example, molding is performed by applying pressure between hot platens. It is necessary to increase the curing speed by about 10 to 50 times compared to the case where In this case, if a fast-curing resin is used, the non-impregnated part of the resin-impregnated base material (1) remains as it is, causing scratches, resulting in poor appearance and poor transparency, as well as poor heat resistance and moisture resistance. As a result, the reliability of the printed wiring board was low and it could not be used as a side bottom. ``Object of the Invention'' The present invention was made to solve the above problems, and the problems with the purpose are continuous. The second objective is to produce a metal foil-clad laminate that can be applied with standard heating and pressure forming, has excellent formability, excellent dimensional stability and moisture resistance, and is free of scratches. [Disclosure 1 of the present invention] The method for producing metal foil-clad laminates is to stack a predetermined number of resin-impregnated base materials with a thickness of 11 and an unimpregnated portion of resin of 2% or less of the total area, stack metal foil on the outermost layer, and sandwich it between endless belts. The base material used in the present invention may be paper, cloth made of organic fibers, nonwoven fabric, glass, asbestos, etc. alone or in various forms. Blended fabrics and non-woven fabrics can be used. Preferably, glass fabrics with a thickness of 0.10~0.30111111% and a weight of 100~300g/m" are used. Glass fabrics other than this specific thickness and weight are impregnated with resin. This base material has poor properties and contains many air bubbles.This base material is dipped in a resin varnish to impregnate it with resin, and then dried to form a resin-impregnated base material.Epoxy resin is used as the resin for the resin varnish. , thermosetting resins such as polyimide resins or modified products thereof, phenolic resins, unsaturated polyester resins, etc. can be used. In this case, the resin is impregnated into the base material under reduced pressure by reducing the pressure in the varnish tank, or in the varnish tank. Pressure is applied by passing the base material between two rolls placed on the floor, and then the pressure is removed. In the case of pressurization, for example, there are three rolls, and the pressure is 1.0 kg/
Impregnation is carried out under cm2. The amount of resin impregnated is 35~ in terms of solid content.
It is 65% by weight. By carrying out the coating under reduced pressure or increased pressure, the entrainment of air bubbles into the base material in the varnish bath can be reduced. Of course, the impregnation may be carried out under normal pressure. After impregnating the base material with resin in this way,
When dried at 0°C, the thickness is 11 or less, preferably 0.08 to 0.
, 3nun, a resin-impregnated base material is obtained in which the unimpregnated area of the resin is 2% or less, preferably 0.3%, of the total area, and the number of bubbles is 500 or less. After this, one or more resin-impregnated base materials are stacked, a metal foil or film is placed on the upper and/or lower surfaces, and the material is sandwiched between endless belts running at the bottom, for example, 10-30 kg/cm2. .150
A metal foil-clad laminate is obtained by heating and pressing at ~170'C and continuous molding using a so-called double belt press. Metal foils include copper foil, aluminum foil, brass foil, nickel foil, stainless steel T14 foil, iron foil, etc.
An adhesive layer may be formed on one side to enhance adhesion. Next, the present invention will be described in detail, but the present invention is not limited to the following examples. (Example 1) Thickness 0.18mm, width 1050mm, weight 1200g/m
The glass cloth of No. 2 was immersed in a varnish bath containing an epoxy resin containing a fast curing agent with a resin content of 70% by weight. in this case,
Impregnated for 3 minutes under reduced pressure of 50mmt1g and dried Ia! The amount of resin is 45% by weight, and the unimpregnated area of resin is 0.2% by weight.
A resin-impregnated base material with a resin impregnation of 5% and a cell count of 450 was obtained. Two sheets of this resin-impregnated base material were stacked one on top of the other, and copper foil with a thickness of 0.035 mm was placed on both the top and bottom surfaces, and this was sandwiched between endless belts and subjected to continuous heating and pressure molding. The pressure was 10 kg/cm2, the temperature was 180°C, and the heating time was 3 minutes. Thereafter, a post cure was performed at 170° C. for 30 minutes to obtain a double-sided copper foil-clad laminate having a thickness of 0.4 [11111]. The presence or absence of scratches on this laminate, solder heat resistance, solder heat resistance after boiling, insulation resistance after boiling, dimensional change rate after etching, and plate thickness accuracy were measured. The results are shown in Table 1. Next, a circuit is formed on the upper and lower surfaces of the laminate, and the thickness is 0.2111 mm.
A 4-layer circuit wiring board was obtained by heating and press-molding three ordinary resin-impregnated base materials on the top and bottom, and placing a 0.2 mm thick single-sided copper foil-clad laminate on the outside. The pressurizing conditions were a temperature of 170°C, a time of 60 minutes, and a pressure of 30 kg/cm2. After boiling this wiring board, the solder heat resistance, plating penetration property, inner layer material dimensional change rate, and board thickness accuracy were measured. Results. are shown in Table 2. (Comparative Example 1) A copper foil-clad laminate was obtained in the same manner as in Example 1 except that the epoxy resin was impregnated under normal pressure.The unimpregnated area was 2.5%. This laminate was subjected to the same measurements as in Example 1. The results are shown in Table # & 1. Next, a 4-layer circuit wiring board was obtained from this laminate in the same manner as in Example 1. This wiring board The same measurements as in Example 1 were also carried out.The results are shown in Table 2. (Comparative Example 2) Copper A foil-clad laminate was obtained.The unimpregnated area was 3%.The same measurements as in Example 1 were performed on this laminate.The results are shown in Table 1.Next, Examples were prepared from this laminate. A four-layer circuit wiring board was obtained in the same manner as in Example 1. This wiring board was also subjected to the same measurements as in Example 1. The results are shown in Table $2. Table 1 Characteristics of Laminated Board Examples Comparative Example Faint None Yes None Soldering heat resistance (minutes) 5 or more 0.5 5 or more Soldering heat resistance after boiling (hours) 4 or more 2 1 4 or more Insulation resistance after boiling (Ω) 3X10127X10IO3X101
2 Dimensional change rate after etching (%) 0.005 0.005 0.0
12 Plate thickness accuracy (mm) 0.01.5 0.01
．． 5 0,070 Example Comparative Example Solder heat resistance after boiling (hours) 4 or more 34 Plating solution penetration (μm) 50-70 150-300
50-70 Inner layer material dimensional change rate (%) 0,020 0.020 0
．． 035...1-11 vice, 1. Q Q-, 10
0,20

【Measuring method】

After boiling, the beef was boiled for a predetermined period of time after thermal etching on the entire mouth side, and then immersed in solder at 260° C. for 30 seconds to measure the time without blistering or peeling. Dimensional change rate The larger of vertical and horizontal 3σn1 is shown. The plate thickness accuracy is shown in the range of 3σnl. From the results in the tJS1 table, it can be seen that the examples of the present invention exhibit excellent properties such as no scratching even though they are molded at low pressure. [Effect of the invention] In the present invention, the thickness is 1. A predetermined number of resin-impregnated base materials with a size of 2 mm or less and an unimpregnated portion of the resin of 2% or less of the total area are stacked, and a metal foil is layered on the outermost layer, which is sandwiched between endless belts and continuously heated and pressed. Since it is molded, it can be molded continuously at low pressure, resulting in high productivity.Moreover, resin flow is small and thickness accuracy can be improved.Furthermore, it has excellent moldability with no voids remaining, and has excellent dimensional stability and moisture resistance. It is possible to produce metal foil-clad laminates with excellent quality and no blurring. Agent Patent Attorney Ishi 1) Ai Seven Procedural Amendments (Voluntary) August 8, 1985 1 1. Indication of the case 1985 Patent Application No. 3mm350 2. Name of the invention Method for manufacturing metal foil-clad laminates 3 , Relationship with the case of the person making the amendment Patent applicant address 1048 Kadoma, Kadoma City, Osaka Prefecture Name (5B
3) Matsushita Electric Works Co., Ltd. Representative: Sadao Fujii 4, Agent postal code: 530 Address: 1-12-17-5 Umeda, Kita-ku, Osaka City Date of amendment order: 6 Number of inventions increased by amendment: None 1) Specification No. 4
Insert "1 or less" next to "0.3%" on the 10th line of the page. 2) Next to “less than 500” on page 4, line 10 of the above [
, the unimpregnated area is less than 5% in terms of cross-sectional area]. 3) 1450 items on page 5, line 9], followed by ``,
We will insert 1.4% of the unimpregnated section of the cross section. 4) Insert "after secondary forming" in front of "Inner layer material dimensional change rate" on page 6, line 6 of the same page. 5) Delete "The unimpregnated area was 2.5%" in the 10th to 11th lines of page 6 of the above and read ``The unimpregnated area of the resin was 1.0%, and the number of bubbles was 1800.'' The unimpregnated part of the cross section is 6.
It was 7%. ” will be inserted. 6) In Table 2 on page 8 of the same, the solder heat resistance (time) after boiling of Comparative Example 1 is "3", which has been corrected to [2].

Claims (2)

[Claims] (1) A predetermined number of resin-impregnated base materials with a thickness of 1 mm or less and an unimpregnated portion of resin of 2% or less of the total area are stacked on top of each other and metal foil is layered on the outermost layer, which is then sandwiched between endless belts to continuously produce A method for manufacturing a metal foil-clad laminate, which is characterized by heating and pressure forming. (2) A resin-impregnated base material having a thickness of 0.08 to 0.3 mm and having a resin-unimpregnated portion of 0.3% or less of the total area is used. A method for manufacturing a metal foil-clad laminate.