JPH0477261U - - Google Patents
Info
- Publication number
- JPH0477261U JPH0477261U JP12030190U JP12030190U JPH0477261U JP H0477261 U JPH0477261 U JP H0477261U JP 12030190 U JP12030190 U JP 12030190U JP 12030190 U JP12030190 U JP 12030190U JP H0477261 U JPH0477261 U JP H0477261U
- Authority
- JP
- Japan
- Prior art keywords
- groove
- support plate
- end side
- electronic element
- grooves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/183—Connection portion, e.g. seal
- H01L2924/18301—Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990120301U JP2525555Y2 (ja) | 1990-11-19 | 1990-11-19 | 樹脂封止型半導体装置用リードフレーム組立体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990120301U JP2525555Y2 (ja) | 1990-11-19 | 1990-11-19 | 樹脂封止型半導体装置用リードフレーム組立体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0477261U true JPH0477261U (nl) | 1992-07-06 |
| JP2525555Y2 JP2525555Y2 (ja) | 1997-02-12 |
Family
ID=31868214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990120301U Expired - Lifetime JP2525555Y2 (ja) | 1990-11-19 | 1990-11-19 | 樹脂封止型半導体装置用リードフレーム組立体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2525555Y2 (nl) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04117454U (ja) * | 1991-03-29 | 1992-10-21 | サンケン電気株式会社 | 絶縁物被覆電子部品 |
| JP2009021630A (ja) * | 2008-09-24 | 2009-01-29 | Sanyo Electric Co Ltd | 半導体装置の製造方法 |
| JP2013258387A (ja) * | 2012-05-15 | 2013-12-26 | Rohm Co Ltd | パワーモジュール半導体装置 |
| JP2015023212A (ja) * | 2013-07-22 | 2015-02-02 | ローム株式会社 | パワーモジュールおよびその製造方法 |
| DE102019112979A1 (de) * | 2019-05-16 | 2020-11-19 | Infineon Technologies Ag | Clip mit Verriegelungsausnehmung |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6366953A (ja) * | 1986-09-08 | 1988-03-25 | Toshiba Corp | 樹脂絶縁型半導体装置 |
| JPS6378558A (ja) * | 1986-09-22 | 1988-04-08 | Hitachi Ltd | 電子装置 |
-
1990
- 1990-11-19 JP JP1990120301U patent/JP2525555Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6366953A (ja) * | 1986-09-08 | 1988-03-25 | Toshiba Corp | 樹脂絶縁型半導体装置 |
| JPS6378558A (ja) * | 1986-09-22 | 1988-04-08 | Hitachi Ltd | 電子装置 |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04117454U (ja) * | 1991-03-29 | 1992-10-21 | サンケン電気株式会社 | 絶縁物被覆電子部品 |
| JP2009021630A (ja) * | 2008-09-24 | 2009-01-29 | Sanyo Electric Co Ltd | 半導体装置の製造方法 |
| JP2013258387A (ja) * | 2012-05-15 | 2013-12-26 | Rohm Co Ltd | パワーモジュール半導体装置 |
| US9691673B2 (en) | 2012-05-15 | 2017-06-27 | Rohm Co., Ltd. | Power module semiconductor device |
| JP2015023212A (ja) * | 2013-07-22 | 2015-02-02 | ローム株式会社 | パワーモジュールおよびその製造方法 |
| DE102019112979A1 (de) * | 2019-05-16 | 2020-11-19 | Infineon Technologies Ag | Clip mit Verriegelungsausnehmung |
| US11728309B2 (en) | 2019-05-16 | 2023-08-15 | Infineon Technologies Ag | Clip having locking recess for connecting an electronic component with a carrier in a package |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2525555Y2 (ja) | 1997-02-12 |