JPS62182600U - - Google Patents

Info

Publication number
JPS62182600U
JPS62182600U JP6963086U JP6963086U JPS62182600U JP S62182600 U JPS62182600 U JP S62182600U JP 6963086 U JP6963086 U JP 6963086U JP 6963086 U JP6963086 U JP 6963086U JP S62182600 U JPS62182600 U JP S62182600U
Authority
JP
Japan
Prior art keywords
heat dissipation
dissipation fins
cut
fins
raised tongue
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6963086U
Other languages
Japanese (ja)
Other versions
JPH041757Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6963086U priority Critical patent/JPH041757Y2/ja
Publication of JPS62182600U publication Critical patent/JPS62182600U/ja
Application granted granted Critical
Publication of JPH041757Y2 publication Critical patent/JPH041757Y2/ja
Expired legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の原理を示す斜視図、第2図は
本考案の1実施例の側断面図、第3図はプリント
板実装装置の要部斜視図、第4図は従来例の斜視
図である。 図において、2はプリント板、3は半導体部品
、4は正面板、5は窓、6Aは排風孔、7Aは吸
入孔、10,30は冷却モジユール、11はアダ
プター、12は伝熱バー、15,15,15
,は放熱フイン、20は切起し舌片、21は通
風孔を示す。
Fig. 1 is a perspective view showing the principle of the present invention, Fig. 2 is a side sectional view of one embodiment of the invention, Fig. 3 is a perspective view of main parts of a printed board mounting device, and Fig. 4 is a perspective view of a conventional example. It is a diagram. In the figure, 2 is a printed board, 3 is a semiconductor component, 4 is a front plate, 5 is a window, 6A is an exhaust hole, 7A is an intake hole, 10 and 30 are cooling modules, 11 is an adapter, 12 is a heat transfer bar, 15 1 , 15 2 , 15
n , indicates a heat dissipation fin, 20 indicates a cut and raised tongue piece, and 21 indicates a ventilation hole.

Claims (1)

【実用新案登録請求の範囲】 複数の平行した放熱フイン15,15,…
…15を有し、最先端の該放熱フイン15
、正面板4の窓5に対向して実装される、半導体
部品の冷却モジユール30において、 該放熱フイン15,15,…15のそれ
ぞれに設けた切起し舌片20と、 それぞれの該放熱フイン15,15,…1
の対応する位置に、該切起し舌片20を設け
たことにより形成された通風孔21とを、備えた
ことを特徴とする半導体部品の放熱構造。
[Claims for Utility Model Registration] A plurality of parallel heat dissipation fins 15 1 , 15 2 ,...
... 15n , and the most advanced heat dissipation fins 151 are mounted opposite the windows 5 of the front plate 4, in the cooling module 30 for semiconductor components, the heat dissipation fins 151 , 152 ,...15 The cut and raised tongue pieces 20 provided on each of the heat dissipating fins 15 1 , 15 2 ,...1
5. A heat dissipation structure for a semiconductor component, comprising a ventilation hole 21 formed by providing the cut and raised tongue piece 20 at a position corresponding to 5n .
JP6963086U 1986-05-09 1986-05-09 Expired JPH041757Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6963086U JPH041757Y2 (en) 1986-05-09 1986-05-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6963086U JPH041757Y2 (en) 1986-05-09 1986-05-09

Publications (2)

Publication Number Publication Date
JPS62182600U true JPS62182600U (en) 1987-11-19
JPH041757Y2 JPH041757Y2 (en) 1992-01-21

Family

ID=30910535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6963086U Expired JPH041757Y2 (en) 1986-05-09 1986-05-09

Country Status (1)

Country Link
JP (1) JPH041757Y2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02146451U (en) * 1989-05-17 1990-12-12
KR100674135B1 (en) 2005-04-18 2007-01-24 (주) 대홍기업 Heat sink
JP2012002387A (en) * 2010-06-14 2012-01-05 Shimonishi Giken Kogyo Kk Heat dissipation plate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02146451U (en) * 1989-05-17 1990-12-12
KR100674135B1 (en) 2005-04-18 2007-01-24 (주) 대홍기업 Heat sink
JP2012002387A (en) * 2010-06-14 2012-01-05 Shimonishi Giken Kogyo Kk Heat dissipation plate

Also Published As

Publication number Publication date
JPH041757Y2 (en) 1992-01-21

Similar Documents

Publication Publication Date Title
JPS62182600U (en)
JPH0284392U (en)
JPH0260288U (en)
JPH01176993U (en)
JPS63102292U (en)
JPH0330487U (en)
JPH02140893U (en)
JPH0390449U (en)
JPS6230397U (en)
JPS59121892U (en) heat dissipation device
JPH03120046U (en)
JPH036837U (en)
JPH0327091U (en)
JPH0455192U (en)
JPS6022841U (en) radiator
JPH0237504U (en)
JPS6255396U (en)
JPS6370156U (en)
JPH0260292U (en)
JPH0415892U (en)
JPS605143U (en) heat sink structure
JPH01173829U (en)
JPH01120393U (en)
JPH02146890U (en)
JPS59177955U (en) Heatsink used for printed wiring boards