JPS62182600U - - Google Patents
Info
- Publication number
- JPS62182600U JPS62182600U JP6963086U JP6963086U JPS62182600U JP S62182600 U JPS62182600 U JP S62182600U JP 6963086 U JP6963086 U JP 6963086U JP 6963086 U JP6963086 U JP 6963086U JP S62182600 U JPS62182600 U JP S62182600U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation fins
- cut
- fins
- raised tongue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 2
- 238000009423 ventilation Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Description
第1図は本考案の原理を示す斜視図、第2図は
本考案の1実施例の側断面図、第3図はプリント
板実装装置の要部斜視図、第4図は従来例の斜視
図である。
図において、2はプリント板、3は半導体部品
、4は正面板、5は窓、6Aは排風孔、7Aは吸
入孔、10,30は冷却モジユール、11はアダ
プター、12は伝熱バー、151,152,15
n,は放熱フイン、20は切起し舌片、21は通
風孔を示す。
Fig. 1 is a perspective view showing the principle of the present invention, Fig. 2 is a side sectional view of one embodiment of the invention, Fig. 3 is a perspective view of main parts of a printed board mounting device, and Fig. 4 is a perspective view of a conventional example. It is a diagram. In the figure, 2 is a printed board, 3 is a semiconductor component, 4 is a front plate, 5 is a window, 6A is an exhaust hole, 7A is an intake hole, 10 and 30 are cooling modules, 11 is an adapter, 12 is a heat transfer bar, 15 1 , 15 2 , 15
n , indicates a heat dissipation fin, 20 indicates a cut and raised tongue piece, and 21 indicates a ventilation hole.
Claims (1)
…15nを有し、最先端の該放熱フイン151が
、正面板4の窓5に対向して実装される、半導体
部品の冷却モジユール30において、 該放熱フイン151,152,…15nのそれ
ぞれに設けた切起し舌片20と、 それぞれの該放熱フイン151,152,…1
5nの対応する位置に、該切起し舌片20を設け
たことにより形成された通風孔21とを、備えた
ことを特徴とする半導体部品の放熱構造。[Claims for Utility Model Registration] A plurality of parallel heat dissipation fins 15 1 , 15 2 ,...
... 15n , and the most advanced heat dissipation fins 151 are mounted opposite the windows 5 of the front plate 4, in the cooling module 30 for semiconductor components, the heat dissipation fins 151 , 152 ,...15 The cut and raised tongue pieces 20 provided on each of the heat dissipating fins 15 1 , 15 2 ,...1
5. A heat dissipation structure for a semiconductor component, comprising a ventilation hole 21 formed by providing the cut and raised tongue piece 20 at a position corresponding to 5n .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6963086U JPH041757Y2 (en) | 1986-05-09 | 1986-05-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6963086U JPH041757Y2 (en) | 1986-05-09 | 1986-05-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62182600U true JPS62182600U (en) | 1987-11-19 |
JPH041757Y2 JPH041757Y2 (en) | 1992-01-21 |
Family
ID=30910535
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6963086U Expired JPH041757Y2 (en) | 1986-05-09 | 1986-05-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH041757Y2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02146451U (en) * | 1989-05-17 | 1990-12-12 | ||
KR100674135B1 (en) | 2005-04-18 | 2007-01-24 | (주) 대홍기업 | Heat sink |
JP2012002387A (en) * | 2010-06-14 | 2012-01-05 | Shimonishi Giken Kogyo Kk | Heat dissipation plate |
-
1986
- 1986-05-09 JP JP6963086U patent/JPH041757Y2/ja not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02146451U (en) * | 1989-05-17 | 1990-12-12 | ||
KR100674135B1 (en) | 2005-04-18 | 2007-01-24 | (주) 대홍기업 | Heat sink |
JP2012002387A (en) * | 2010-06-14 | 2012-01-05 | Shimonishi Giken Kogyo Kk | Heat dissipation plate |
Also Published As
Publication number | Publication date |
---|---|
JPH041757Y2 (en) | 1992-01-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS62182600U (en) | ||
JPH0284392U (en) | ||
JPH0260288U (en) | ||
JPH01176993U (en) | ||
JPS63102292U (en) | ||
JPH0330487U (en) | ||
JPH02140893U (en) | ||
JPH0390449U (en) | ||
JPS6230397U (en) | ||
JPS59121892U (en) | heat dissipation device | |
JPH03120046U (en) | ||
JPH036837U (en) | ||
JPH0327091U (en) | ||
JPH0455192U (en) | ||
JPS6022841U (en) | radiator | |
JPH0237504U (en) | ||
JPS6255396U (en) | ||
JPS6370156U (en) | ||
JPH0260292U (en) | ||
JPH0415892U (en) | ||
JPS605143U (en) | heat sink structure | |
JPH01173829U (en) | ||
JPH01120393U (en) | ||
JPH02146890U (en) | ||
JPS59177955U (en) | Heatsink used for printed wiring boards |