JPS62180949U - - Google Patents
Info
- Publication number
- JPS62180949U JPS62180949U JP1986069134U JP6913486U JPS62180949U JP S62180949 U JPS62180949 U JP S62180949U JP 1986069134 U JP1986069134 U JP 1986069134U JP 6913486 U JP6913486 U JP 6913486U JP S62180949 U JPS62180949 U JP S62180949U
- Authority
- JP
- Japan
- Prior art keywords
- package
- storage chamber
- view
- semiconductor pellet
- bump electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000008188 pellet Substances 0.000 claims description 5
- 238000003860 storage Methods 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986069134U JPS62180949U (nl) | 1986-05-08 | 1986-05-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986069134U JPS62180949U (nl) | 1986-05-08 | 1986-05-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62180949U true JPS62180949U (nl) | 1987-11-17 |
Family
ID=30909579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986069134U Pending JPS62180949U (nl) | 1986-05-08 | 1986-05-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62180949U (nl) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62252154A (ja) * | 1986-04-24 | 1987-11-02 | Shinko Electric Ind Co Ltd | 半導体装置 |
| JP2011060889A (ja) * | 2009-09-08 | 2011-03-24 | Tokai Rika Co Ltd | 電子部品付きパッケージ |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5191668A (en) * | 1975-02-10 | 1976-08-11 | Shusekikairosochi no kumitatehoho |
-
1986
- 1986-05-08 JP JP1986069134U patent/JPS62180949U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5191668A (en) * | 1975-02-10 | 1976-08-11 | Shusekikairosochi no kumitatehoho |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62252154A (ja) * | 1986-04-24 | 1987-11-02 | Shinko Electric Ind Co Ltd | 半導体装置 |
| JP2011060889A (ja) * | 2009-09-08 | 2011-03-24 | Tokai Rika Co Ltd | 電子部品付きパッケージ |