JPS62183580U - - Google Patents
Info
- Publication number
- JPS62183580U JPS62183580U JP6986486U JP6986486U JPS62183580U JP S62183580 U JPS62183580 U JP S62183580U JP 6986486 U JP6986486 U JP 6986486U JP 6986486 U JP6986486 U JP 6986486U JP S62183580 U JPS62183580 U JP S62183580U
- Authority
- JP
- Japan
- Prior art keywords
- container
- supply port
- unit
- lead frame
- passing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 claims 1
- 239000011344 liquid material Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Coating Apparatus (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6986486U JPS62183580U (de) | 1986-05-09 | 1986-05-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6986486U JPS62183580U (de) | 1986-05-09 | 1986-05-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62183580U true JPS62183580U (de) | 1987-11-21 |
Family
ID=30910977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6986486U Pending JPS62183580U (de) | 1986-05-09 | 1986-05-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62183580U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009142729A (ja) * | 2007-12-12 | 2009-07-02 | Toshiba Corp | ニードルユニット、及びディスペンサ装置 |
-
1986
- 1986-05-09 JP JP6986486U patent/JPS62183580U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009142729A (ja) * | 2007-12-12 | 2009-07-02 | Toshiba Corp | ニードルユニット、及びディスペンサ装置 |