JPS6218002Y2 - - Google Patents
Info
- Publication number
- JPS6218002Y2 JPS6218002Y2 JP13273180U JP13273180U JPS6218002Y2 JP S6218002 Y2 JPS6218002 Y2 JP S6218002Y2 JP 13273180 U JP13273180 U JP 13273180U JP 13273180 U JP13273180 U JP 13273180U JP S6218002 Y2 JPS6218002 Y2 JP S6218002Y2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- epoxy resin
- thermistor
- outer periphery
- changes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003822 epoxy resin Substances 0.000 claims description 15
- 229920000647 polyepoxide Polymers 0.000 claims description 15
- 230000001419 dependent effect Effects 0.000 claims description 7
- 229920002050 silicone resin Polymers 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
- Thermistors And Varistors (AREA)
Description
【考案の詳細な説明】
本考案は、温度センサーとして用いることので
きる温度依存性抵抗素子（以下サーミスタと称す
る）の構成に関し、使用環境の変化特に温度・湿
度の変化に対する信頼性の高いものを提供しよう
とするものである。[Detailed description of the invention] The present invention relates to the configuration of a temperature-dependent resistance element (hereinafter referred to as a thermistor) that can be used as a temperature sensor, and is designed to be highly reliable against changes in the usage environment, especially changes in temperature and humidity. This is what we are trying to provide.
まず、従来から用いられている小形・低価格の
サーミスタの構造を第１図に示して説明する。こ
のものは、焼結体で構成された１mm角程度のサー
ミスタ素体１に銀ペイント等による電極層２を設
け、これに半田３によつてリード線４を接続した
ものの外周を耐水性のエポキシ系の樹脂５で覆い
さらにその外周にエポキシ樹脂６を塗布硬化させ
て覆つたものである。７は外部引出用のビニール
線、８はリード線４とビニール線７との接続用の
半田である。ところがこのような従来のものにお
いては、−20℃〜＋80℃、０〜95％RHのような大
きい温度・湿度変化がくり返し与えられるような
使用環境下では、各樹脂５，６に熱歪が生じてそ
のストレスのために電極層２の剥離を生じて抵抗
値の増大を招いたり、また、温度・湿度の変化に
よる複合ストレスによつて発生する被覆樹脂５，
６の欠陥から水分が侵入して抵抗値の減少を招い
たりして、信頼性が劣るという欠点があつた。 First, the structure of a conventionally used small-sized, low-cost thermistor will be explained with reference to FIG. This device has an electrode layer 2 made of silver paint or the like on a thermistor body 1 of about 1 mm square made of a sintered body, and a lead wire 4 is connected to this with solder 3.The outer periphery is covered with water-resistant epoxy. The epoxy resin 5 is coated with a resin 5 of the same type, and then an epoxy resin 6 is coated and cured on the outer periphery of the epoxy resin 5. 7 is a vinyl wire for external extraction, and 8 is solder for connecting the lead wire 4 and the vinyl wire 7. However, in such conventional products, thermal distortion occurs in each resin 5 and 6 under a usage environment where large temperature and humidity changes such as -20°C to +80°C and 0 to 95% RH are repeatedly applied. This stress may cause the electrode layer 2 to peel off, leading to an increase in resistance, or the coating resin 5 may be caused by combined stress due to changes in temperature and humidity.
The defect was that moisture entered through the defects in No. 6 and caused a decrease in resistance, resulting in poor reliability.
そこで、本考案はかかる従来の欠点を解消した
小形・低価格のサーミスタを提供することを目的
とするもので、以下、その一実施例を第２図に示
して説明する。ここではサーミスタ素体９に銀ペ
イント等による電極層１０を設け、これに半田１
１によつてリード線１２を接続したものの外周
を、薄い耐水エポキシ樹脂１３によつて覆い、そ
の外周をシリコン系樹脂層１４で覆い、さらにそ
の外周をエポキシ樹脂１５で覆うようにしたこと
を特徴としている。なお、１６は外部引出用のビ
ニール線、１７はリード線１２とビニール線１６
との接続用の半田である。このシリコン系樹脂層
１４はエポキシ樹脂よりも柔軟性を有するものを
用いて、バツフア層とする。 Therefore, the object of the present invention is to provide a small, low-cost thermistor that eliminates the above-mentioned drawbacks of the conventional technology.One embodiment of the thermistor will be described below with reference to FIG. 2. Here, an electrode layer 10 made of silver paint or the like is provided on the thermistor body 9, and solder 1 is applied to this.
1 to which the lead wire 12 is connected is covered with a thin waterproof epoxy resin 13, the outer periphery is covered with a silicone resin layer 14, and the outer periphery is further covered with an epoxy resin 15. It is said that In addition, 16 is a vinyl wire for external extraction, and 17 is a lead wire 12 and vinyl wire 16.
This is solder for connection with. This silicone resin layer 14 is made of a material that is more flexible than epoxy resin and is used as a buffer layer.
このように内部の耐水性エポキシ樹脂１３と外
部のエポキシ樹脂１５との間にバツフア用のシリ
コン系樹脂層１４を設けたことにより、使用環境
において大幅な温度・湿度の変化があつた場合で
も、エポキシ樹脂１３，１５の熱歪や複合ストレ
スによる歪は中間のシリコン系樹脂層１４によつ
て吸収され、サーミスタ素体９に直接ストレスが
かかることが少なくなつて電極剥離のおそれをほ
とんど無くすることができる。また、外部のエポ
キシ樹脂１５に複合ストレス等によるクラツク等
の欠陥が生じても、内部エポキシ樹脂１３にまで
生じることはほとんど無くなり、外部からの水分
の侵入による不良化も防止することができること
となつた。 By providing the buffering silicone resin layer 14 between the internal water-resistant epoxy resin 13 and the external epoxy resin 15 in this way, even if there are significant changes in temperature and humidity in the usage environment, Strain due to thermal strain and combined stress of the epoxy resins 13 and 15 is absorbed by the intermediate silicone resin layer 14, and direct stress is less applied to the thermistor element 9, thereby almost eliminating the risk of electrode peeling. I can do it. In addition, even if defects such as cracks occur in the external epoxy resin 15 due to complex stress, etc., this will almost never occur in the internal epoxy resin 13, and it is also possible to prevent defects due to moisture intrusion from the outside. Ta.
従来のサーミスタと本考案による上記のような
サーミスタとの温度・湿度変化に対する特性変化
を第３図に示す。このグラフはJIS−Ｃ−2504試
験法に準拠して温度変化−20℃〜＋80℃、湿度変
化０〜95％RHの温湿度変化サイクルをくり返し
与えた場合におけるサーミスタの抵抗値の変化率
を示すものである。この第３図からも明らかなよ
うに、従来のサーミスタＡでは10〜20回のくり返
し変化の後には抵抗値が大幅に変化していたが、
本考案のサーミスタＢではほとんど変化しておら
ず、信頼性が大きく改善されていることがわか
る。 FIG. 3 shows changes in characteristics of a conventional thermistor and the above-described thermistor according to the present invention with respect to changes in temperature and humidity. This graph shows the rate of change in the resistance value of a thermistor when a cycle of temperature and humidity changes of -20℃ to +80℃ and humidity changes of 0 to 95% RH is applied repeatedly in accordance with the JIS-C-2504 test method. It is something. As is clear from Fig. 3, in the conventional thermistor A, the resistance value changed significantly after repeated changes 10 to 20 times.
It can be seen that there is almost no change in thermistor B of the present invention, and the reliability is greatly improved.
このように、本考案によれば、温度・湿度等の
使用環境の変化によつても特性が変化することの
少ない信頼性の高いサーミスタを得ることができ
るものである。 As described above, according to the present invention, it is possible to obtain a highly reliable thermistor whose characteristics hardly change even due to changes in the usage environment such as temperature and humidity.
第１図は従来の温度依存性抵抗素子の断面図、
第２図は本考案の一実施例における温度依存性抵
抗素子の断面図、第３図は従来と本考案の温度依
存性抵抗素子の特性を示す特性図である。
９……サーミスタ素体、１０……電極層、１１
……半田、１２……リード線、１３……耐水エポ
キシ樹脂、１４……シリコン系樹脂層、１５……
エポキシ樹脂。
Figure 1 is a cross-sectional view of a conventional temperature-dependent resistance element.
FIG. 2 is a cross-sectional view of a temperature-dependent resistance element according to an embodiment of the present invention, and FIG. 3 is a characteristic diagram showing the characteristics of the conventional temperature-dependent resistance element and the temperature-dependent resistance element of the present invention. 9... Thermistor element body, 10... Electrode layer, 11
... Solder, 12 ... Lead wire, 13 ... Water-resistant epoxy resin, 14 ... Silicone resin layer, 15 ...
Epoxy resin.
Claims (1)
素体の外周を耐水エポキシ樹脂で覆い、その外周
をシリコン系樹脂で覆い、さらにその外周をエポ
キシ樹脂で覆つてなる温度依存性抵抗素子。 A temperature-dependent resistance element, which is formed by covering the outer periphery of a temperature-dependent resistance element body provided with an electrode layer and lead wires with a water-resistant epoxy resin, covering the outer periphery with a silicone resin, and further covering the outer periphery with an epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13273180U JPS6218002Y2 (en) | 1980-09-16 | 1980-09-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13273180U JPS6218002Y2 (en) | 1980-09-16 | 1980-09-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5755902U JPS5755902U (en) | 1982-04-01 |
| JPS6218002Y2 true JPS6218002Y2 (en) | 1987-05-09 |
Family
ID=29492963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13273180U Expired JPS6218002Y2 (en) | 1980-09-16 | 1980-09-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6218002Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03105643U (en) * | 1990-02-16 | 1991-11-01 | ||
| JP2519163Y2 (en) * | 1990-11-22 | 1996-12-04 | 国際電気株式会社 | Switchgear for small enclosures |
-
1980
- 1980-09-16 JP JP13273180U patent/JPS6218002Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5755902U (en) | 1982-04-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6218002Y2 (en) | ||
| CN105424210B (en) | A kind of highly sensitive fluid temperature sensor and preparation method thereof | |
| JPS6140137B2 (en) | ||
| JPS5917252A (en) | Manufacture of semiconductor device | |
| JPS61102758A (en) | Resin sealing type semiconductor device | |
| JPS60178651A (en) | Semiconductor device | |
| JPS6060742A (en) | Lead frame | |
| JPH03251704A (en) | Manufacture of strain gauge | |
| JPH04180202A (en) | Thermistor element | |
| JPS60150657A (en) | Resin molded semiconductor device | |
| JPH11132866A (en) | Thermistor temperature sensor | |
| JPS5912583Y2 (en) | Heat resistant shock resistant temperature sensor | |
| JPH0676983B2 (en) | Moisture sensitive element | |
| JPS5893359A (en) | Semiconductor device | |
| JPS6011477Y2 (en) | Pyroelectric temperature sensing element | |
| JPH06213742A (en) | Surface pressurization type semiconductor pressure sensor | |
| JPS5967662A (en) | Semiconductor device | |
| JPS587179B2 (en) | Semiconductor strain gauge pressure sensor | |
| JPS6056244U (en) | semiconductor pressure sensor | |
| JP2946742B2 (en) | Semiconductor device | |
| JPS62108554A (en) | Hybrid integrated circuit device and manufacture thereof | |
| JP2838914B2 (en) | Manufacturing method of semiconductor pressure sensor | |
| JPS58143503A (en) | Thin film platinum temperature sensor | |
| JPS63114242A (en) | Semiconductor device | |
| JPH0622944U (en) | Sensor chip mounting structure |