JPS62187050A - Manufacture of thermal head - Google Patents
Manufacture of thermal headInfo
- Publication number
- JPS62187050A JPS62187050A JP2971986A JP2971986A JPS62187050A JP S62187050 A JPS62187050 A JP S62187050A JP 2971986 A JP2971986 A JP 2971986A JP 2971986 A JP2971986 A JP 2971986A JP S62187050 A JPS62187050 A JP S62187050A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- heating element
- resistance heating
- thermal head
- glazed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title description 3
- 238000010438 heat treatment Methods 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 5
- 238000005520 cutting process Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 abstract description 48
- 239000011241 protective layer Substances 0.000 abstract description 11
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、高速で烏品質の印字が得られるサーマルヘッ
ドの製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a thermal head that can produce high-quality printing at high speed.
［従来の技術］
第２図は、例えば特開昭５６−１５９１７６号公報に開
示されている従来のサーマルヘッドの一例を示す構成説
明図である。[Prior Art] FIG. 2 is a configuration explanatory diagram showing an example of a conventional thermal head disclosed in, for example, Japanese Unexamined Patent Publication No. 56-159176.
第２図において、絶縁性を有する基板１上には山形のグ
レーズ層２が形成され、グレーズ層２を覆うように抵抗
発熱体層３が形成されている。この抵抗発熱体層３の両
側には、抵抗発熱体層３の頂面３Ａを挾むようにして電
極１１１４が形成されている。そして、これら抵抗発熱
体ＪＩ３および電極層４を覆うようにしてＴｌ４ｊＩ！
耗性を０する保１１１５が形成されている。In FIG. 2, a chevron-shaped glaze layer 2 is formed on an insulating substrate 1, and a resistive heating element layer 3 is formed so as to cover the glaze layer 2. Electrodes 1114 are formed on both sides of the resistance heating element layer 3 so as to sandwich the top surface 3A of the resistance heating element layer 3. Then, Tl4jI! covers the resistance heating element JI3 and the electrode layer 4!
A retainer 1115 that reduces wear resistance to 0 is formed.
このような構成において、対向する電極４間に電圧を印
加することによりその間の抵抗発熱体層３に電流が流れ
て発熱する。このとき、例えば図示しない感熱紙が保護
層５に押圧されることにより熱が保ＩＷ！！５を介して
感熱紙に伝導され、感熱発色による印字が行われる。ま
た、図示しない熱転写インクリボンが記録紙に巾ね合わ
された状態で保護層５に押圧されることにより熱が保護
Ｒ５を介して熱転写インクリボンに伝導され、熱転写イ
ンクが溶けて記録紙に転写されることにより印字が行わ
れる。In such a configuration, by applying a voltage between the opposing electrodes 4, a current flows through the resistance heating element layer 3 between them, thereby generating heat. At this time, heat is retained by pressing thermal paper (not shown) against the protective layer 5, for example. ! The light is conducted to the thermal paper through the wire 5, and printing is performed by thermal coloring. Further, when a thermal transfer ink ribbon (not shown) is pressed against the protective layer 5 while being stretched across the recording paper, heat is conducted to the thermal transfer ink ribbon via the protection R5, and the thermal transfer ink is melted and transferred to the recording paper. Printing is performed by
［１明が解決しようとする問題点］
しかし、このような従来の構成によれば、ドツトの発熱
部（抵抗発熱体Ｈ３の頂面３Ａ）が電極層４の厚さ分（
例えば２μｍ１度）窪んでいること力日う感熱紙や熱転
写インクリボンと保護層５との密着性が悪くなり、感熱
紙や熱転写インクリボンへの熱の伝導効率が低下して高
速印字や高い印字品質が得にくいという問題がある。[Problems to be Solved by 1 Mei] However, according to such a conventional configuration, the heating portion of the dot (the top surface 3A of the resistance heating element H3) has a thickness equal to the thickness of the electrode layer 4 (
For example, if there is a dent (2 μm 1 degree), the adhesion between the thermal paper or thermal transfer ink ribbon and the protective layer 5 will deteriorate, and the efficiency of heat conduction to the thermal paper or thermal transfer ink ribbon will decrease, resulting in high-speed printing or high-quality printing. The problem is that quality is difficult to obtain.
本発明は、このような点に着目してなされたものであり
、その目的は、高速で高品質の印字が得られるサーマル
ヘッドの特進方法を提供することにある。The present invention has been made with attention to these points, and its purpose is to provide a method for specializing a thermal head that allows high-speed, high-quality printing to be obtained.
［問題点を解決するための手段］
このような目的を達成する本発明は、絶縁性を有するり
板上に形成された山形のグレーズ層を覆うように電極層
を形成する第１の工程と、電極層が形成されたグレーズ
層の頂面近傍をグレーズ層の一部が露出するように切除
する第２の工程と、電極！ｍおよび露出したグレーズ層
を覆うように抵抗発熱体層を形成する第３の工程と、抵
抗発熱体層を覆うように耐摩耗性を有する保護層を形成
するｉｎ４の工程とを含むことを特徴とする。[Means for Solving the Problems] The present invention that achieves the above object includes a first step of forming an electrode layer so as to cover a chevron-shaped glaze layer formed on an insulating plate. , a second step of cutting off the vicinity of the top surface of the glaze layer on which the electrode layer is formed so that a part of the glaze layer is exposed, and the electrode! A third step of forming a resistive heating element layer so as to cover the resistive heating element layer and the exposed glaze layer, and a fourth step of forming a protective layer having wear resistance so as to cover the resistive heating element layer. shall be.
［実施例］ 以下、図面を用いて本発明の実施例を詳細に説明する。[Example] Embodiments of the present invention will be described in detail below with reference to the drawings.
第１図は本発明の一実施例を示す工程説明図であり、第
２図と同一部分には同一符号をつけている。FIG. 1 is a process explanatory diagram showing an embodiment of the present invention, and the same parts as in FIG. 2 are given the same reference numerals.
まず、（ａ）に示す第１工程で、グレーズ層２を覆うよ
うに電極層４を形成する。次に、（ｂ）に示す第２工程
で、電極層４が形成されたグレーズ層２の頂面近傍をグ
レーズ層２の一部が露出するように基板１とほぼ平行に
切除する。これにより、グレーズ１１２の頂面はほぼ平
坦面として形成されることになる。綺いて、（Ｃ）に示
ず第３工程で、電極層４および露出したグレーズ層２を
覆うように抵抗発熱体層３を形成する。そしてさらに、
（ｄ）に示す第４工程で、抵抗発熱体１１３を覆うよう
に保１１１！！５を形成する。First, in a first step shown in (a), the electrode layer 4 is formed so as to cover the glaze layer 2. Next, in a second step shown in (b), the vicinity of the top surface of the glaze layer 2 on which the electrode layer 4 is formed is cut out substantially parallel to the substrate 1 so that a part of the glaze layer 2 is exposed. As a result, the top surface of the glaze 112 is formed as a substantially flat surface. Finally, in a third step (not shown in (C)), a resistive heating element layer 3 is formed so as to cover the electrode layer 4 and the exposed glaze layer 2. And furthermore,
In the fourth step shown in (d), hold 111 so as to cover the resistance heating element 113! ! form 5.
このようにして構成されるサーマルヘッドの頂面には第
２図に示す従来のサーマルヘッドのようなＷ１橿層４の
厚さによる窪みはなくなり、はぼ平坦な面が形成される
ことになる。The top surface of the thermal head constructed in this manner does not have a depression due to the thickness of the W1 layer 4 as in the conventional thermal head shown in FIG. 2, and a substantially flat surface is formed. .
従って、感熱紙ヤ熱転写インクリボンと保護層５との密
着性は高くなって抵抗発熱体ＷＩ３で発生した熱は保護
層５を介して効率よく感熱紙や熱転写インクリボンに伝
導されることになり、従来のり°−マルヘッドに比べて
高速印字や高い印字品質を得ることができる。Therefore, the adhesion between the thermal transfer ink ribbon of the thermal paper and the protective layer 5 becomes high, and the heat generated by the resistance heating element WI3 is efficiently conducted to the thermal paper or the thermal transfer ink ribbon via the protective layer 5. , it is possible to obtain high-speed printing and high printing quality compared to conventional paper heads.
なお、必要に応じて、グレーズＩ２と抵抗発熱体層３と
の間にグレーズ層２から抵抗発熱体層３に酸素やアルカ
リ成分などが侵入するのを防止するための５ｔＯ２など
の阻止層を設けてもよいし、抵抗発熱体１１３と保１１
Ｆｆ５との１〜にも同様な阻止層を設けるようにしても
よい。このような阻止層を陵けることにより、抵抗発熱
体１Ｉ１３の安定化が図れ、長、ＩＰ＃のサーマルヘッ
ドが実現できる。Note that, if necessary, a blocking layer such as 5tO2 is provided between the glaze I2 and the resistive heating element layer 3 to prevent oxygen, alkaline components, etc. from entering the resistive heating element layer 3 from the glaze layer 2. Alternatively, the resistance heating element 113 and the
A similar blocking layer may be provided for Ff5 and Ff5. By extending such a blocking layer, the resistance heating element 1I13 can be stabilized, and a long IP# thermal head can be realized.
［発明の効１］
以上説明したように、本発明によれば、高速で高品質の
印字が得られるサーマルヘッドの製造方法が実現でき、
実用上の効果は大ぎい。[Effect 1 of the Invention] As explained above, according to the present invention, a method for manufacturing a thermal head that can obtain high-speed and high-quality printing can be realized.
The practical effects are great.
第１図は本発明の一実施例を示す工程説明図、第２図は
従来のサーマルヘッドの一例を示す構成説明図である。
１・・・基板、２・・・グレーズ層、３・・・抵抗発熱
体層、４・・・Ｗ１電極、５・・・保護層。
寸 −寸 −勺寸 −FIG. 1 is a process explanatory diagram showing an embodiment of the present invention, and FIG. 2 is a configuration explanatory diagram showing an example of a conventional thermal head. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Glaze layer, 3... Resistance heating element layer, 4... W1 electrode, 5... Protective layer. Dimension − Dimension − 勺 Dimension −
Claims (1)
を覆うように電極層を形成する第１の工程と、電極層が
形成されたグレーズ層の頂面近傍をグレーズソ層の一部
が露出するように切除する第２の工程と、電極層および
露出したグレーズ層を覆うように抵抗発熱体層を形成す
る第３の工程と、抵抗発熱体層を覆うように耐摩耗性を
有する保護層を形成する第４の工程とを含むサーマルヘ
ッドの製造方法。A first step of forming an electrode layer so as to cover a chevron-shaped glaze layer formed on an insulating substrate, and a part of the glaze layer is exposed near the top surface of the glaze layer on which the electrode layer is formed. a second step of cutting the resistive heating element layer to cover the electrode layer and the exposed glaze layer; and a third step of forming a resistive heating element layer to cover the resistive heating element layer. and a fourth step of forming a thermal head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2971986A JPS62187050A (en) | 1986-02-13 | 1986-02-13 | Manufacture of thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2971986A JPS62187050A (en) | 1986-02-13 | 1986-02-13 | Manufacture of thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62187050A true JPS62187050A (en) | 1987-08-15 |
Family
ID=12283915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2971986A Pending JPS62187050A (en) | 1986-02-13 | 1986-02-13 | Manufacture of thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62187050A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01161888A (en) * | 1987-12-18 | 1989-06-26 | Cmk Corp | Printed wiring board |
| JPH022026A (en) * | 1988-06-13 | 1990-01-08 | Hitachi Ltd | Thermal recording head and manufacture thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5511850A (en) * | 1978-07-11 | 1980-01-28 | Mitsubishi Electric Corp | Thermal head |
-
1986
- 1986-02-13 JP JP2971986A patent/JPS62187050A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5511850A (en) * | 1978-07-11 | 1980-01-28 | Mitsubishi Electric Corp | Thermal head |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01161888A (en) * | 1987-12-18 | 1989-06-26 | Cmk Corp | Printed wiring board |
| JPH022026A (en) * | 1988-06-13 | 1990-01-08 | Hitachi Ltd | Thermal recording head and manufacture thereof |
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