JPS62188164U - - Google Patents
Info
- Publication number
- JPS62188164U JPS62188164U JP1986077410U JP7741086U JPS62188164U JP S62188164 U JPS62188164 U JP S62188164U JP 1986077410 U JP1986077410 U JP 1986077410U JP 7741086 U JP7741086 U JP 7741086U JP S62188164 U JPS62188164 U JP S62188164U
- Authority
- JP
- Japan
- Prior art keywords
- light
- resin
- emitting element
- receiving element
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986077410U JPS62188164U (enExample) | 1986-05-20 | 1986-05-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986077410U JPS62188164U (enExample) | 1986-05-20 | 1986-05-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62188164U true JPS62188164U (enExample) | 1987-11-30 |
Family
ID=30925390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986077410U Pending JPS62188164U (enExample) | 1986-05-20 | 1986-05-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62188164U (enExample) |
-
1986
- 1986-05-20 JP JP1986077410U patent/JPS62188164U/ja active Pending