JPS62186512A - Metallized film capacitor - Google Patents
Metallized film capacitorInfo
- Publication number
- JPS62186512A JPS62186512A JP2811286A JP2811286A JPS62186512A JP S62186512 A JPS62186512 A JP S62186512A JP 2811286 A JP2811286 A JP 2811286A JP 2811286 A JP2811286 A JP 2811286A JP S62186512 A JPS62186512 A JP S62186512A
- Authority
- JP
- Japan
- Prior art keywords
- film
- metallized film
- film capacitor
- capacitor
- resins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims description 23
- 239000011104 metalized film Substances 0.000 title claims description 13
- 239000010408 film Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 11
- 238000003851 corona treatment Methods 0.000 description 8
- 239000011229 interlayer Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 208000028659 discharge Diseases 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001227 electron beam curing Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000004200 microcrystalline wax Substances 0.000 description 1
- 235000019808 microcrystalline wax Nutrition 0.000 description 1
- 239000002362 mulch Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/14—Organic dielectrics
- H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は金属化フィルムコンデンサに関し、特にAC1
50V以上で用いられる電気機器用の金属化フィルムコ
ンデンサの改良に関する。DETAILED DESCRIPTION OF THE INVENTION FIELD OF INDUSTRIAL APPLICATION The present invention relates to metallized film capacitors, particularly AC1
This invention relates to improvements in metallized film capacitors for electrical equipment used at 50V or higher.
従来の技術
従来より、人C150v以上で用いられる電気機器用コ
ンデ/すには部分放電による誘電体の劣化や金属薄膜電
極の劣化の問題がある。この金属化フィルムコンデンサ
の部分放電を抑えるために、フィルム層間を接着する方
法が種々提案されてい2べ−7・
る。その一つに金属化処理の下地としてフィルムをコロ
ナ放電処理するだけでたく、金属化面と重ねられ接する
フィルム表面をもコロナ放電処理し、加熱処理して層間
接着を付与する方法がある。その他にフィルム表面にの
りの役目をする物質を塗布したシ、ラミネートしたりす
る方法、あるいは溶剤、界面活性剤などを素子含浸する
方法がある。BACKGROUND OF THE INVENTION Conventionally, air conditioners for electrical equipment used at a voltage of 150 V or more have had the problem of deterioration of dielectric materials and deterioration of metal thin film electrodes due to partial discharge. In order to suppress partial discharge in metallized film capacitors, various methods of bonding film layers have been proposed. One method is to not only subject the film to corona discharge treatment as a base for metallization treatment, but also apply corona discharge treatment to the surface of the film that overlaps and contacts the metallized surface, followed by heat treatment to provide interlayer adhesion. Other methods include coating or laminating the film surface with a substance that acts as a glue, or impregnating the element with a solvent, surfactant, etc.
発明が解決しようとする問題へ
しかるに、上記コンデンサを種々研究したところ、特に
非常に長時間課電後、特性劣化が生じることがわかって
きた。Problems to be Solved by the Invention However, as a result of various studies on the above-mentioned capacitors, it has been found that their characteristics deteriorate, especially after being energized for a very long time.
問題点を解決するための手段
本発明は金属化フィルムコンデンサ素子のフィルム層間
接着強度を201ff幅換算で5グラム以上とし、この
金属化フィルムコンデンサ素子を硬度(ショア−D)が
17以上の固定外装材で外装してなるものである。Means for Solving the Problems The present invention provides a metallized film capacitor element with a film interlayer adhesion strength of 5 grams or more when converted to a 201ff width, and a fixed exterior having a hardness (Shore-D) of 17 or more. The exterior is made of wood.
作用
上記構成において、フィルム層間強度が6グラムより小
さいと、冷熱サイクル等のストレスによ3 N−ノ
シコンダンサ素子中の層間のはがれが起き、ボイド放電
の原因となるので好ましくない。また層間接着強度は可
能な限り大きい方が好ましい。さらに外装材の硬度(シ
ョア−D)が17以上であると非常に長時間後の特性(
絶縁抵抗と容量減少)を安定化することができる。Effects In the above configuration, if the interlayer strength of the film is less than 6 grams, it is not preferable because stress such as heating and cooling cycles will cause interlayer peeling in the 3N-conductor element, causing void discharge. Further, it is preferable that the interlayer adhesive strength is as large as possible. Furthermore, if the hardness (Shore-D) of the exterior material is 17 or more, the properties after a very long time (
Insulation resistance and capacitance reduction) can be stabilized.
なお電極には、Znやムl、 Ni、 Ni−0r、
Go。Note that the electrodes include Zn, mulch, Ni, Ni-0r,
Go.
Cu、 Mo、 Ti などが用いられ、特にZnが
有効である。Cu, Mo, Ti, etc. are used, and Zn is particularly effective.
固体外装材としては、ウレタン系樹脂、エポキシ系樹脂
、ジアリルフタレート系樹脂、不飽和ポリエステル系樹
脂、グアナミン系樹脂、フェノール系樹脂、尿素系樹脂
、メラミン系樹脂、アクリル系樹脂、シリコーン系樹脂
、熱硬化ポリイミド樹脂、パラフィン系ワックス、マイ
クロクリスタリン系ワックス、ポリエチレン系ワックス
、その他各種合成ワックス等を、注型、含浸、ディップ
。Solid exterior materials include urethane resins, epoxy resins, diallyl phthalate resins, unsaturated polyester resins, guanamine resins, phenolic resins, urea resins, melamine resins, acrylic resins, silicone resins, and thermal resins. Casting, impregnating, and dipping with hardened polyimide resin, paraffin wax, microcrystalline wax, polyethylene wax, and various other synthetic waxes.
粉体コーティング等の手法で被覆し、熱硬化。Coat using methods such as powder coating and heat curing.
UV硬化、EB硬化などの手法で硬化し外装とする。It is cured using methods such as UV curing and EB curing to form the exterior.
1だ1層間接着性を付与する方法としては、金属化フィ
ルムコンデンサ素子の金属化面と重ねられ接するフィル
ム表面をもコロナ放電処理する方法やフィルム表面に比
較的低融点の物質をラミネートしたり活面活性剤のよう
なものを付着させる方法、接着性を付与する液体(溶剤
、界面活性剤など)をコンデンサ素子中に含浸する方法
ガどが挙げられる。Methods for imparting single-layer adhesion include corona discharge treatment of the film surface that overlaps and contacts the metallized surface of the metallized film capacitor element, and methods that include laminating or activating a substance with a relatively low melting point on the film surface. Examples include a method of attaching something such as a surfactant, and a method of impregnating a liquid (solvent, surfactant, etc.) that imparts adhesiveness into the capacitor element.
まだ、フィルム層間接着強度の測定法は、1ずコンデン
サを分解し、コンデンサ素子を取り出17てフィルムを
20MM幅に切り出し、第6図のように片方11を固定
し、他方12を引くことによりバネばかり等で測定する
3、接着強度は、巻芯近傍の方が在外部分より大きくな
る場合があるが、この様な場合は在外寄りの値(すなわ
ち在外より100ターンの間の部分で平均値)をとるよ
うにする。However, the method for measuring the adhesive strength between film layers is to first disassemble the capacitor, take out the capacitor element 17, cut the film into a 20 mm width, fix one side 11, and pull the other side 12 as shown in Figure 6. Measure with a spring balance, etc. 3. The adhesive strength may be greater near the core than in the overseas part, but in such cases, the value closer to the overseas part (i.e., the average value for the part 100 turns from the overseas part) ).
実施例
以下、本発明の実施例について添付回向を謬照して説明
する。EXAMPLES Hereinafter, examples of the present invention will be described with reference to the attached notes.
第1図において、1は厚さ6μmで幅が80闘6ベー/
で両面をコロナ放電処理したポリプロピレンフィルム(
東し社;製品名YK−41)の片面にZnを真空蒸着し
て主電極部2aが薄く(20〜3゜Ω/口)、メタリコ
ン接触部2bが厚く(3〜4Ω10 )となるようにし
た。なお、3はコロナ放電処理部、4は金属蒸着下地コ
ロナ放電処理部である。この1対の金属化フィルムを巻
き取シ、コンデンサ素子(60μF)とし、両端面に、
Znのメタリコンを施し、真空槽中で115℃、16
Hの熱処理をおこなった。このあと、リード線を溶接し
、適当なケース(アルミケースやポリエステル樹脂ケー
ス)に格納し、各種外装材で外装して金属化フィルムコ
ンデンサを作った。In Figure 1, 1 is a polypropylene film with a thickness of 6 μm and a width of 80 mm to 6 mm and which has been treated with corona discharge on both sides.
Toshisha; product name YK-41) Zn was vacuum-deposited on one side of the electrode so that the main electrode part 2a was thin (20 to 3 Ω/mouth) and the metal contact part 2b was thick (3 to 4 Ω 10 ). did. Note that 3 is a corona discharge treatment section, and 4 is a metal vapor deposition base corona discharge treatment section. This pair of metallized films was wound up and used as a capacitor element (60 μF), with
Zn metallicon was applied and heated at 115℃ for 16℃ in a vacuum chamber.
H heat treatment was performed. After this, we welded the lead wires, stored them in a suitable case (aluminum case or polyester resin case), and covered them with various exterior materials to create a metallized film capacitor.
上記第1図に示す構造において、コロナ放電処理強度を
変えて層間接着強度を変え、コンデンサを試作したとき
の特性を第2図に示す。これは、−30℃〜100℃の
ヒートサイクルを100サイクル施した後のコロナ開始
電圧を調べたもので、層間接着強度を5グラム以上とす
ることにより、優れた接着性を維持することがわかる。In the structure shown in FIG. 1 above, the corona discharge treatment strength was changed to change the interlayer adhesion strength, and the characteristics of a prototype capacitor were manufactured and the characteristics are shown in FIG. This is a result of examining the corona onset voltage after 100 heat cycles from -30°C to 100°C, and it can be seen that excellent adhesion can be maintained by setting the interlayer adhesion strength to 5 grams or more. .
6 べ−7
また、コンデンサの特性評価として高温連続耐用試験(
80℃、480V 、2000K )を実施し、その主
な結果を第1表に示し、第3図、第4図にまとメチ示す
(ICIA規格:±3%(2000H))。6.7 In addition, a high temperature continuous durability test (
The main results are shown in Table 1 and summarized in Figs. 3 and 4 (ICIA standard: ±3% (2000H)).
この実施例でわかる通り、外装材の硬度を1了り以−J
二にすることにより非常に長時間後の特性(絶縁抵抗(
CR)と容量減少(−ΔC))を安定化させることがわ
かる。第1表では第1図の構造で、外装材を変えた結果
を示しているが、さらに第5図G)および(ロ)の構成
で、エポキシ樹脂(フィラー入り:90D)で外装した
サンプル(電極: Zn )を同じ評価したところ、第
1図の構成に比べて初期耐圧試験で多少バラツクものの
硬度9Dのエポキシ樹脂品に比べて優れた侵期信頼性を
示した。As can be seen from this example, the hardness of the exterior material is 1-J or higher.
2. Characteristics after a very long time (insulation resistance (
It can be seen that this stabilizes the CR) and capacity decrease (-ΔC). Table 1 shows the results of changing the exterior material for the structure shown in Figure 1, but in addition, the sample (G) and (B) in Figure 5 was packaged with epoxy resin (filler: 90D). When the electrode (Zn) was evaluated in the same manner, compared to the structure shown in FIG. 1, it showed superior epoch reliability compared to an epoxy resin product with a hardness of 9D, although there was some variation in the initial pressure test.
(以下余 白)
7 ・\−2
なお、第1図に示す電極構成においては、主電極部21
Lの電極抵抗を8Ω/口 (Zn)以上とすることによ
り、より効果的なコンデンサを実現することができる。(Hereinafter, blank space) 7 ・\-2 In the electrode configuration shown in FIG. 1, the main electrode part 21
By setting the electrode resistance of L to 8Ω/gate (Zn) or more, a more effective capacitor can be realized.
発明の効果
以上のように本発明によれば、畏期信頼性に優れた高耐
圧の金属化フィルムコンデンサを提供することができる
。Effects of the Invention As described above, according to the present invention, it is possible to provide a high-voltage metallized film capacitor with excellent reliability over time.
第1図は本発明の実施例における金属化フィルムコンデ
ンサの要部断面図、第2図は同コンデンサのフィルム層
間接着強度とコロナ開始電圧との関係を示す特性図、第
3図は同コンデンサの外装材のショア−硬度と絶縁抵抗
の関係を示す特11ミ図、第4図は同コンデンサの外装
材のショア−硬度と容量変化の関係を示す特性図、第6
図は本発明の他の実施例における金属化フィルムコンデ
ンサの要部断面図、第6図はフィルム層間接着強度の測
定法を示す斜視図である。
1・・・・・・ポリプロピレンフィルム、2a・・・・
・・主型9 へ−/
室部、2b・・・・・・メタリコン接触部、3・・・・
・・コロナ放電処理部、4・・・・・・金属蒸着下地コ
ロナ放電処理部。
代理人の氏名 弁理士 中 尾 敏 男 ほか1名第1
図
第2図
プイル4・看7x#看先A(和
第3図
第4図
シつアーf更7便 CD)
第5図
2α
@6図Fig. 1 is a cross-sectional view of the main parts of a metallized film capacitor according to an embodiment of the present invention, Fig. 2 is a characteristic diagram showing the relationship between film interlayer adhesion strength and corona onset voltage of the same capacitor, and Fig. 3 is a characteristic diagram of the same capacitor. Figure 4 is a characteristic diagram showing the relationship between the shore hardness of the exterior material and insulation resistance, and Figure 6 is a characteristic diagram showing the relationship between the shore hardness of the exterior material and capacitance change of the same capacitor.
The figure is a sectional view of a main part of a metallized film capacitor according to another embodiment of the present invention, and FIG. 6 is a perspective view showing a method for measuring the adhesive strength between film layers. 1...Polypropylene film, 2a...
...To main mold 9-/chamber, 2b...Metallic contact part, 3...
... Corona discharge treatment section, 4... Metal vapor deposition base corona discharge treatment section. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 Puil 4/view 7x # View A (Japanese Figure 3 Figure 4 Seats A further 7 CD) Figure 5 2α @ Figure 6
Claims (1)
度を20mm幅換算で5グラム以上とし、前記金属化フ
ィルムコンデンサ素子を硬度(ショア−D)が17以上
の固体外装材で外装したことを特徴とする金属化フィル
ムコンデンサ。A metallized film capacitor element having an adhesive strength between film layers of 5 grams or more when converted to a width of 20 mm, and the metallized film capacitor element being packaged with a solid exterior material having a hardness (Shore-D) of 17 or more. Film capacitor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2811286A JPS62186512A (en) | 1986-02-12 | 1986-02-12 | Metallized film capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2811286A JPS62186512A (en) | 1986-02-12 | 1986-02-12 | Metallized film capacitor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62186512A true JPS62186512A (en) | 1987-08-14 |
JPH0545049B2 JPH0545049B2 (en) | 1993-07-08 |
Family
ID=12239730
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2811286A Granted JPS62186512A (en) | 1986-02-12 | 1986-02-12 | Metallized film capacitor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62186512A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000311829A (en) * | 1999-04-26 | 2000-11-07 | Mitsubishi Polyester Film Copp | Laminated film for capacitor |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54104555A (en) * | 1978-02-02 | 1979-08-16 | Matsushita Electric Ind Co Ltd | Doubleeside metallized film capacitor |
JPS56101735A (en) * | 1980-01-18 | 1981-08-14 | Matsushita Electric Ind Co Ltd | Method of manufacturing resin sheathed plastic film condenser |
JPS56101734A (en) * | 1980-01-18 | 1981-08-14 | Matsushita Electric Ind Co Ltd | Metallized film storage battery |
JPS57180114A (en) * | 1981-04-30 | 1982-11-06 | Nissei Electric | Method of producing film condenser |
JPS59916A (en) * | 1982-06-26 | 1984-01-06 | ユニチカ株式会社 | Film for condenser dielectric unit |
JPS5921012A (en) * | 1982-07-26 | 1984-02-02 | サンユレジン株式会社 | Moisture preventive insulated condenser and method of producing same |
JPS5999428U (en) * | 1982-12-23 | 1984-07-05 | ニチコン株式会社 | dry metallized film capacitor |
JPS60170229A (en) * | 1984-02-14 | 1985-09-03 | 松下電器産業株式会社 | Metallized film condenser |
-
1986
- 1986-02-12 JP JP2811286A patent/JPS62186512A/en active Granted
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54104555A (en) * | 1978-02-02 | 1979-08-16 | Matsushita Electric Ind Co Ltd | Doubleeside metallized film capacitor |
JPS56101735A (en) * | 1980-01-18 | 1981-08-14 | Matsushita Electric Ind Co Ltd | Method of manufacturing resin sheathed plastic film condenser |
JPS56101734A (en) * | 1980-01-18 | 1981-08-14 | Matsushita Electric Ind Co Ltd | Metallized film storage battery |
JPS57180114A (en) * | 1981-04-30 | 1982-11-06 | Nissei Electric | Method of producing film condenser |
JPS59916A (en) * | 1982-06-26 | 1984-01-06 | ユニチカ株式会社 | Film for condenser dielectric unit |
JPS5921012A (en) * | 1982-07-26 | 1984-02-02 | サンユレジン株式会社 | Moisture preventive insulated condenser and method of producing same |
JPS5999428U (en) * | 1982-12-23 | 1984-07-05 | ニチコン株式会社 | dry metallized film capacitor |
JPS60170229A (en) * | 1984-02-14 | 1985-09-03 | 松下電器産業株式会社 | Metallized film condenser |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000311829A (en) * | 1999-04-26 | 2000-11-07 | Mitsubishi Polyester Film Copp | Laminated film for capacitor |
Also Published As
Publication number | Publication date |
---|---|
JPH0545049B2 (en) | 1993-07-08 |
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